JP6827022B2 - フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 - Google Patents
フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 Download PDFInfo
- Publication number
- JP6827022B2 JP6827022B2 JP2018187990A JP2018187990A JP6827022B2 JP 6827022 B2 JP6827022 B2 JP 6827022B2 JP 2018187990 A JP2018187990 A JP 2018187990A JP 2018187990 A JP2018187990 A JP 2018187990A JP 6827022 B2 JP6827022 B2 JP 6827022B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- copper
- flexible printed
- printed circuit
- tensile strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 86
- 239000011889 copper foil Substances 0.000 title claims description 77
- 238000010438 heat treatment Methods 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 28
- 238000010030 laminating Methods 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 238000005097 cold rolling Methods 0.000 description 14
- 239000010408 film Substances 0.000 description 13
- 230000037303 wrinkles Effects 0.000 description 13
- 238000001035 drying Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 12
- 238000005238 degreasing Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018187990A JP6827022B2 (ja) | 2018-10-03 | 2018-10-03 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
| TW108132612A TWI741365B (zh) | 2018-10-03 | 2019-09-10 | 可撓性印刷基板用銅箔、使用其之覆銅積層體、可撓性印刷基板及電子機器 |
| KR1020190116562A KR102260207B1 (ko) | 2018-10-03 | 2019-09-23 | 플렉시블 프린트 기판용 구리박, 그것을 사용한 동장 적층체, 플렉시블 프린트 기판 및 전자 기기 |
| CN201910923158.9A CN110996507B (zh) | 2018-10-03 | 2019-09-27 | 铜箔、使用其的覆铜叠层体、柔性印刷基板和电子设备 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018187990A JP6827022B2 (ja) | 2018-10-03 | 2018-10-03 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020056081A JP2020056081A (ja) | 2020-04-09 |
| JP6827022B2 true JP6827022B2 (ja) | 2021-02-10 |
Family
ID=70081821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018187990A Active JP6827022B2 (ja) | 2018-10-03 | 2018-10-03 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6827022B2 (zh) |
| KR (1) | KR102260207B1 (zh) |
| CN (1) | CN110996507B (zh) |
| TW (1) | TWI741365B (zh) |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3911173B2 (ja) * | 2002-02-27 | 2007-05-09 | 日鉱金属株式会社 | 銅張積層板用圧延銅箔及びその製造方法（２） |
| JP5235080B2 (ja) * | 2007-09-28 | 2013-07-10 | Ｊｘ日鉱日石金属株式会社 | 銅合金箔及びそれを用いたフレキシブルプリント基板 |
| JP5055088B2 (ja) * | 2007-10-31 | 2012-10-24 | Ｊｘ日鉱日石金属株式会社 | 銅箔及びそれを用いたフレキシブルプリント基板 |
| JP5329372B2 (ja) * | 2009-11-16 | 2013-10-30 | Ｊｘ日鉱日石金属株式会社 | 圧延銅箔、並びにこれを用いた負極集電体、負極板及び二次電池 |
| JP2012038890A (ja) * | 2010-08-06 | 2012-02-23 | Sumitomo Electric Printed Circuit Inc | フレキシブル銅張積層板用銅箔、フレキシブル銅張積層板、フレキシブル銅張積層板の製造方法、フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器 |
| JP5124039B2 (ja) | 2011-03-23 | 2013-01-23 | Ｊｘ日鉱日石金属株式会社 | 銅箔及びそれを用いた銅張積層板 |
| JP2013001983A (ja) * | 2011-06-20 | 2013-01-07 | Jx Nippon Mining & Metals Corp | 圧延銅箔 |
| JP2013001982A (ja) * | 2011-06-20 | 2013-01-07 | Jx Nippon Mining & Metals Corp | 圧延銅箔 |
| JP5826160B2 (ja) | 2012-04-10 | 2015-12-02 | Jx日鉱日石金属株式会社 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
| KR101675706B1 (ko) * | 2013-01-29 | 2016-11-11 | 후루카와 덴키 고교 가부시키가이샤 | 전해 동박, 그 전해 동박을 사용한 리튬 이온 이차 전지용 전극, 그 전극을 사용한 리튬 이온 이차 전지 |
| TWI518210B (zh) * | 2013-01-31 | 2016-01-21 | 三井金屬鑛業股份有限公司 | 電解銅箔、該電解銅箔之製造方法及使用該電解銅箔而得之表面處理銅箔 |
| JP6193950B2 (ja) * | 2015-03-30 | 2017-09-06 | Ｊｘ金属株式会社 | 二次電池用圧延銅箔及びその製造方法、並びにそれを用いたリチウムイオン二次電池及びリチウムイオンキャパシタ |
| KR101776471B1 (ko) * | 2015-03-30 | 2017-09-07 | 제이엑스금속주식회사 | 이차 전지용 압연 동박, 그리고 그것을 사용한 리튬 이온 이차 전지 및 리튬 이온 캐패시터 |
| JP6294376B2 (ja) * | 2016-02-05 | 2018-03-14 | Ｊｘ金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
| JP6663769B2 (ja) | 2016-03-28 | 2020-03-13 | Ｊｘ金属株式会社 | 圧延銅箔、銅張積層板、並びにフレキシブルプリント基板及び電子機器 |
| JP6348621B1 (ja) * | 2017-02-15 | 2018-06-27 | Ｊｘ金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
-
2018
- 2018-10-03 JP JP2018187990A patent/JP6827022B2/ja active Active
-
2019
- 2019-09-10 TW TW108132612A patent/TWI741365B/zh active
- 2019-09-23 KR KR1020190116562A patent/KR102260207B1/ko active IP Right Grant
- 2019-09-27 CN CN201910923158.9A patent/CN110996507B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110996507B (zh) | 2022-09-09 |
| TWI741365B (zh) | 2021-10-01 |
| JP2020056081A (ja) | 2020-04-09 |
| KR102260207B1 (ko) | 2021-06-03 |
| KR20200038410A (ko) | 2020-04-13 |
| TW202030339A (zh) | 2020-08-16 |
| CN110996507A (zh) | 2020-04-10 |
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