JP6842467B2 - 赤外線エミッタ - Google Patents
赤外線エミッタ Download PDFInfo
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- JP6842467B2 JP6842467B2 JP2018544410A JP2018544410A JP6842467B2 JP 6842467 B2 JP6842467 B2 JP 6842467B2 JP 2018544410 A JP2018544410 A JP 2018544410A JP 2018544410 A JP2018544410 A JP 2018544410A JP 6842467 B2 JP6842467 B2 JP 6842467B2
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- 239000000758 substrate Substances 0.000 claims description 87
- 239000004020 conductor Substances 0.000 claims description 60
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 40
- 230000005855 radiation Effects 0.000 claims description 38
- 239000011159 matrix material Substances 0.000 claims description 25
- 238000005259 measurement Methods 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 230000003595 spectral effect Effects 0.000 claims description 8
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 229910052906 cristobalite Inorganic materials 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000013039 cover film Substances 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 17
- 239000002002 slurry Substances 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 15
- 239000002245 particle Substances 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
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- 239000011863 silicon-based powder Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 2
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- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
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- 229910052697 platinum Inorganic materials 0.000 description 2
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- 238000010146 3D printing Methods 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 241000500881 Lepisma Species 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
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- 238000005229 chemical vapour deposition Methods 0.000 description 1
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- 238000002485 combustion reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
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- 239000012153 distilled water Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
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- 239000010419 fine particle Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- GNLCAVBZUNZENF-UHFFFAOYSA-N platinum silver Chemical compound [Ag].[Ag].[Ag].[Pt] GNLCAVBZUNZENF-UHFFFAOYSA-N 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000007582 slurry-cast process Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/06—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated
- F27B9/062—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated electrically heated
- F27B9/063—Resistor heating, e.g. with resistors also emitting IR rays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/009—Heating devices using lamps heating devices not specially adapted for a particular application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G17/00—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/06—Glass compositions containing silica with more than 90% silica by weight, e.g. quartz
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D11/00—Arrangement of elements for electric heating in or on furnaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/62—Heating elements specially adapted for furnaces
- H05B3/66—Supports or mountings for heaters on or in the wall or roof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2201/00—Glass compositions
- C03C2201/06—Doped silica-based glasses
- C03C2201/20—Doped silica-based glasses containing non-metals other than boron or halide
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2204/00—Glasses, glazes or enamels with special properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/032—Heaters specially adapted for heating by radiation heating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Combustion & Propulsion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Glass Compositions (AREA)
Description
αλ=ελ (1)
である。
ελ=1−Rgh−Tgh (2)
照射強度の測定は、国際規格IEC 62798 (2014)の方法を用いて行う。
製作には国際公開第2015067688号に記載のスラリーキャスティング法を利用する。高温塩素化処理でアモルファス石英ガラス粒子を予め清浄化し、クリストバライト含有量が1重量%未満であることを確認する。粒径が250μmから650μmの範囲の石英ガラス粒子を、純水で湿式粉砕して、78%の固形分の均一なベーススラリーを形成する。
石英ガラスプレート(2)は、平均表面粗さRaが約1μmになるように表面を研磨する。蛇行形状の印刷導体3を、スクリーン印刷法を用いて研磨した上面5に施工する。この目的のために市販のプラチナ含有抵抗ペーストが使用される。
2 プレート状基板
