JP6861365B2 - 炭化珪素半導体装置およびその製造方法 - Google Patents
炭化珪素半導体装置およびその製造方法 Download PDFInfo
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims description 156
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 155
- 239000004065 semiconductor Substances 0.000 title claims description 146
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 229910021332 silicide Inorganic materials 0.000 claims description 106
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 106
- 238000005530 etching Methods 0.000 claims description 98
- 239000002184 metal Substances 0.000 claims description 86
- 229910052751 metal Inorganic materials 0.000 claims description 86
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 64
- 229920005591 polysilicon Polymers 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 40
- 210000000746 body region Anatomy 0.000 claims description 38
- 238000010438 heat treatment Methods 0.000 claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 238000001312 dry etching Methods 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 301
- 239000011229 interlayer Substances 0.000 description 35
- 229910004298 SiO 2 Inorganic materials 0.000 description 16
- 239000007789 gas Substances 0.000 description 16
- 239000012535 impurity Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 11
- 230000002159 abnormal effect Effects 0.000 description 8
- 238000001878 scanning electron micrograph Methods 0.000 description 8
- 238000009413 insulation Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229910005881 NiSi 2 Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical class O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003915 cell function Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- -1 nitrogen ions Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Description
以下、図面を参照しながら、本開示の炭化珪素半導体装置の実施形態を説明する。
以下、本実施形態の炭化珪素半導体装置201の製造方法の一例を説明する。
本発明者は、ポリシリコン層の等方性エッチングの条件を異ならせて金属シリサイドを形成し、等方性エッチング条件と金属シリサイドの形状との関係を検討した。ここでは、金属シリサイドとして、Niシリサイドを形成した。また、比較のため、等方性エッチングを行わない場合の金属シリサイドの形状も調べた。以下、検討結果の一例を説明する。
図5A〜図5C、および図6A〜図6Cは、それぞれ、実施例1、実施例2におけるNiシリサイドの形成工程を模式的に示す拡大断面図である。
図9Aおよび図9Bは、それぞれ、比較例のNiシリサイドの形成方法を説明するための拡大断面図である。
100S セル領域
100G 配線領域
100u ユニットセル
101 基板
102 炭化珪素半導体層
103 第1ボディ領域
104 ソース領域
105 コンタクト領域
107 絶縁層(第1絶縁層)
107a ゲート絶縁層
107b フィールド絶縁層
108 電極層
108g ゲート電極
108c ゲート接続部
109 第1シリサイド電極(ソース電極)
110 ドレイン電極
111 層間絶縁層(第2絶縁層)
111a 庇部
112 上部ソース電極
114 上部ゲート電極
115 第2ボディ領域
129 第2シリサイド電極
131 第1開口部
132 第2開口部
SC ソースコンタクト部
GC ゲートコンタクト部
Claims (17)
- 第1主面を有する基板と、
前記基板の前記第1主面上に配置された炭化珪素半導体層と、
前記炭化珪素半導体層上に第1絶縁層を介して配置された、ポリシリコンを含む電極層と、
前記炭化珪素半導体層および前記電極層を覆う第2絶縁層と、
前記第1絶縁層および前記第2絶縁層に形成された第1開口部内に位置し、前記炭化珪素半導体層の一部とオーミック接合を形成する第1シリサイド電極と、
