JP6855226B2 - 回路基板及び電子機器 - Google Patents

回路基板及び電子機器 Download PDF

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Publication number
JP6855226B2
JP6855226B2 JP2016233367A JP2016233367A JP6855226B2 JP 6855226 B2 JP6855226 B2 JP 6855226B2 JP 2016233367 A JP2016233367 A JP 2016233367A JP 2016233367 A JP2016233367 A JP 2016233367A JP 6855226 B2 JP6855226 B2 JP 6855226B2
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Japan
Prior art keywords
circuit board
reinforcing
reinforcing member
substrate
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016233367A
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English (en)
Japanese (ja)
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JP2018092998A (ja
JP2018092998A5 (enExample
Inventor
浩幸 松尾
浩幸 松尾
崇弘 菅井
崇弘 菅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dynabook Inc
Original Assignee
Dynabook Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Dynabook Inc filed Critical Dynabook Inc
Priority to JP2016233367A priority Critical patent/JP6855226B2/ja
Publication of JP2018092998A publication Critical patent/JP2018092998A/ja
Publication of JP2018092998A5 publication Critical patent/JP2018092998A5/ja
Application granted granted Critical
Publication of JP6855226B2 publication Critical patent/JP6855226B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016233367A 2016-11-30 2016-11-30 回路基板及び電子機器 Active JP6855226B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016233367A JP6855226B2 (ja) 2016-11-30 2016-11-30 回路基板及び電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016233367A JP6855226B2 (ja) 2016-11-30 2016-11-30 回路基板及び電子機器

Publications (3)

Publication Number Publication Date
JP2018092998A JP2018092998A (ja) 2018-06-14
JP2018092998A5 JP2018092998A5 (enExample) 2019-12-26
JP6855226B2 true JP6855226B2 (ja) 2021-04-07

Family

ID=62566406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016233367A Active JP6855226B2 (ja) 2016-11-30 2016-11-30 回路基板及び電子機器

Country Status (1)

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JP (1) JP6855226B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119325180B (zh) * 2023-07-17 2025-10-10 庆鼎精密电子（淮安）有限公司 电路板及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000068328A (ja) * 1998-08-21 2000-03-03 Olympus Optical Co Ltd フリップチップ実装用配線基板
JP2011210755A (ja) * 2010-03-29 2011-10-20 Panasonic Corp 実装基板
JP5445340B2 (ja) * 2010-06-10 2014-03-19 富士通株式会社 基板補強構造、基板組立体、及び電子機器
JP5132801B1 (ja) * 2011-07-14 2013-01-30 株式会社東芝 テレビジョン受像機、及び電子機器
JP5845792B2 (ja) * 2011-10-07 2016-01-20 株式会社村田製作所 電子部品
JP2014130865A (ja) * 2012-12-28 2014-07-10 Keihin Corp 多層回路基板及び多層回路基板を備えた電子機器

Also Published As

Publication number Publication date
JP2018092998A (ja) 2018-06-14

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