JP6831913B2 - 入力装置 - Google Patents
入力装置 Download PDFInfo
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- JP6831913B2 JP6831913B2 JP2019526696A JP2019526696A JP6831913B2 JP 6831913 B2 JP6831913 B2 JP 6831913B2 JP 2019526696 A JP2019526696 A JP 2019526696A JP 2019526696 A JP2019526696 A JP 2019526696A JP 6831913 B2 JP6831913 B2 JP 6831913B2
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- Position Input By Displaying (AREA)
Description
図1は、本実施形態に係る入力装置を例示する分解斜視図である。
図2は、本実施形態に係る入力装置を例示する模式平面図である。図2には、入力装置1におけるフレキシブル配線基板40の接続部分の模式平面図が示される。
図3は、本実施形態に係る入力装置を例示する模式断面図である。図3には、入力装置1におけるフレキシブル配線基板40の接続部分の模式断面図が示される。なお、説明の都合上、図3には表示装置100は示されていない。
フレキシブル配線基板40を接続する場合、配線端部455と端子部155との間に導電性接合部材80を挟み、加熱圧着することで導通および接着を行うが、この圧着を行う際に導電性接合部材80が潰されて周囲に拡がっていく。
図6は、他の例における導電性接合部材のはみ出さない部分の状態を例示する模式平面図である。図6では、配線端部455の部分を拡大した模式平面図が示される。
図7は、比較例を示す模式断面図である。図7には、比較例に係る入力装置2におけるフレキシブル配線基板40の接続部分の模式断面図が示される。なお、説明の都合上、図7には表示装置100は示されていない。
図8は、比較例における導電性接合部材がはみ出した状態を例示する模式平面図である。図8では、配線端部455の部分を拡大した模式平面図が示される。
10…センサ部
11…第1電極
12…第2電極
15…支持基材
15a…第1面
20…表面パネル
30…光学層
35…接着剤
40…フレキシブル配線基板
41,42…フレキシブル基材
45…電極層
50…保護層
60…加飾層
70…接着樹脂層
80…導電性接合部材
80a…先端
100…表示装置
150…引き出しパターン
155…端子部
411…突出部分
411a…先端
455…配線端部
A…気泡領域
BA…緩衝領域
CA…接続領域
D1…第1方向
DA…不可視領域
EA…周辺領域
RA…はみ出さない部分
SA…検知領域
VA…視認領域
h1,h2…高さ
t1…厚さ
Claims (7)
- 支持基材と、前記支持基材の第1面における検知領域に設けられた透光性電極部と、前記透光性電極部と導通し前記支持基材の前記第1面における前記検知領域の外側に設けられた端子部と、を有するセンサ部と、
前記センサ部と第1方向に重ね合わされたフィルム状の光学層と、
前記端子部と接続される接続領域を有し、前記接続領域が前記光学層と前記支持基材との間で挟持されたフレキシブル配線基板と、
を備えた入力装置であって、
前記フレキシブル配線基板は、
電極層が設けられたフレキシブル基材と、
前記電極層の端部であり、前記接続領域において前記端子部と導電性接合部材によって導通するように接続される配線端部と、を有し、
前記光学層の端部が前記フレキシブル配線基板の上に乗り上げるようにして固定されることにより、前記光学層と前記センサ部との間における前記フレキシブル配線基板の端部よりも前記検知領域側には気泡領域が設けられ、
前記配線端部の位置が前記フレキシブル基材の前記検知領域側の端の位置よりも後退していることで、前記フレキシブル基材には前記電極層が積層されておらず前記配線端部よりも前記検知領域側に突出する突出部分が形成され、
前記突出部分の先端よりも前記検知領域側に前記導電性接合部材がはみ出さない部分を有する、入力装置。 - 前記フレキシブル基材の幅方向の80%以上において、前記はみ出さない部分が設けられている、請求項1に記載の入力装置。
- 前記フレキシブル基材の幅方向の20%未満において、前記導電性接合部材は前記突出部分よりも前記検知領域側にはみ出した部分を有し、前記導電性接合部材の当該はみ出した部分における前記第1面からの高さは、前記突出部分の前記第1面からの高さ以下である、請求項2に記載の入力装置。
- 前記透光性電極部と前記光学層との間に設けられた保護層をさらに備え、
前記保護層の主面の外周端部まで前記保護層と前記光学層とを固定する接着層が位置し、前記保護層の主面の外周端部が前記気泡領域の前記検知領域側の端部となる、請求項1から請求項3のいずれか1項に記載の入力装置。 - 前記保護層の厚さの、前記突出部分の前記第1面からの高さに対する割合が0.2以上である、請求項4に記載の入力装置。
- 前記突出部分は、突出する方向において前記支持基材側に近づくように設けられた、請求項1から請求項5のいずれか1項に記載の入力装置。
- 前記第1方向にみたとき、前記導電性接合部材は前記突出部分の先端よりも前記検知領域側にはみ出していない、請求項1から請求項6のいずれか1項に記載の入力装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017127174 | 2017-06-29 | ||
JP2017127174 | 2017-06-29 | ||
PCT/JP2018/019937 WO2019003732A1 (ja) | 2017-06-29 | 2018-05-24 | 入力装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019003732A1 JPWO2019003732A1 (ja) | 2020-04-09 |
JP6831913B2 true JP6831913B2 (ja) | 2021-02-17 |
Family
ID=64741304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019526696A Active JP6831913B2 (ja) | 2017-06-29 | 2018-05-24 | 入力装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11284520B2 (ja) |
