JP6831133B2 - ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 - Google Patents
ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 Download PDFInfo
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- JP6831133B2 JP6831133B2 JP2019502159A JP2019502159A JP6831133B2 JP 6831133 B2 JP6831133 B2 JP 6831133B2 JP 2019502159 A JP2019502159 A JP 2019502159A JP 2019502159 A JP2019502159 A JP 2019502159A JP 6831133 B2 JP6831133 B2 JP 6831133B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/05—Electron or ion-optical arrangements for separating electrons or ions according to their energy or mass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
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- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/02—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diaphragms, collimators
- G21K1/025—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diaphragms, collimators using multiple collimators, e.g. Bucky screens; other devices for eliminating undesired or dispersed radiation
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- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/10—Scattering devices; Absorbing devices; Ionising radiation filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
- H01J37/1472—Deflecting along given lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
- H01J37/3172—Maskless patterned ion implantation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
- H01J2237/0475—Changing particle velocity decelerating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/05—Arrangements for energy or mass analysis
- H01J2237/057—Energy or mass filtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
- H01J2237/31705—Impurity or contaminant control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
- H01J2237/31706—Ion implantation characterised by the area treated
- H01J2237/3171—Ion implantation characterised by the area treated patterned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
- H01J2237/31706—Ion implantation characterised by the area treated
- H01J2237/3171—Ion implantation characterised by the area treated patterned
- H01J2237/31711—Ion implantation characterised by the area treated patterned using mask
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Physical Vapour Deposition (AREA)
- Element Separation (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016106119.0 | 2016-04-04 | ||
| DE102016106119.0A DE102016106119B4 (de) | 2016-04-04 | 2016-04-04 | Energiefilterelement für Ionenimplantationsanlagen für den Einsatz in der Produktion von Wafern |
| PCT/EP2017/058018 WO2017174597A1 (de) | 2016-04-04 | 2017-04-04 | Energiefilterelement für ionenimplantationsanlagen für den einsatz in der produktion von wafern |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021003936A Division JP7134508B2 (ja) | 2016-04-04 | 2021-01-14 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019522326A JP2019522326A (ja) | 2019-08-08 |
| JP2019522326A5 JP2019522326A5 (https=) | 2020-09-17 |
| JP6831133B2 true JP6831133B2 (ja) | 2021-02-17 |
Family
ID=58544919
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019502159A Active JP6831133B2 (ja) | 2016-04-04 | 2017-04-04 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
| JP2021003936A Active JP7134508B2 (ja) | 2016-04-04 | 2021-01-14 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
| JP2022132936A Active JP7384480B2 (ja) | 2016-04-04 | 2022-08-24 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
| JP2023187393A Active JP7572751B2 (ja) | 2016-04-04 | 2023-11-01 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
