JP6859263B2 - カメラモジュールおよび電子機器 - Google Patents

カメラモジュールおよび電子機器 Download PDF

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Publication number
JP6859263B2
JP6859263B2 JP2017552349A JP2017552349A JP6859263B2 JP 6859263 B2 JP6859263 B2 JP 6859263B2 JP 2017552349 A JP2017552349 A JP 2017552349A JP 2017552349 A JP2017552349 A JP 2017552349A JP 6859263 B2 JP6859263 B2 JP 6859263B2
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Prior art keywords
lens
substrate
camera module
pixel
light receiving
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Japanese (ja)
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JPWO2017090437A1 (ja
Inventor
石田　実
実 石田
釘宮　克尚
克尚 釘宮
博則 星
博則 星
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Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00365—Production of microlenses
    • B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00403—Producing compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0075—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for altering, e.g. increasing, the depth of field or depth of focus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B19/00—Cameras
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B19/00—Cameras
    • G03B19/02—Still-picture cameras
    • G03B19/04—Roll-film cameras
    • G03B19/07—Roll-film cameras having more than one objective
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
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    • H01L27/14632—Wafer-level processed structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
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    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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    • H—ELECTRICITY
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
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    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
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    • H—ELECTRICITY
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    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computing Systems (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Cameras In General (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Measuring And Recording Apparatus For Diagnosis (AREA)
  • Prostheses (AREA)
  • Diaphragms For Cameras (AREA)
  • Lenses (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2017552349A 2015-11-24 2016-11-10 カメラモジュールおよび電子機器 Active JP6859263B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015228426 2015-11-24
JP2015228426 2015-11-24
PCT/JP2016/083324 WO2017090437A1 (ja) 2015-11-24 2016-11-10 カメラモジュールおよび電子機器

Publications (2)

Publication Number Publication Date
JPWO2017090437A1 JPWO2017090437A1 (ja) 2018-09-13
JP6859263B2 true JP6859263B2 (ja) 2021-04-14

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JP2017552349A Active JP6859263B2 (ja) 2015-11-24 2016-11-10 カメラモジュールおよび電子機器

Country Status (7)

Country Link
US (1) US10375282B2 (ko)
EP (1) EP3383019A4 (ko)
JP (1) JP6859263B2 (ko)
KR (1) KR20180084629A (ko)
CN (1) CN107431746B (ko)
TW (1) TWI781085B (ko)
WO (1) WO2017090437A1 (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10488632B2 (en) * 2016-01-20 2019-11-26 Mems Optical Zoom Corporation MEMS lens actuator
WO2018145644A1 (zh) * 2017-02-08 2018-08-16 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和制造方法以及电子设备
US10951817B2 (en) 2017-06-26 2021-03-16 Mitsubishi Electric Corporation Compound-eye imaging device, image processing method, and recording medium
TWI627460B (zh) * 2017-07-19 2018-06-21 大立光電股份有限公司 成像鏡頭、相機模組及電子裝置
JP2019040892A (ja) * 2017-08-22 2019-03-14 ソニーセミコンダクタソリューションズ株式会社 撮像装置、カメラモジュール、及び、電子機器
JP6957271B2 (ja) * 2017-08-31 2021-11-02 ソニーセミコンダクタソリューションズ株式会社 積層レンズ構造体、固体撮像素子、および、電子機器
US10425561B2 (en) * 2017-09-08 2019-09-24 Apple Inc. Portable electronic device
US20190187471A1 (en) * 2017-12-18 2019-06-20 Flex Ltd. Dynamically controlled focal plane for optical waveguide-based displays
KR102572974B1 (ko) * 2018-04-26 2023-08-31 엘지이노텍 주식회사 카메라 모듈 및 그의 깊이 정보 추출 방법
RU186570U1 (ru) * 2018-10-08 2019-01-24 Общество с ограниченной ответственностью "ИРВЭЙ" Камера системы ночного видения
RU2694553C1 (ru) * 2018-10-08 2019-07-16 Общество с ограниченной ответственностью "ИРВЭЙ" Камера системы ночного видения
KR102558301B1 (ko) * 2018-12-13 2023-07-24 에스케이하이닉스 주식회사 유기 픽셀 어레이 및 무기 픽셀 어레이를 갖는 이미지 센싱 디바이스
JP7172553B2 (ja) * 2018-12-18 2022-11-16 株式会社デンソー レンズモジュール及び車両用撮像装置
CN112462481B (zh) * 2019-09-09 2022-07-15 玉晶光电(厦门)有限公司 支撑组件与可携式光学成像镜头
TWI707169B (zh) * 2019-11-29 2020-10-11 大立光電股份有限公司 成像鏡頭、相機模組及電子裝置
US11343435B2 (en) 2019-12-26 2022-05-24 Waymo Llc Microlensing for real-time sensing of stray light
CN111152452B (zh) * 2020-01-14 2023-04-18 青岛理工大学 一种PDMS/SiC功能梯度衬底及其制备方法与应用
TWI781458B (zh) 2020-10-08 2022-10-21 大立光電股份有限公司 光學指紋辨識系統
DE102021202164B3 (de) * 2021-03-05 2022-07-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Tandemblendenarchitektur zur Füllfaktorerhöhung von kompakten Multikanalabbildungssystemen
JP2022147493A (ja) * 2021-03-23 2022-10-06 株式会社ダイセル 光学素子、光学モジュール及び、光学素子または光学モジュールの製造方法