EP (1) | EP3647918B1 (ja) |
JP (1) | JP6831913B2 (ja) |
KR (1) | KR102325850B1 (ja) |
CN (1) | CN110678829B (ja) |
TW (1) | TWI652606B (ja) |
WO (1) | WO2019003732A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019040407A (ja) * | 2017-08-25 | 2019-03-14 | ホシデン株式会社 | 樹脂積層体およびこれを備えたタッチ入力装置 |
JP7444593B2 (ja) * | 2019-12-13 | 2024-03-06 | シャープ株式会社 | 表示装置、表示装置の製造方法およびプリント配線基板 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050046622A1 (en) * | 2003-08-26 | 2005-03-03 | Akira Nakanishi | Touch panel and electronic device using the same |
US7639335B2 (en) * | 2007-03-19 | 2009-12-29 | Epson Imaging Devices Corporation | Electro-optical device and electronic apparatus |
CN102187304A (zh) * | 2008-11-19 | 2011-09-14 | 夏普株式会社 | 触摸面板和具备该触摸面板的显示装置 |
KR101309598B1 (ko) | 2009-10-09 | 2013-09-23 | 주식회사 엘지화학 | 일체형 터치 편광판 및 이를 포함하는 터치 패널 |
JP2011118657A (ja) * | 2009-12-03 | 2011-06-16 | Alps Electric Co Ltd | 操作装置 |
JP5611864B2 (ja) | 2011-03-09 | 2014-10-22 | アルプス電気株式会社 | 入力装置及び入力装置の製造方法 |
US9660092B2 (en) * | 2011-08-31 | 2017-05-23 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor thin film transistor including oxygen release layer |
CN107026089B (zh) * | 2012-06-29 | 2021-12-03 | 株式会社半导体能源研究所 | 用于制造半导体装置的方法 |
JP2014130336A (ja) * | 2012-11-30 | 2014-07-10 | Semiconductor Energy Lab Co Ltd | 表示装置 |
WO2014156066A1 (ja) * | 2013-03-25 | 2014-10-02 | パナソニック株式会社 | 入力装置 |
CN104951156A (zh) | 2014-03-31 | 2015-09-30 | 宸盛光电有限公司 | 电容式触控装置 |
KR20160114510A (ko) * | 2015-03-24 | 2016-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 터치 패널 |
US10008797B2 (en) * | 2015-07-10 | 2018-06-26 | Te Connectivity Corporation | Flexible printed circuit connector and connector assembly including the same |
JP6085647B2 (ja) * | 2015-08-11 | 2017-02-22 | 株式会社フジクラ | 配線体アセンブリ、導体層付き構造体、及びタッチセンサ |
JP6168216B2 (ja) * | 2016-08-22 | 2017-07-26 | 大日本印刷株式会社 | タッチパネルセンサおよびフレキシブルプリント配線板付タッチパネルセンサ |
-
2018
- 2018-02-01 TW TW107103582A patent/TWI652606B/zh active
- 2018-05-24 CN CN201880035152.1A patent/CN110678829B/zh active Active
- 2018-05-24 WO PCT/JP2018/019937 patent/WO2019003732A1/ja unknown
- 2018-05-24 KR KR1020197038330A patent/KR102325850B1/ko active IP Right Grant
- 2018-05-24 JP JP2019526696A patent/JP6831913B2/ja active Active
- 2018-05-24 EP EP18822650.0A patent/EP3647918B1/en active Active
-
2019
- 2019-11-06 US US16/675,657 patent/US11284520B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW201905659A (zh) | 2019-02-01 |
WO2019003732A1 (ja) | 2019-01-03 |
JPWO2019003732A1 (ja) | 2020-04-09 |
US11284520B2 (en) | 2022-03-22 |
KR20200012925A (ko) | 2020-02-05 |
CN110678829A (zh) | 2020-01-10 |
CN110678829B (zh) | 2023-05-02 |
EP3647918B1 (en) | 2022-04-20 |
EP3647918A1 (en) | 2020-05-06 |
EP3647918A4 (en) | 2021-04-07 |
KR102325850B1 (ko) | 2021-11-12 |
US20200073497A1 (en) | 2020-03-05 |
TWI652606B (zh) | 2019-03-01 |
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