JP6862068B2 - 位置検出装置及び位置検出方法 - Google Patents

位置検出装置及び位置検出方法 Download PDF

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Publication number
JP6862068B2
JP6862068B2 JP2019507664A JP2019507664A JP6862068B2 JP 6862068 B2 JP6862068 B2 JP 6862068B2 JP 2019507664 A JP2019507664 A JP 2019507664A JP 2019507664 A JP2019507664 A JP 2019507664A JP 6862068 B2 JP6862068 B2 JP 6862068B2
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substrate
image data
corner portion
view
position detection
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Japanese (ja)
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JPWO2018174011A1 (ja
Inventor
裕司 岡本
裕司 岡本
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Analysis (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Image Processing (AREA)
JP2019507664A 2017-03-22 2018-03-19 位置検出装置及び位置検出方法 Active JP6862068B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017055685 2017-03-22
JP2017055685 2017-03-22
PCT/JP2018/010826 WO2018174011A1 (ja) 2017-03-22 2018-03-19 位置検出装置及び位置検出方法

Publications (2)

Publication Number Publication Date
JPWO2018174011A1 JPWO2018174011A1 (ja) 2020-01-23
JP6862068B2 true JP6862068B2 (ja) 2021-04-21

Family

ID=63585488

Family Applications (1)

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JP2019507664A Active JP6862068B2 (ja) 2017-03-22 2018-03-19 位置検出装置及び位置検出方法

Country Status (5)

Country Link
JP (1) JP6862068B2 (ko)
KR (1) KR20190131475A (ko)
CN (1) CN110446905A (ko)
TW (1) TWI654500B (ko)
WO (1) WO2018174011A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6984451B2 (ja) * 2018-01-31 2021-12-22 株式会社豊田自動織機 計測装置及び計測方法
CN112629444B (zh) * 2021-03-08 2021-06-22 南京航空航天大学 一种基于机器视觉的放射库盖板落放误差自动纠正方法
KR102616399B1 (ko) 2021-08-20 2023-12-20 지영배 나노버블 식기세척기
KR102616395B1 (ko) 2021-08-20 2023-12-20 지영배 식기세척기용 나노버블장치
KR102632696B1 (ko) 2021-09-16 2024-02-01 지영배 나노버블장치
KR102632695B1 (ko) 2021-09-16 2024-02-01 지영배 나노버블이 적용된 식기세척기
KR20240136783A (ko) 2023-03-07 2024-09-19 주식회사 일성 나노버블식기세척기

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2974794B2 (ja) * 1991-01-22 1999-11-10 松下電器産業株式会社 多角形部品の多視野認識方法
JPH05149716A (ja) * 1991-11-29 1993-06-15 Toshiba Corp コーナ検出方法
JP3763229B2 (ja) * 1999-05-11 2006-04-05 松下電器産業株式会社 画像認識による位置検出方法
JP4707249B2 (ja) * 2001-03-28 2011-06-22 Ｊｕｋｉ株式会社 部品位置検出方法及び装置
CN101331385B (zh) * 2005-12-16 2011-11-30 旭化成电子材料元件株式会社 位置检测装置
JP2007256053A (ja) * 2006-03-23 2007-10-04 Nikon Corp 位置計測方法及びデバイス製造方法
CN101561248A (zh) * 2008-04-17 2009-10-21 鸿富锦精密工业（深圳）有限公司 位置测量装置及测量方法
JP5907110B2 (ja) 2013-04-12 2016-04-20 信越化学工業株式会社 スクリーン印刷方法及びスクリーン印刷装置

Also Published As

Publication number Publication date
KR20190131475A (ko) 2019-11-26
TW201835692A (zh) 2018-10-01
TWI654500B (zh) 2019-03-21
JPWO2018174011A1 (ja) 2020-01-23
WO2018174011A1 (ja) 2018-09-27
CN110446905A (zh) 2019-11-12

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