JP6871706B2 - 半導体発光素子の製造方法 - Google Patents
半導体発光素子の製造方法 Download PDFInfo
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- JP6871706B2 JP6871706B2 JP2016194153A JP2016194153A JP6871706B2 JP 6871706 B2 JP6871706 B2 JP 6871706B2 JP 2016194153 A JP2016194153 A JP 2016194153A JP 2016194153 A JP2016194153 A JP 2016194153A JP 6871706 B2 JP6871706 B2 JP 6871706B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
Description
Claims (8)
- 光取出面を有する光取出層を備える半導体発光素子の製造方法であって、
前記光取出層上にアレイ状のパターンを有するマスクを形成する工程と、
前記マスクの上から前記マスクおよび前記光取出層をエッチングする工程と、を備え、
前記エッチングする工程は、前記マスクの全体が除去されるまでドライエッチングする第1ドライエッチング工程と、前記マスクが除去されてから前記光取出層をマスクレスでさらにドライエッチングする第2ドライエッチング工程とを含むことを特徴とする半導体発光素子の製造方法。 - 前記第2ドライエッチング工程により前記光取出層がエッチングされる深さ方向の第2エッチング量は、前記第1ドライエッチング工程により前記光取出層がエッチングされる深さ方向の第1エッチング量の10%以上20%以下であることを特徴とする請求項1に記載の半導体発光素子の製造方法。
- 前記第2ドライエッチング工程は、前記第1ドライエッチング工程とエッチレートが同じであり、
前記第2ドライエッチング工程が実行される第2ドライエッチング時間は、前記第1ドライエッチング工程が実行される第1ドライエッチング時間の10%以上20%以下であることを特徴とする請求項1または2に記載の半導体発光素子の製造方法。 - 前記半導体発光素子は、サファイア(Al2O3)層、窒化アルミニウム(AlN)層および酸化シリコン(SiO2)層の少なくとも一つを含むベース構造体と、前記ベース構造体の上に形成され、深紫外光を発する窒化アルミニウムガリウム(AlGaN)系半導体層を含む発光構造体と、を備え、
前記光取出層は、前記ベース構造体のサファイア層、AlN層またはSiO2層であることを特徴とする請求項1から3のいずれか一項に記載の半導体発光素子の製造方法。 - 前記エッチングする工程は、エッチングガスとして塩素(Cl2)または三塩化ホウ素(BCl3)を用いることを特徴とする請求項1から4のいずれか一項に記載の半導体発光素子の製造方法。
- 前記マスクは、樹脂であることを特徴とする請求項1から5のいずれか一項に記載の半導体発光素子の製造方法。
- 前記マスクは、アレイ状に配置される複数の柱状部を有し、前記複数の柱状部のそれぞれは、高さ方向に直交する方向の幅が一定であることを特徴とする請求項1から6のいずれか一項に記載の半導体発光素子の製造方法。
- 前記マスクは、アレイ状に配置される複数の柱状部を有し、前記複数の柱状部のそれぞれは、角柱、円柱、角錐台または円錐台形状を有することを特徴とする請求項1から6のいずれか一項に記載の半導体発光素子の製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016194153A JP6871706B2 (ja) | 2016-09-30 | 2016-09-30 | 半導体発光素子の製造方法 |
EP17856254.2A EP3522239B1 (en) | 2016-09-30 | 2017-09-27 | Method for manufacturing semiconductor light-emitting element |
PCT/JP2017/035022 WO2018062305A1 (ja) | 2016-09-30 | 2017-09-27 | 半導体発光素子および半導体発光素子の製造方法 |
KR1020197012424A KR102220351B1 (ko) | 2016-09-30 | 2017-09-27 | 반도체 발광 소자 및 반도체 발광 소자의 제조 방법 |
CN201780060220.5A CN109863610B (zh) | 2016-09-30 | 2017-09-27 | 半导体发光元件及半导体发光元件的制造方法 |
TW106133724A TWI737826B (zh) | 2016-09-30 | 2017-09-29 | 半導體發光元件的製造方法 |
US16/370,791 US11489091B2 (en) | 2016-09-30 | 2019-03-29 | Semiconductor light emitting device and method of manufacturing semiconductor light emitting device having pattered light extraction surface |
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JP6871706B2 true JP6871706B2 (ja) | 2021-05-12 |
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EP (1) | EP3522239B1 (ja) |
JP (1) | JP6871706B2 (ja) |
KR (1) | KR102220351B1 (ja) |
CN (1) | CN109863610B (ja) |
