CN110446905A - 位置检测装置及位置检测方法 - Google Patents

位置检测装置及位置检测方法 Download PDF

Info

Publication number
CN110446905A
CN110446905A CN201880005782.4A CN201880005782A CN110446905A CN 110446905 A CN110446905 A CN 110446905A CN 201880005782 A CN201880005782 A CN 201880005782A CN 110446905 A CN110446905 A CN 110446905A
Authority
CN
China
Prior art keywords
corner
substrate
image data
field angle
photographic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880005782.4A
Other languages
English (en)
Chinese (zh)
Inventor
冈本裕司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Publication of CN110446905A publication Critical patent/CN110446905A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Analysis (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Image Processing (AREA)
CN201880005782.4A 2017-03-22 2018-03-19 位置检测装置及位置检测方法 Pending CN110446905A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-055685 2017-03-22
JP2017055685 2017-03-22
PCT/JP2018/010826 WO2018174011A1 (ja) 2017-03-22 2018-03-19 位置検出装置及び位置検出方法

Publications (1)

Publication Number Publication Date
CN110446905A true CN110446905A (zh) 2019-11-12

Family

ID=63585488

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880005782.4A Pending CN110446905A (zh) 2017-03-22 2018-03-19 位置检测装置及位置检测方法

Country Status (5)

Country Link
JP (1) JP6862068B2 (ko)
KR (1) KR20190131475A (ko)
CN (1) CN110446905A (ko)
TW (1) TWI654500B (ko)
WO (1) WO2018174011A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112629444A (zh) * 2021-03-08 2021-04-09 南京航空航天大学 一种基于机器视觉的放射库盖板落放误差自动纠正方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6984451B2 (ja) * 2018-01-31 2021-12-22 株式会社豊田自動織機 計測装置及び計測方法
KR102616395B1 (ko) 2021-08-20 2023-12-20 지영배 식기세척기용 나노버블장치
KR102616399B1 (ko) 2021-08-20 2023-12-20 지영배 나노버블 식기세척기
KR102632696B1 (ko) 2021-09-16 2024-02-01 지영배 나노버블장치
KR102632695B1 (ko) 2021-09-16 2024-02-01 지영배 나노버블이 적용된 식기세척기

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04238206A (ja) * 1991-01-22 1992-08-26 Matsushita Electric Ind Co Ltd 多角形部品の多視野認識方法
JPH05149716A (ja) * 1991-11-29 1993-06-15 Toshiba Corp コーナ検出方法
JP2002288634A (ja) * 2001-03-28 2002-10-04 Juki Corp 部品位置検出方法及び装置
CN101331385A (zh) * 2005-12-16 2008-12-24 旭化成电子材料元件株式会社 位置检测装置
CN101561248A (zh) * 2008-04-17 2009-10-21 鸿富锦精密工业（深圳）有限公司 位置测量装置及测量方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3763229B2 (ja) * 1999-05-11 2006-04-05 松下電器産業株式会社 画像認識による位置検出方法
JP2007256053A (ja) * 2006-03-23 2007-10-04 Nikon Corp 位置計測方法及びデバイス製造方法
JP5907110B2 (ja) 2013-04-12 2016-04-20 信越化学工業株式会社 スクリーン印刷方法及びスクリーン印刷装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04238206A (ja) * 1991-01-22 1992-08-26 Matsushita Electric Ind Co Ltd 多角形部品の多視野認識方法
JPH05149716A (ja) * 1991-11-29 1993-06-15 Toshiba Corp コーナ検出方法
JP2002288634A (ja) * 2001-03-28 2002-10-04 Juki Corp 部品位置検出方法及び装置
CN101331385A (zh) * 2005-12-16 2008-12-24 旭化成电子材料元件株式会社 位置检测装置
CN101561248A (zh) * 2008-04-17 2009-10-21 鸿富锦精密工业（深圳）有限公司 位置测量装置及测量方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112629444A (zh) * 2021-03-08 2021-04-09 南京航空航天大学 一种基于机器视觉的放射库盖板落放误差自动纠正方法
CN112629444B (zh) * 2021-03-08 2021-06-22 南京航空航天大学 一种基于机器视觉的放射库盖板落放误差自动纠正方法

Also Published As

Publication number Publication date
TW201835692A (zh) 2018-10-01
JP6862068B2 (ja) 2021-04-21
JPWO2018174011A1 (ja) 2020-01-23
WO2018174011A1 (ja) 2018-09-27
TWI654500B (zh) 2019-03-21
KR20190131475A (ko) 2019-11-26

Similar Documents

Publication Publication Date Title
CN110446905A (zh) 位置检测装置及位置检测方法
US11465232B2 (en) Laser patterning skew correction
US20210012532A1 (en) System and method for calibration of machine vision cameras along at least three discrete planes
US9360773B2 (en) Mark detecting method
CN109732228B (zh) 一种激光振镜精度校正方法、装置及系统
CN109789460B (zh) 具有工作区图像捕获设备的弯曲机以及用于改进弯曲机的操作安全性的方法
US20200156251A1 (en) Calibration method and device for robotic arm system
CN109029299A (zh) 舱段销孔对接转角的双相机测量装置及测量方法
KR102022091B1 (ko) 노즐에서 분사되는 코팅액의 폭 제어 방법 및 장치
CN105258710A (zh) 一种高精度相机主点标定方法
US20210291376A1 (en) System and method for three-dimensional calibration of a vision system
CN104005180A (zh) 一种用于缝纫的视觉定位方法及系统
TWI552598B (zh) 一種攝影機之自動校正系統及其自動校正方法
CN106272320A (zh) 刻划装置
KR102609524B1 (ko) 절단 궤적을 정렬하는 방법 및 장치
JP2017107104A5 (ko)
CN110853102A (zh) 一种新的机器人视觉标定及引导方法、装置及计算机设备
KR101116321B1 (ko) 기판 정렬 방법
CN116148186B (zh) 极片飞拍纠偏方法、电子设备及存储介质
CN211401101U (zh) 高精度3d轮廓建模设备
CN111707446B (zh) 光斑中心与探测器接收面中心对准的调节方法及系统
JP2019012040A (ja) 制御装置及び制御方法
JP2019132731A (ja) 位置特定装置及び位置特定方法
CN111080713B (zh) 相机标定系统以及方法
KR101891681B1 (ko) 비젼을 이용한 피봇점 정렬 장치

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20191112

WD01 Invention patent application deemed withdrawn after publication