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3858361B2 (ja) 1997-07-08 2006-12-13 ソニー株式会社 固体撮像装置及びその駆動方法、並びにカメラ
JPH1175118A (ja) 1997-08-29 1999-03-16 Matsushita Electric Ind Co Ltd ビデオカメラ
JP4144079B2 (ja) 1998-09-04 2008-09-03 株式会社デンソー 可変焦点レンズ
JP2002243918A (ja) 2001-02-14 2002-08-28 Olympus Optical Co Ltd 可変焦点レンズ、光学特性可変光学素子及び光学装置
US6937401B2 (en) * 2001-08-28 2005-08-30 Sony Corporation Projection lens
JP4465958B2 (ja) * 2002-12-18 2010-05-26 株式会社ニコン カラー撮像装置
WO2005057278A1 (en) * 2003-12-11 2005-06-23 Nokia Corporation Method and device for capturing multiple images
US20060054782A1 (en) * 2004-08-25 2006-03-16 Olsen Richard I Apparatus for multiple camera devices and method of operating same
US7483065B2 (en) 2004-12-15 2009-01-27 Aptina Imaging Corporation Multi-lens imaging systems and methods using optical filters having mosaic patterns
JP2006318060A (ja) 2005-05-10 2006-11-24 Olympus Corp 画像処理装置、画像処理方法、および画像処理用プログラム
US8189100B2 (en) * 2006-07-25 2012-05-29 Qualcomm Incorporated Mobile device with dual digital camera sensors and methods of using the same
NO326372B1 (no) 2006-09-21 2008-11-17 Polight As Polymerlinse
JP2008092247A (ja) * 2006-10-02 2008-04-17 Sanyo Electric Co Ltd 固体撮像素子
JP4396684B2 (ja) * 2006-10-04 2010-01-13 ソニー株式会社 固体撮像装置の製造方法
US20110158617A1 (en) 2007-02-12 2011-06-30 Polight As Device for providing stabilized images in a hand held camera
JP2008286527A (ja) 2007-05-15 2008-11-27 Panasonic Corp 複眼測距装置
KR100969987B1 (ko) * 2008-01-10 2010-07-15 연세대학교 산학협력단 광학패키지 웨이퍼스케일 어레이 및 그 제조방법
JP2009251366A (ja) * 2008-04-08 2009-10-29 Konica Minolta Opto Inc 撮像レンズの製造方法、撮像レンズ及び撮像装置
JP2009279790A (ja) 2008-05-20 2009-12-03 Sharp Corp レンズ及びその製造方法、並びに、レンズアレイ、カメラモジュール及びその製造方法、電子機器
WO2009146530A1 (en) 2008-06-06 2009-12-10 Lensvector Inc. Tunable liquid crystal optical device
WO2010015093A1 (en) 2008-08-08 2010-02-11 Optotune Ag Electroactive optical device
JP2010048993A (ja) * 2008-08-21 2010-03-04 Fujinon Corp 積層型カメラモジュールの製造方法および積層型カメラモジュール並びに撮像装置。
JP5183441B2 (ja) * 2008-11-27 2013-04-17 キヤノン株式会社 撮像装置
JP2010204631A (ja) 2009-02-06 2010-09-16 Fujifilm Corp ウェハレベルレンズアレイの製造方法、ウェハレンズアレイ、レンズモジュール及び撮像ユニット
JP5171681B2 (ja) 2009-02-13 2013-03-27 オリンパス株式会社 レンズモジュールの製造方法
JP2010256563A (ja) 2009-04-23 2010-11-11 Sharp Corp レンズアレイおよび当該レンズアレイの製造方法、並びに、その利用
FR2950154B1 (fr) 2009-09-15 2011-12-23 Commissariat Energie Atomique Dispositif optique a membrane deformable a actionnement piezoelectrique en forme de couronne continue
CN102597693B (zh) 2009-11-13 2015-04-01 富士胶片株式会社 测距装置、测距方法、测距程序及测距系统以及拍摄装置
JP2011138089A (ja) 2010-01-04 2011-07-14 Fujifilm Corp ウェハレベルレンズアレイ、レンズモジュール及び撮像ユニット
JP2012015642A (ja) 2010-06-29 2012-01-19 Sanyo Electric Co Ltd 撮像装置
JP5501918B2 (ja) * 2010-09-30 2014-05-28 株式会社トプコン 光学素子の製造方法およびその方法により作製された光学素子
JP2012205117A (ja) * 2011-03-25 2012-10-22 Kyocera Corp 電子機器
JP2013001091A (ja) 2011-06-21 2013-01-07 Konica Minolta Advanced Layers Inc 光学素子の製造方法
US20130265459A1 (en) * 2011-06-28 2013-10-10 Pelican Imaging Corporation Optical arrangements for use with an array camera
JP5816015B2 (ja) 2011-07-15 2015-11-17 株式会社東芝 固体撮像装置及びカメラモジュール
JP5734776B2 (ja) * 2011-07-15 2015-06-17 株式会社東芝 カメラモジュール
JP6112824B2 (ja) * 2012-02-28 2017-04-12 キヤノン株式会社 画像処理方法および装置、プログラム。
JP2015088691A (ja) * 2013-11-01 2015-05-07 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP6257285B2 (ja) 2013-11-27 2018-01-10 キヤノン株式会社 複眼撮像装置
TWI741988B (zh) * 2015-07-31 2021-10-11 日商新力股份有限公司 堆疊式透鏡結構及其製造方法，以及電子裝置
US9973669B2 (en) * 2015-08-28 2018-05-15 Apple Inc. Dual overmolded reconstructed camera module
KR20170035237A (ko) * 2015-09-22 2017-03-30 엘지전자 주식회사 이동 단말기 및 그 제어방법

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