| JP2024174677A Active JP7809377B2 (ja) | 2016-04-04 | 2024-10-04 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
| JP2026004510A Pending JP2026065111A (ja) | 2016-04-04 | 2026-01-14 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
Family Applications After (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021003936A Active JP7134508B2 (ja) | 2016-04-04 | 2021-01-14 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
| JP2022132936A Active JP7384480B2 (ja) | 2016-04-04 | 2022-08-24 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
| JP2023187393A Active JP7572751B2 (ja) | 2016-04-04 | 2023-11-01 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
| JP2024174677A Active JP7809377B2 (ja) | 2016-04-04 | 2024-10-04 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
| JP2026004510A Pending JP2026065111A (ja) | 2016-04-04 | 2026-01-14 | ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 |
Country Status (6)
| Country | Link |
|---|---|
| US (5) | US10847338B2 (https=) |
| EP (4) | EP3440690B1 (https=) |
| JP (6) | JP6831133B2 (https=) |
| CN (2) | CN113035676B (https=) |
| DE (1) | DE102016106119B4 (https=) |
| WO (1) | WO2017174597A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016106119B4 (de) | 2016-04-04 | 2019-03-07 | mi2-factory GmbH | Energiefilterelement für Ionenimplantationsanlagen für den Einsatz in der Produktion von Wafern |
| DE102016122791B3 (de) * | 2016-11-25 | 2018-05-30 | mi2-factory GmbH | Ionenimplantationsanlage, Filterkammer und Implantationsverfahren unter Einsatz eines Energiefilterelements |
| EP3605555A4 (en) * | 2017-03-22 | 2020-12-16 | Japan Atomic Energy Agency | FUNCTIONAL MEMBRANE FOR ION BEAM TRANSMISSION, BEAM LINE DEVICE USING A FUNCTIONAL MEMBRANE FOR ION BEAM TRANSMISSION, FILTER DEVICE USING A FUNCTIONAL MEMBRANE FOR ION BEAM TRANSMISSION, AND METHOD OF ADJUSTING A DEVICE FILTER |
| US10217654B1 (en) * | 2018-02-12 | 2019-02-26 | Varian Semiconductor Equipment Associates, Inc. | Embedded features for interlocks using additive manufacturing |
| DE102018114667B3 (de) | 2018-06-19 | 2019-09-19 | Infineon Technologies Ag | Ionenstrahl-moderatorvorrichtung, ionenstrahl-implantationsgerät und ionen-implantationsverfahren |
| DE102019112773B4 (de) * | 2019-05-15 | 2023-11-30 | mi2-factory GmbH | Vorrichtung und Verfahren zur Implantation von Teilchen in ein Substrat |
| DE102019120623B4 (de) * | 2019-07-31 | 2024-01-25 | mi2-factory GmbH | Energiefilter zur Verwendung bei der Implantation von Ionen in ein Substrat |
| LU101808B1 (en) | 2020-05-15 | 2021-11-15 | Mi2 Factory Gmbh | An ion implantation device comprising energy filter and additional heating element |
| LU101807B1 (en) | 2020-05-15 | 2021-11-15 | Mi2 Factory Gmbh | Ion implantation device with energy filter having additional thermal energy dissipation surface area |
| CN111634899B (zh) * | 2020-06-14 | 2022-11-18 | 南开大学 | 一种基于金属-有机框架衍生合成碳包覆磷酸钛钾纳米花的制备方法 |
| US20240047168A1 (en) * | 2020-12-17 | 2024-02-08 | mi2-factory GmbH | Energy Filter Assembly for Ion Implantation System with at least one coupling element |
| JP7705477B2 (ja) * | 2020-12-17 | 2025-07-09 | エムイー2-ファクトリー・ゲーエムベーハー | エネルギーフィルタと、エネルギーフィルタの少なくとも一部に重なるための支持要素とを伴うイオン注入デバイス |
| DE102020134222A1 (de) * | 2020-12-18 | 2022-06-23 | mi2-factory GmbH | Verfahren zur Herstellung eines vorbehandelten Verbundsubstrats und vorbehandeltes Verbundsubstrat |
| US20240232470A9 (en) | 2021-02-24 | 2024-07-11 | mi2-factory GmbH | A Method for the Simulation of an Energy-Filtered Ion Implantation (EFII) |
| WO2022180037A1 (en) | 2021-02-24 | 2022-09-01 | mi2-factory GmbH | A computer-implemented method for the simulation of an energy-filtered ion implantation (efii) using an ion tunnel |