前記第2絶縁層に形成された第2開口部内に位置し、前記電極層の一部と接する第2シリサイド電極と
を備え、
前記第1シリサイド電極および前記第2シリサイド電極は、いずれも、第1金属元素のシリサイドを含み、
前記第2シリサイド電極の端部は、前記第2開口部の周縁部において前記第2絶縁層の下方に位置し、前記基板の前記第1主面に垂直な断面において、前記第2シリサイド電極の幅は、前記第2開口部の底面の幅よりも大きく、
前記電極層のうち前記第2シリサイド電極と前記第1絶縁層との間に位置する部分の厚さt1は、前記電極層の他の部分の厚さt2の1/3以上1未満である、炭化珪素半導体装置。 - 前記第2シリサイド電極は、前記第2開口部の前記底面の全体を覆っている、請求項1に記載の炭化珪素半導体装置。
- 前記第2シリサイド電極は、前記第2開口部の内部およびその周縁部のみに配置されている、請求項1または2に記載の炭化珪素半導体装置。
- 前記第2シリサイド電極の下面は、前記電極層と接している、請求項1から3のいずれかに記載の炭化珪素半導体装置。
- 前記第2シリサイド電極は、前記第1シリサイド電極よりも厚い、請求項1から4のいずれかに記載の炭化珪素半導体装置。
- 前記第1金属元素はNiまたはTiである、請求項1から5のいずれかに記載の炭化珪素半導体装置。
- 前記第2絶縁層上および前記第1開口部内に配置され、前記第1開口部内で前記第1シリサイド電極と接する第1上部電極と、
前記第2絶縁層上および前記第2開口部内に配置され、前記第2開口部内で前記第2シリサイド電極と接する第2上部電極と
をさらに備える、請求項1から6のいずれかに記載の炭化珪素半導体装置。 - 前記基板は、前記第1上部電極が配置され、かつ、複数のユニットセルを含むセル領域と、前記第2上部電極が配置された配線領域とを有し、
前記複数のユニットセルのそれぞれは、
前記炭化珪素半導体層の表面に選択的に形成された第2導電型のボディ領域と、
前記ボディ領域内に選択的に形成された第1導電型のソース領域と、
前記炭化珪素半導体層上に、前記第1絶縁層を介して配置されたゲート電極と
を備え、
前記電極層は、前記セル領域に位置し、前記複数のユニットセルのそれぞれの前記ゲート電極を含むゲート部と、前記配線領域に位置し、前記ゲート部に接続されたゲート接続部とを含み、
前記第1開口部は前記複数のユニットセルのそれぞれに配置され、前記第1開口部内において、前記第1シリサイド電極は、前記炭化珪素半導体層における前記ソース領域および前記ボディ領域と電気的に接続されており、
前記第2開口部は前記配線領域に配置され、前記第2開口部内において、前記第2シリサイド電極は、前記電極層の前記ゲート接続部と接している、請求項7に記載の炭化珪素半導体装置。 - 前記第1絶縁層のうち前記第2シリサイド電極の下方に位置する部分は、前記電極層の前記ゲート部の下方に位置する部分よりも厚い、請求項8に記載の炭化珪素半導体装置。
- 前記第2シリサイド電極の下方において、前記炭化珪素半導体層の前記表面に選択的に配置された第2導電型の他のボディ領域をさらに備える、請求項8または9に記載の炭化珪素半導体装置。
- 表面に炭化珪素半導体層が形成された基板を用意する工程と、
前記炭化珪素半導体層上に第1絶縁層を介してポリシリコン膜を形成し、前記ポリシリコン膜をパターニングすることにより、電極層を形成する工程と、
前記第1絶縁層および前記電極層を覆う第2絶縁層を形成する工程と、
前記第2絶縁層および前記第1絶縁層に前記炭化珪素半導体層の一部を露出する第1開口部と、前記第2絶縁層に前記電極層の一部を露出する第2開口部とを形成する第1のエッチング工程と、
前記第2開口部の周縁部において、前記電極層のうち前記第2絶縁層の下方に位置する部分を除去することにより、前記第2絶縁層に庇部を形成する第2のエッチング工程と、
前記第2絶縁層上、前記第1開口部内および前記第2開口部内に、第1金属元素を含む金属膜を形成する工程であって、前記第2開口部内において、前記金属膜は、前記第2絶縁層の前記庇部によって、前記第2開口部の底面上に位置する第1部分と、前記第2開口部の側壁上に位置する第2部分とに分離される、金属膜形成工程と、
前記基板に熱処理を行うことにより、前記第1開口部内において、前記金属膜と前記炭化珪素半導体層とを反応させて、前記第1金属元素のシリサイドを含む第1シリサイド電極を形成するとともに、前記第2開口部内において、前記金属膜の前記第1部分と前記電極層とを反応させて、前記第1金属元素のシリサイドを含む第2シリサイド電極を形成する、シリサイド化工程と、
を包含する、炭化珪素半導体装置の製造方法。 - 前記第1のエッチング工程は、前記第2絶縁層上に配置されたマスクを用いて、前記第2絶縁層および前記第1絶縁層の異方性エッチングを行うことによって、前記第1開口部および前記第2開口部を形成する工程であり、
前記第2のエッチング工程は、前記第2開口部内に露出した前記電極層の前記一部の等方性エッチングを行う工程を含む、請求項11に記載の炭化珪素半導体装置の製造方法。 - 前記第2のエッチング工程の後で、前記マスクを除去する、請求項12に記載の炭化珪素半導体装置の製造方法。
- 前記第1のエッチング工程と前記第2のエッチング工程との間に、前記マスクを除去する、請求項12に記載の炭化珪素半導体装置の製造方法。
- 前記第1のエッチング工程では、第1のエッチングガスを用いたドライエッチングを行い、
前記第2のエッチング工程では、前記第1のエッチングガスとは異なる第2のエッチングガスを用いたドライエッチングを行い、
前記第1のエッチング工程および前記第2のエッチング工程は、チャンバー内で、エッチングガスを切り替えることにより連続して行われる、請求項11から14のいずれかに記載の炭化珪素半導体装置の製造方法。 - 前記シリサイド化工程における前記熱処理は、800℃以上1050℃以下の温度で行われる、請求項11から15のいずれかに記載の炭化珪素半導体装置の製造方法。
- 前記第1金属元素はNiまたはTiである、請求項11から16のいずれかに記載の炭化珪素半導体装置の製造方法。
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