JP2018092998A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018092998A5 JP2018092998A5 JP2016233367A JP2016233367A JP2018092998A5 JP 2018092998 A5 JP2018092998 A5 JP 2018092998A5 JP 2016233367 A JP2016233367 A JP 2016233367A JP 2016233367 A JP2016233367 A JP 2016233367A JP 2018092998 A5 JP2018092998 A5 JP 2018092998A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- reinforcing
- board according
- reinforcing member
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003014 reinforcing effect Effects 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 6
- 238000005476 soldering Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016233367A JP6855226B2 (ja) | 2016-11-30 | 2016-11-30 | 回路基板及び電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016233367A JP6855226B2 (ja) | 2016-11-30 | 2016-11-30 | 回路基板及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018092998A JP2018092998A (ja) | 2018-06-14 |
| JP2018092998A5 true JP2018092998A5 (enExample) | 2019-12-26 |
| JP6855226B2 JP6855226B2 (ja) | 2021-04-07 |
Family
ID=62566406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016233367A Active JP6855226B2 (ja) | 2016-11-30 | 2016-11-30 | 回路基板及び電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6855226B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119325180B (zh) * | 2023-07-17 | 2025-10-10 | 庆鼎精密电子（淮安）有限公司 | 电路板及其制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000068328A (ja) * | 1998-08-21 | 2000-03-03 | Olympus Optical Co Ltd | フリップチップ実装用配線基板 |
| JP2011210755A (ja) * | 2010-03-29 | 2011-10-20 | Panasonic Corp | 実装基板 |
| JP5445340B2 (ja) * | 2010-06-10 | 2014-03-19 | 富士通株式会社 | 基板補強構造、基板組立体、及び電子機器 |
| JP5132801B1 (ja) * | 2011-07-14 | 2013-01-30 | 株式会社東芝 | テレビジョン受像機、及び電子機器 |
| JP5845792B2 (ja) * | 2011-10-07 | 2016-01-20 | 株式会社村田製作所 | 電子部品 |
| JP2014130865A (ja) * | 2012-12-28 | 2014-07-10 | Keihin Corp | 多層回路基板及び多層回路基板を備えた電子機器 |
-
2016
- 2016-11-30 JP JP2016233367A patent/JP6855226B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008187054A5 (enExample) | ||
| JP2018037576A5 (ja) | プリント配線板、プリント回路板及び電子機器 | |
| EP2846356A3 (en) | Electronic device | |
| JP2012129443A5 (enExample) | ||
| JP2016072493A5 (enExample) | ||
| JP2018124503A5 (ja) | 電子機器 | |
| JP2015153816A5 (enExample) | ||
| JP2016139056A5 (enExample) | ||
| JP2009158856A5 (enExample) | ||
| JP2015079911A5 (ja) | 車両電子装置 | |
| JP2014150102A5 (enExample) | ||
| JP2016139057A5 (enExample) | ||
| JP2015118988A5 (enExample) | ||
| JP2015050384A5 (enExample) | ||
| JP2014030321A5 (enExample) | ||
| JP2017510075A5 (enExample) | ||
| US20130269994A1 (en) | Printed circuit board with strengthened pad | |
| JP2017038046A5 (enExample) | ||
| JP2016048649A5 (enExample) | ||
| JP2015130566A5 (ja) | アンテナ装置 | |
| JP2018092998A5 (enExample) | ||
| JP2015035531A5 (enExample) | ||
| JP2014165210A5 (enExample) | ||
| JP2013115205A5 (enExample) | ||
| JP2009188375A5 (enExample) |