| US11569063B2 (en) | 2021-04-02 | 2023-01-31 | Applied Materials, Inc. | Apparatus, system and method for energy spread ion beam |
| CN114758730B (zh) * | 2022-01-05 | 2024-08-16 | 西安理工大学 | 等离子体活性粒子与绝缘材料表面作用的仿真方法 |
| WO2023140953A1 (en) * | 2022-01-21 | 2023-07-27 | Axcelis Technologies, Inc. | High incidence angle graphite for particle control with dedicated low sputter yield ion beam |
| DE102023103315B4 (de) | 2023-02-10 | 2024-11-28 | Ernst-Abbe-Hochschule Jena, Körperschaft des öffentlichen Rechts | Messvorrichtung, Ionenimplantationsvorrichtung und Verfahren zur ladungsunabhängigen In-Situ-Dosismessung |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4158141A (en) * | 1978-06-21 | 1979-06-12 | Hughes Aircraft Company | Process for channeling ion beams |
| US4278475A (en) * | 1979-01-04 | 1981-07-14 | Westinghouse Electric Corp. | Forming of contoured irradiated regions in materials such as semiconductor bodies by nuclear radiation |
| GB2078441A (en) * | 1980-06-17 | 1982-01-06 | Westinghouse Electric Corp | Forming impurity regions in semiconductor bodies by high energy ion irradiation |
| GB2089499A (en) * | 1980-12-15 | 1982-06-23 | Ramsey Eng Co | X-ray Radiation Analyser |
| DE3121666A1 (de) * | 1981-05-30 | 1982-12-16 | Ibm Deutschland Gmbh, 7000 Stuttgart | Verfahren und einrichtung zur gegenseitigen ausrichtung von objekten bei roentgenstrahl- und korpuskularstrahl-belichtungsvorgaengen |
| JPH0216726A (ja) * | 1988-05-03 | 1990-01-19 | Varian Assoc Inc | イオン注入量の測定のための方法及び装置 |
| JPH0718584Y2 (ja) | 1988-07-18 | 1995-05-01 | 本州製紙株式会社 | 商品底押出し包装体 |
| JP3187043B2 (ja) * | 1990-11-09 | 2001-07-11 | 株式会社フジクラ | 物理蒸着法による酸化物超電導導体の製造方法 |
| KR100221109B1 (ko) | 1992-11-06 | 1999-09-15 | 다니구찌 이찌로오 | 이미지 디스플레이 장치 |
| JP2616423B2 (ja) * | 1993-12-14 | 1997-06-04 | 日本電気株式会社 | イオン注入装置 |
| JPH08220298A (ja) * | 1995-02-11 | 1996-08-30 | Nissin High Voltage Co Ltd | イオンビーム停止部材 |
| DE19652463C2 (de) | 1996-12-17 | 1999-02-25 | Univ Schiller Jena | Verfahren und Vorrichtung zur Herstellung dreidimensionaler Mikrostrukturen beliebiger Form |
| US5972728A (en) * | 1997-12-05 | 1999-10-26 | Advanced Micro Devices, Inc. | Ion implantation feedback monitor using reverse process simulation tool |
| US6335534B1 (en) | 1998-04-17 | 2002-01-01 | Kabushiki Kaisha Toshiba | Ion implantation apparatus, ion generating apparatus and semiconductor manufacturing method with ion implantation processes |
| US6294862B1 (en) * | 1998-05-19 | 2001-09-25 | Eaton Corporation | Multi-cusp ion source |
| US6136164A (en) * | 1998-07-15 | 2000-10-24 | United Microelectronics Corp. | Apparatus for detecting position of collimator in sputtering processing chamber |
| JP2000306541A (ja) * | 1999-04-16 | 2000-11-02 | Nippon Steel Corp | イオン注入装置におけるウェーハ温度検出装置 |
| US6639227B1 (en) * | 2000-10-18 | 2003-10-28 | Applied Materials, Inc. | Apparatus and method for charged particle filtering and ion implantation |
| DE10201868C1 (de) * | 2002-01-18 | 2003-07-17 | Siemens Ag | Röntgeneinrichtung |
| JP4072359B2 (ja) * | 2002-02-28 | 2008-04-09 | 株式会社日立製作所 | 荷電粒子ビーム照射装置 |
| DE10239312B4 (de) | 2002-08-27 | 2006-08-17 | Infineon Technologies Ag | Verfahren zur Herstellung eines Halbleiterbauelements mit einer Driftzone und einer Feldstoppzone und Halbleiterbauelement mit einer Driftzone und einer Feldstoppzone |
| WO2004095138A2 (en) | 2003-04-24 | 2004-11-04 | Fondation Cafi | Micromachining process, system and product |
| US20060043316A1 (en) * | 2003-06-10 | 2006-03-02 | Varian Semiconductor Equipment Associates, Inc. | Ion implanter having enhanced low energy ion beam transport |
