JP6842562B2 - アルミニウム合金膜、その製造方法、及び薄膜トランジスタ - Google Patents
アルミニウム合金膜、その製造方法、及び薄膜トランジスタ Download PDFInfo
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- JP6842562B2 JP6842562B2 JP2019547523A JP2019547523A JP6842562B2 JP 6842562 B2 JP6842562 B2 JP 6842562B2 JP 2019547523 A JP2019547523 A JP 2019547523A JP 2019547523 A JP2019547523 A JP 2019547523A JP 6842562 B2 JP6842562 B2 JP 6842562B2
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- 229910052684 Cerium Inorganic materials 0.000 claims description 21
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- 238000001312 dry etching Methods 0.000 claims description 12
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- 238000004544 sputter deposition Methods 0.000 claims description 10
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- 229910052746 lanthanum Inorganic materials 0.000 claims description 9
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
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Description
上記第1添加元素の含有量が0.01原子%以上1.0原子%以下である。
このようなアルミニウム合金膜であれば、アルミニウム合金膜が優れた屈曲耐性を有し、優れた耐熱性を有する。また、アルミニウム合金膜は、エッチングも可能になる。
このようなアルミニウム合金膜であれば、アルミニウム合金膜が優れた屈曲耐性を有し、さらに、優れた耐熱性を有する。また、アルミニウム合金膜は、エッチングも可能になる。
上記第2添加元素の含有量は、0.2原子%以上3.0原子%以下でもよい。
このようなアルミニウム合金膜であれば、アルミニウム合金膜が優れた屈曲耐性を有し、さらに、優れた耐熱性を有する。また、アルミニウム合金膜は、エッチングも可能になる。
このようなアルミニウム合金膜であれば、アルミニウム合金膜が優れた屈曲耐性を有し、粒界に第3添加元素が析出することで優れた耐熱性を有する。また、また、アルミニウム合金膜は、エッチングも可能になる。
放電方式:DC放電
成膜温度:室温(25℃)
成膜圧力:0.3Pa
膜厚:200nm
表2に示すように、Al純金属に、Sc、Zrの第1添加元素が0.01at%以上1.0at%以下含有されているときに、Al合金膜の比抵抗が10μΩ・cm以下になることが分かる。また、Al純金属に、Mn、Siの第2添加元素が0.2at%以上3.0at%以下含有されているときにも、Al合金膜の比抵抗が10μΩ・cm以下になることが分かる。
表4は、Al合金インゴットに含まれる各元素の濃度分布の一例が示されている。
10、20…ガラス基板
11、21…活性層
12、22…ゲート絶縁膜
13、23…ゲート電極
15…保護層
15D、25D…ドレイン電極
16S、26S…ソース電極
Claims (7)
- Al純金属に、
Zr及びScと、Mo、Y、Nb、及びTiの群から選択される少なくとも1種の第1添加元素とが含有され、
Mn及びSiと、Mg及びAgの群から選択される少なくとも1種の第2添加元素とが含有され、
さらに、Ce、Nd、La、及びGdの群から選択される少なくとも1種の第3添加元素が含有され、
Zr及びScと、前記第1添加元素との含有量が0.01原子%以上1.0原子%以下であり、
Mn及びSiと、前記第2添加元素との含有量が0.2原子%以上3.0原子%以下であり、
前記第3添加元素の含有量が0.1原子%以上1.0原子%以下である
アルミニウム合金膜。 - 請求項1に記載されたアルミニウム合金膜であって、
屈曲半径1mmに折り曲げられた場合に耐え得る屈曲耐性を有する
アルミニウム合金膜。 - 請求項1または2に記載されたアルミニウム合金膜であって、
ドライエッチング及びウェットエッチングが可能である
アルミニウム合金膜。 - 請求項1〜3のいずれか1つに記載されたアルミニウム合金膜であって、
表面粗さP−V値が50nm以下である
アルミニウム合金膜。 - 請求項1〜4のいずれか1つに記載されたアルミニウム合金膜であって、
比抵抗が10μΩ・cm以下である
アルミニウム合金膜。 - 請求項1〜5のいずれか1つに記載されたアルミニウム合金膜で構成されたゲート電極を具備する薄膜トランジスタ。
- Al合金ターゲットを用いてスパッタリング法により、Al純金属に、
Zr及びScと、Mo、Y、Nb、及びTiの群から選択される少なくとも1種の第1添加元素とが含有され、
Mn及びSiと、Mg及びAgの群から選択される少なくとも1種の第2添加元素が含有され、
さらに、Ce、Nd、La、及びGdの群から選択される少なくとも1種の第3添加元素が含有され、
Zr及びScと、前記第1添加元素との含有量が0.01原子%以上1.0原子%以下であり、
Mn及びSiと、前記第2添加元素との含有量が0.2原子%以上3.0原子%以下であり、
前記第3添加元素の含有量が0.1原子%以上1.0原子%以下であるアルミニウム合金膜を基板上に製造する製造方法。
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