KR20180084629A - 카메라 모듈 및 전자 기기 - Google Patents
카메라 모듈 및 전자 기기 Download PDFInfo
- Publication number
- KR20180084629A KR20180084629A KR1020177025521A KR20177025521A KR20180084629A KR 20180084629 A KR20180084629 A KR 20180084629A KR 1020177025521 A KR1020177025521 A KR 1020177025521A KR 20177025521 A KR20177025521 A KR 20177025521A KR 20180084629 A KR20180084629 A KR 20180084629A
- Authority
- KR
- South Korea
- Prior art keywords
- electronic device
- camera module
- camera
- module
- electronic
- Prior art date
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Classifications
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- H04N5/369—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00365—Production of microlenses
- B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00403—Producing compound lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0075—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for altering, e.g. increasing, the depth of field or depth of focus
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B19/00—Cameras
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B19/00—Cameras
- G03B19/02—Still-picture cameras
- G03B19/04—Roll-film cameras
- G03B19/07—Roll-film cameras having more than one objective
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/95—Computational photography systems, e.g. light-field imaging systems
- H04N23/957—Light-field or plenoptic cameras or camera modules
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
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- H04N5/2254—
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Human Computer Interaction (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Computing Systems (AREA)
- Theoretical Computer Science (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Cameras In General (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Prostheses (AREA)
- Measuring And Recording Apparatus For Diagnosis (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Optical Elements Other Than Lenses (AREA)
- Diaphragms For Cameras (AREA)
- Lenses (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2015-228426 | 2015-11-24 | ||
JP2015228426 | 2015-11-24 | ||
PCT/JP2016/083324 WO2017090437A1 (ja) | 2015-11-24 | 2016-11-10 | カメラモジュールおよび電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20180084629A true KR20180084629A (ko) | 2018-07-25 |
Family
ID=58763153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020177025521A KR20180084629A (ko) | 2015-11-24 | 2016-11-10 | 카메라 모듈 및 전자 기기 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10375282B2 (ko) |
EP (1) | EP3383019A4 (ko) |
JP (1) | JP6859263B2 (ko) |
KR (1) | KR20180084629A (ko) |
CN (1) | CN107431746B (ko) |
TW (1) | TWI781085B (ko) |
WO (1) | WO2017090437A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200072855A (ko) * | 2018-12-13 | 2020-06-23 | 에스케이하이닉스 주식회사 | 유기 픽셀 어레이 및 무기 픽셀 어레이를 갖는 이미지 센싱 디바이스 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
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US10488632B2 (en) * | 2016-01-20 | 2019-11-26 | Mems Optical Zoom Corporation | MEMS lens actuator |
KR102405359B1 (ko) * | 2017-02-08 | 2022-06-07 | 닝보 써니 오포테크 코., 엘티디. | 촬영모듈 및 그 몰드감광 어셈블리와 제조방법, 및 전자장치 |
WO2019003258A1 (ja) * | 2017-06-26 | 2019-01-03 | 三菱電機株式会社 | カメラ装置、複眼撮像装置及び画像処理方法、並びにプログラム及び記録媒体 |
TWI627460B (zh) * | 2017-07-19 | 2018-06-21 | 大立光電股份有限公司 | 成像鏡頭、相機模組及電子裝置 |
JP2019040892A (ja) * | 2017-08-22 | 2019-03-14 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置、カメラモジュール、及び、電子機器 |
JP6957271B2 (ja) * | 2017-08-31 | 2021-11-02 | ソニーセミコンダクタソリューションズ株式会社 | 積層レンズ構造体、固体撮像素子、および、電子機器 |
US10425561B2 (en) * | 2017-09-08 | 2019-09-24 | Apple Inc. | Portable electronic device |
US20190187471A1 (en) * | 2017-12-18 | 2019-06-20 | Flex Ltd. | Dynamically controlled focal plane for optical waveguide-based displays |
KR102572974B1 (ko) * | 2018-04-26 | 2023-08-31 | 엘지이노텍 주식회사 | 카메라 모듈 및 그의 깊이 정보 추출 방법 |
RU186570U1 (ru) * | 2018-10-08 | 2019-01-24 | Общество с ограниченной ответственностью "ИРВЭЙ" | Камера системы ночного видения |
RU2694553C1 (ru) * | 2018-10-08 | 2019-07-16 | Общество с ограниченной ответственностью "ИРВЭЙ" | Камера системы ночного видения |
JP7172553B2 (ja) * | 2018-12-18 | 2022-11-16 | 株式会社デンソー | レンズモジュール及び車両用撮像装置 |
CN112462481B (zh) * | 2019-09-09 | 2022-07-15 | 玉晶光电(厦门)有限公司 | 支撑组件与可携式光学成像镜头 |
TWI707169B (zh) * | 2019-11-29 | 2020-10-11 | 大立光電股份有限公司 | 成像鏡頭、相機模組及電子裝置 |
US11343435B2 (en) | 2019-12-26 | 2022-05-24 | Waymo Llc | Microlensing for real-time sensing of stray light |
CN111152452B (zh) * | 2020-01-14 | 2023-04-18 | 青岛理工大学 | 一种PDMS/SiC功能梯度衬底及其制备方法与应用 |
TWI781458B (zh) | 2020-10-08 | 2022-10-21 | 大立光電股份有限公司 | 光學指紋辨識系統 |
DE102021202164B3 (de) * | 2021-03-05 | 2022-07-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Tandemblendenarchitektur zur Füllfaktorerhöhung von kompakten Multikanalabbildungssystemen |
JP2022147493A (ja) * | 2021-03-23 | 2022-10-06 | 株式会社ダイセル | 光学素子、光学モジュール及び、光学素子または光学モジュールの製造方法 |
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CN1278160C (zh) * | 2001-08-28 | 2006-10-04 | 索尼株式会社 | 投影透镜 |
JP4465958B2 (ja) * | 2002-12-18 | 2010-05-26 | 株式会社ニコン | カラー撮像装置 |
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JP2008092247A (ja) * | 2006-10-02 | 2008-04-17 | Sanyo Electric Co Ltd | 固体撮像素子 |
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- 2016-11-10 JP JP2017552349A patent/JP6859263B2/ja active Active
- 2016-11-10 US US15/560,973 patent/US10375282B2/en active Active
- 2016-11-10 CN CN201680014349.8A patent/CN107431746B/zh active Active
- 2016-11-10 WO PCT/JP2016/083324 patent/WO2017090437A1/ja active Application Filing
- 2016-11-10 KR KR1020177025521A patent/KR20180084629A/ko not_active Application Discontinuation
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Also Published As
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TWI781085B (zh) | 2022-10-21 |
CN107431746A (zh) | 2017-12-01 |
US10375282B2 (en) | 2019-08-06 |
TW201719916A (zh) | 2017-06-01 |
US20180270404A1 (en) | 2018-09-20 |
CN107431746B (zh) | 2021-12-14 |
WO2017090437A1 (ja) | 2017-06-01 |
JP6859263B2 (ja) | 2021-04-14 |
EP3383019A1 (en) | 2018-10-03 |
EP3383019A4 (en) | 2019-10-09 |
JPWO2017090437A1 (ja) | 2018-09-13 |
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