JP2018092998A5 - - Google Patents

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Publication number
JP2018092998A5
JP2018092998A5 JP2016233367A JP2016233367A JP2018092998A5 JP 2018092998 A5 JP2018092998 A5 JP 2018092998A5 JP 2016233367 A JP2016233367 A JP 2016233367A JP 2016233367 A JP2016233367 A JP 2016233367A JP 2018092998 A5 JP2018092998 A5 JP 2018092998A5
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JP
Japan
Prior art keywords
circuit board
reinforcing
board according
reinforcing member
substrate
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Application number
JP2016233367A
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Japanese (ja)
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JP6855226B2 (en
JP2018092998A (en
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Priority to JP2016233367A priority Critical patent/JP6855226B2/en
Priority claimed from JP2016233367A external-priority patent/JP6855226B2/en
Publication of JP2018092998A publication Critical patent/JP2018092998A/en
Publication of JP2018092998A5 publication Critical patent/JP2018092998A5/ja
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Publication of JP6855226B2 publication Critical patent/JP6855226B2/en
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Claims (12)

回路基板本体と、
前記回路基板本体上に取り付けられた電子部品と、
前記回路基板本体上への前記電子部品の投影領域の内側に設けられ、前記電子部品と前記回路基板本体とを電気的に接続させる、前記回路基板本体上の取付部と、
前記取付部の前記回路基板本体上の位置に対応して、前記回路基板本体内部に埋設された補強部と、を備えた回路基板。 A circuit board body,
Electronic components mounted on the circuit board body,
A mounting portion on the circuit board main body, which is provided inside a projection area of the electronic component on the circuit board main body and electrically connects the electronic component and the circuit board main body,
A reinforcing portion embedded inside the circuit board main body corresponding to a position of the mounting portion on the circuit board main body. 前記補強部は、前記電子部品の角部に対応して、設けられている請求項１に記載の回路基板。The circuit board according to claim 1, wherein the reinforcing portion is provided corresponding to a corner of the electronic component. 前記電子部品は、前記取付部に電気的に接続される、格子状に並べられた複数のバンプを備え、
前記補強部は、前記バンプの位置に対応して埋設された補強部材から形成されている請求項１又は２に記載の回路基板。 The electronic component is electrically connected to the mounting portion, comprising a plurality of bumps arranged in a grid,
The reinforcing portion, the circuit board according to claim 1 or 2 is formed from a reinforcing member embedded in correspondence with the position of the bump. 前記補強部材は、前記複数のバンプのうち、最外周の前記バンプが前記回路基板本体内部へ投影したときの位置に設けられている請求項３に記載の回路基板。 The reinforcing member, the plurality of bumps, the circuit board according to claim 3 in which the outermost of said bump is provided at a position when projected to the inside of the circuit board body. 前記補強部材は、前記格子状に並べられた前記バンプのうち最外周に配置された前記バンプの配列方向に沿うように配置され、かつＬ字状の形状を有した請求項４に記載の回路基板。 5. The circuit according to claim 4 , wherein the reinforcing member is arranged along the direction in which the outermost bumps of the bumps arranged in the grid are arranged , and has an L- shape. 6. substrate. 前記回路基板本体は、第１基板と、前記第１基板に積層される第２基板とを備え、
前記補強部材は、前記第１基板と前記第２基板との間に設けられている請求項５に記載の回路基板。 The circuit board body includes a first substrate, and a second substrate stacked on the first substrate,
The reinforcing member, the circuit board according to claim 5 which is provided between the first substrate and the second substrate. 前記補強部は、複数の前記補強部材を有し、かつ前記電子部品は矩形状の形状を有し、前記複数の補強部材は、互いに間隔をあけて、前記電子部品の各角部に位置するバンプに対応して設けられている請求項４に記載の回路基板。 The reinforcing section includes a plurality of said reinforcing member, and the electronic component has a rectangular shape, said plurality of reinforcing members, spaced apart from one another, located at each corner of the electronic component The circuit board according to claim 4 , wherein the circuit board is provided corresponding to the bump. 前記補強部材は、前記回路基板本体にはんだ固定されている請求項７に記載の回路基板。 The circuit board according to claim 7 , wherein the reinforcing member is fixed to the circuit board body by soldering. 前記補強部材は、前記回路基板本体に設けられた配線部材により位置決めされている請求項７に記載の回路基板。 The circuit board according to claim 7 , wherein the reinforcing member is positioned by a wiring member provided on the circuit board body. 前記補強部材は、前記回路基板本体に設けられた孔に挿入することにより位置決めされている請求項７に記載の回路基板。 The circuit board according to claim 7 , wherein the reinforcing member is positioned by being inserted into a hole provided in the circuit board body. 前記複数の補強部材の間に内蔵部品を備えた請求項７に記載の回路基板。 The circuit board according to claim 7 , further comprising a built-in component between the plurality of reinforcing members. 請求項１乃至請求項１１のいずれか１項に記載された前記回路基板を有する電子機器。
An electronic device having the circuit board according to any one of claims 1 to 11.
JP2016233367A 2016-11-30 2016-11-30 Circuit boards and electronic devices Active JP6855226B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016233367A JP6855226B2 (en) 2016-11-30 2016-11-30 Circuit boards and electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016233367A JP6855226B2 (en) 2016-11-30 2016-11-30 Circuit boards and electronic devices

Publications (3)

Publication Number Publication Date
JP2018092998A JP2018092998A (en) 2018-06-14
JP2018092998A5 true JP2018092998A5 (en) 2019-12-26
JP6855226B2 JP6855226B2 (en) 2021-04-07

Family

ID=62566406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016233367A Active JP6855226B2 (en) 2016-11-30 2016-11-30 Circuit boards and electronic devices

Country Status (1)

Country Link
JP (1) JP6855226B2 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000068328A (en) * 1998-08-21 2000-03-03 Olympus Optical Co Ltd Wiring board for flip-chip mounting
JP2011210755A (en) * 2010-03-29 2011-10-20 Panasonic Corp Mounting substrate
JP5445340B2 (en) * 2010-06-10 2014-03-19 富士通株式会社 Substrate reinforcement structure, substrate assembly, and electronic device
JP5132801B1 (en) * 2011-07-14 2013-01-30 株式会社東芝 Television receiver and electronic device
JP5845792B2 (en) * 2011-10-07 2016-01-20 株式会社村田製作所 Electronic components
JP2014130865A (en) * 2012-12-28 2014-07-10 Keihin Corp Multilayer circuit board and electronic apparatus having the same

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