3 印刷導体
4 反射体層
5 上面
6 底面
Claims (15)
- 導電性でありかつ電流が流れると熱を発生させる抵抗材で作られている印刷導体(3)に接触する上面(5)を含む、電気絶縁材で作られている基板(2;32)を備える赤外線エミッタであって、
前記基板の材料は、赤外線放射のスペクトル域を吸収する追加成分が埋め込まれている、石英ガラスであるアモルファスマトリックス成分を含み、
前記基板(2;32)は、前記印刷導体(3)に面している上面(5)を備え、前記上面(5)の少なくとも一部には、多孔性石英ガラスで作られているカバー層(4)が構成され、前記印刷導体(3)は、少なくとも部分的に、前記カバー層(4)の中に埋め込まれている、赤外線エミッタ。 - 前記追加成分の種類及び量は、温度600℃の前記基板材料において、2から8μmの間の波長に関して少なくとも0.6の放射率εをもたらすように存在する、請求項1に記載の赤外線エミッタ。
- 前記追加成分の種類及び量は、温度1000℃の前記基板材料において、2から8μmの間の波長に関して少なくとも0.75の放射率εをもたらすように存在する、請求項1に記載の赤外線エミッタ。
- 前記石英ガラスは、少なくとも99.99%SiO2の化学的純度及び最大1%のクリストバライト含有量を有する、請求項1に記載の赤外線エミッタ。
- 前記追加成分の重量分率は、0.1から5%の範囲である、請求項1から4のいずれかに記載の赤外線エミッタ。
- 前記追加成分は、別々の追加成分相として存在し、最大平均寸法が20μm未満である非球状組織を含む、請求項1から5のいずれかに記載の赤外線エミッタ。
- 前記追加成分は、別々の追加成分相として存在し、最大平均寸法が3μmよりも大きく20μm未満である非球状組織を含む、請求項6に記載の赤外線エミッタ。
- 前記追加成分は、元素形態の半導体材料を含有する、請求項1から7のいずれかに記載の赤外線エミッタ。
- 前記追加成分は、元素形態のケイ素を含有する、請求項8に記載の赤外線エミッタ。
- 前記基板材料は、0.5%未満の密閉気孔率を呈示し、少なくとも2.19g/cm3の固有の密度を有する、請求項1から9のいずれかに記載の赤外線エミッタ。
- 前記印刷導体(3)は、焼き付けたカバーフイルム層として設けられる、請求項1から10のいずれかに記載の赤外線エミッタ。
- 前記印刷導体(3)は、前記基板(2;32)の表面をカバーする線パターンとして設けられ、少なくとも1mmの介在スペースが印刷導体の隣接セクションの間に残っている、請求項1から11のいずれかに記載の赤外線エミッタ。
- 前記印刷導体(3)は、前記基板(2;32)の表面をカバーする線パターンとして設けられ、少なくとも2mmの介在スペースが印刷導体の隣接セクションの間に残っている、請求項12に記載の赤外線エミッタ。
- 前記印刷導体(3)は、電気絶縁性の気密性層によってカバーされる、請求項1から13のいずれかに記載の赤外線エミッタ。
- パネル赤外線エミッタとして設計され、前記基板(2)は、前記印刷導体(3)から見て外方に向き、赤外線放射を放出する平らな放射面(6)を備え、これによって赤外線放射は、放射面(6)から10 mmの距離において所定の照射強度を発生させ、互いに5mm離間した10の測定点で測定して、いずれの測定点においても前記照射強度の最大値から±10%を超えて逸脱しない、請求項1から14のいずれかに記載の赤外線エミッタ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015119763.4 | 2015-11-16 | ||
DE102015119763.4A DE102015119763A1 (de) | 2015-11-16 | 2015-11-16 | Infrarotstrahler |
PCT/EP2016/077455 WO2017084980A1 (de) | 2015-11-16 | 2016-11-11 | Infrarotstrahler |
Publications (2)
Publication Number | Publication Date |
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JP2018535531A JP2018535531A (ja) | 2018-11-29 |
JP6842467B2 true JP6842467B2 (ja) | 2021-03-17 |
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ID=57286510
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Application Number | Title | Priority Date | Filing Date |
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JP2018544410A Active JP6842467B2 (ja) | 2015-11-16 | 2016-11-11 | 赤外線エミッタ |
JP2018552164A Active JP6772291B2 (ja) | 2015-11-16 | 2017-03-02 | 赤外線加熱ユニット |
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JP2018552164A Active JP6772291B2 (ja) | 2015-11-16 | 2017-03-02 | 赤外線加熱ユニット |
Country Status (8)
Country | Link |
---|---|
US (2) | US10785830B2 (ja) |
EP (2) | EP3169137B1 (ja) |
JP (2) | JP6842467B2 (ja) |
KR (2) | KR102154728B1 (ja) |
CN (2) | CN108353468B (ja) |
DE (1) | DE102015119763A1 (ja) |
TW (1) | TWI649860B (ja) |
WO (2) | WO2017084980A1 (ja) |
Families Citing this family (17)
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---|---|---|---|---|
PL3287421T3 (pl) * | 2015-04-24 | 2021-05-17 | Nipro Corporation | Sposób wytwarzania medycznego pojemnika szklanego, oraz urządzenie do piaskowania ogniowego wyposażone w mechanizm obrotowy |
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-
2015
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2016
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- 2016-11-11 KR KR1020187014996A patent/KR102154728B1/ko active IP Right Grant
- 2016-11-11 US US15/775,947 patent/US10785830B2/en active Active
- 2016-11-11 WO PCT/EP2016/077455 patent/WO2017084980A1/de active Application Filing
- 2016-11-11 JP JP2018544410A patent/JP6842467B2/ja active Active
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- 2017-03-02 US US16/091,161 patent/US20200326127A1/en not_active Abandoned
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KR20180129908A (ko) | 2018-12-05 |
JP2018535531A (ja) | 2018-11-29 |
KR102222601B1 (ko) | 2021-03-08 |
CN108886838A (zh) | 2018-11-23 |
WO2017174266A1 (de) | 2017-10-12 |
TW201731082A (zh) | 2017-09-01 |
EP3378280B1 (de) | 2020-10-28 |
EP3169137B1 (de) | 2019-12-04 |
CN108353468B (zh) | 2022-01-28 |
JP2019511100A (ja) | 2019-04-18 |
EP3378280A1 (de) | 2018-09-26 |
KR20180084823A (ko) | 2018-07-25 |
JP6772291B2 (ja) | 2020-10-21 |
US20180332665A1 (en) | 2018-11-15 |
TWI649860B (zh) | 2019-02-01 |
US20200326127A1 (en) | 2020-10-15 |
US10785830B2 (en) | 2020-09-22 |
KR102154728B1 (ko) | 2020-09-11 |
WO2017084980A1 (de) | 2017-05-26 |
EP3169137A1 (de) | 2017-05-17 |
DE102015119763A1 (de) | 2017-05-18 |
CN108353468A (zh) | 2018-07-31 |
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