| JP2005061663A (ja) * | 2003-08-08 | 2005-03-10 | Takata Corp | イニシエータ、イニシエータ用着火薬、イニシエータの起動方法及びガス発生器 |
| JP2007523440A (ja) * | 2004-02-18 | 2007-08-16 | 学校法人早稲田大学 | イオン注入方法及び装置 |
| DE102005061663B4 (de) * | 2005-12-22 | 2008-07-17 | RUHR-UNIVERSITäT BOCHUM | Ionenimplantationsvorrichtung |
| US7619229B2 (en) * | 2006-10-16 | 2009-11-17 | Varian Semiconductor Equipment Associates, Inc. | Technique for matching performance of ion implantation devices using an in-situ mask |
| US7960708B2 (en) * | 2007-03-13 | 2011-06-14 | University Of Houston | Device and method for manufacturing a particulate filter with regularly spaced micropores |
| US8531814B2 (en) | 2009-04-16 | 2013-09-10 | Varian Semiconductor Equipment Associates, Inc. | Removal of charge between a substrate and an electrostatic clamp |
| US8461556B2 (en) * | 2010-09-08 | 2013-06-11 | Varian Semiconductor Equipment Associates, Inc. | Using beam blockers to perform a patterned implant of a workpiece |
| WO2012039129A1 (ja) * | 2010-09-24 | 2012-03-29 | パナソニック株式会社 | フィルターデバイス |
| US8440578B2 (en) * | 2011-03-28 | 2013-05-14 | Tel Epion Inc. | GCIB process for reducing interfacial roughness following pre-amorphization |
| DE102011075350A1 (de) | 2011-05-05 | 2012-11-08 | Fachhochschule Jena | Energiefilteranordnung für Ionenimplantationsanlagen |
| CN103777227B (zh) * | 2012-10-18 | 2016-06-08 | 上海原子科兴药业有限公司 | 一种回旋加速器束流测量装置 |
| JP6253362B2 (ja) * | 2013-11-21 | 2017-12-27 | 住友重機械イオンテクノロジー株式会社 | 高エネルギーイオン注入装置、ビーム電流調整装置、及びビーム電流調整方法 |
| JP6207418B2 (ja) * | 2014-02-10 | 2017-10-04 | 住友重機械イオンテクノロジー株式会社 | 高エネルギーイオン注入装置、ビーム平行化器、及びビーム平行化方法 |
| US9685298B1 (en) * | 2016-02-01 | 2017-06-20 | Varian Semiconductor Equipment Associates, Inc. | Apparatus and method for contamination control in ion beam apparatus |
| DE102016106119B4 (de) | 2016-04-04 | 2019-03-07 | mi2-factory GmbH | Energiefilterelement für Ionenimplantationsanlagen für den Einsatz in der Produktion von Wafern |
| DE102016110429A1 (de) * | 2016-06-06 | 2017-12-07 | Infineon Technologies Ag | Energiefilter zum Verarbeiten einer Leistungshalbleitervorrichtung |
| JP7705477B2 (ja) * | 2020-12-17 | 2025-07-09 | エムイー2-ファクトリー・ゲーエムベーハー | エネルギーフィルタと、エネルギーフィルタの少なくとも一部に重なるための支持要素とを伴うイオン注入デバイス |
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2016
- 2016-04-04 DE DE102016106119.0A patent/DE102016106119B4/de active Active
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2017
- 2017-04-04 CN CN202110225252.4A patent/CN113035676B/zh active Active
- 2017-04-04 EP EP17717106.3A patent/EP3440690B1/de active Active
- 2017-04-04 CN CN201780029666.1A patent/CN109155228B/zh active Active
- 2017-04-04 US US16/090,521 patent/US10847338B2/en active Active
- 2017-04-04 EP EP25163764.1A patent/EP4546375A3/de active Pending
- 2017-04-04 WO PCT/EP2017/058018 patent/WO2017174597A1/de not_active Ceased
- 2017-04-04 JP JP2019502159A patent/JP6831133B2/ja active Active
- 2017-04-04 EP EP21183792.7A patent/EP3926658B1/de active Active
- 2017-04-04 EP EP25167441.2A patent/EP4553855A3/de active Pending
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2020
- 2020-09-29 US US17/036,966 patent/US11183358B2/en active Active
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2021
- 2021-01-14 JP JP2021003936A patent/JP7134508B2/ja active Active
- 2021-10-01 US US17/491,963 patent/US11837430B2/en active Active
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2022
- 2022-08-24 JP JP2022132936A patent/JP7384480B2/ja active Active
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2023
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