TW (1) | TWI737826B (ja) |
WO (1) | WO2018062305A1 (ja) |
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JP6719424B2 (ja) * | 2017-06-26 | 2020-07-08 | 日機装株式会社 | 半導体発光素子および半導体発光素子の製造方法 |
JP7076294B2 (ja) * | 2018-06-18 | 2022-05-27 | 日機装株式会社 | 発光装置の製造方法 |
JP7238897B2 (ja) * | 2018-09-14 | 2023-03-14 | 王子ホールディングス株式会社 | 突状構造体、発光素子用基板、その製造方法、及び発光素子 |
US11271136B2 (en) | 2018-11-07 | 2022-03-08 | Seoul Viosys Co., Ltd | Light emitting device |
JP6780083B1 (ja) * | 2019-06-11 | 2020-11-04 | 日機装株式会社 | 半導体発光素子 |
CN113299809B (zh) * | 2021-05-24 | 2023-04-18 | 錼创显示科技股份有限公司 | 微型发光元件及其显示装置 |
CN113540310A (zh) * | 2021-06-22 | 2021-10-22 | 苏州紫灿科技有限公司 | 一种倒装深紫外led芯片及其制作方法 |
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US7534633B2 (en) * | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
JP2007123446A (ja) * | 2005-10-26 | 2007-05-17 | Matsushita Electric Works Ltd | 半導体発光素子の製造方法 |
JP2008060286A (ja) * | 2006-08-31 | 2008-03-13 | Toyoda Gosei Co Ltd | 半導体発光素子及びその製造方法 |
US9331240B2 (en) * | 2008-06-06 | 2016-05-03 | University Of South Carolina | Utlraviolet light emitting devices and methods of fabrication |
JP5282503B2 (ja) * | 2008-09-19 | 2013-09-04 | 日亜化学工業株式会社 | 半導体発光素子 |
CN101673792B (zh) * | 2009-09-25 | 2011-09-21 | 厦门市三安光电科技有限公司 | 一种基于无掩模转移光子晶体结构的GaN基薄膜LED的制造方法 |
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JP5594530B2 (ja) | 2010-10-21 | 2014-09-24 | 創光科学株式会社 | 窒化物半導体紫外線発光素子 |
CN102130285B (zh) * | 2010-11-03 | 2012-12-26 | 映瑞光电科技(上海)有限公司 | 发光二极管及其制造方法 |
JP2012124257A (ja) * | 2010-12-07 | 2012-06-28 | Toshiba Corp | 半導体発光素子及びその製造方法 |
JP5862354B2 (ja) * | 2011-04-15 | 2016-02-16 | 三菱化学株式会社 | 窒化物系発光ダイオード素子とその製造方法 |
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WO2015016150A1 (ja) * | 2013-07-30 | 2015-02-05 | 独立行政法人情報通信研究機構 | 半導体発光素子およびその製造方法 |
CN104425666B (zh) * | 2013-08-28 | 2019-02-15 | 中国科学院物理研究所 | 氮化镓材料层表面粗化的方法 |
TWI632696B (zh) * | 2013-10-11 | 2018-08-11 | 王子控股股份有限公司 | 半導體發光元件用基板之製造方法、半導體發光元件之製 造方法、半導體發光元件用基板、以及半導體發光元件 |
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Publication number | Publication date |
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WO2018062305A1 (ja) | 2018-04-05 |
CN109863610A (zh) | 2019-06-07 |
CN109863610B (zh) | 2022-12-16 |
JP2018056499A (ja) | 2018-04-05 |
KR102220351B1 (ko) | 2021-02-24 |
EP3522239A4 (en) | 2020-05-27 |
EP3522239B1 (en) | 2023-11-01 |
TWI737826B (zh) | 2021-09-01 |
US20190229238A1 (en) | 2019-07-25 |
TW201818571A (zh) | 2018-05-16 |
KR20190102173A (ko) | 2019-09-03 |
EP3522239A1 (en) | 2019-08-07 |
US11489091B2 (en) | 2022-11-01 |
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