JP6825004B2 - 回転クランプ装置 - Google Patents
回転クランプ装置 Download PDFInfo
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- JP6825004B2 JP6825004B2 JP2018552026A JP2018552026A JP6825004B2 JP 6825004 B2 JP6825004 B2 JP 6825004B2 JP 2018552026 A JP2018552026 A JP 2018552026A JP 2018552026 A JP2018552026 A JP 2018552026A JP 6825004 B2 JP6825004 B2 JP 6825004B2
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- 238000012546 transfer Methods 0.000 claims description 22
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- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Description
一実施形態の目的は、クランプ位置の近傍からクランプ位置に行くほどクランプの速度を減少させることにある。
一実施形態の目的は、クランプが基板に対して上向きに膨らんだ曲線状の経路を有するようにすることにある。
前記ストッパは、前記ベースに脱着自在に連結され得る。
また、クランプの速度は、基板と接触するクランプ位置の近傍からクランプ位置に行くほど遅くなり得るため、クランプ過程で基板に加えられる衝撃を低減することができる。
また、クランプが基板に対して上向きに膨らんだ曲線状の経路に沿って移動するため、クランプは角の部分が曲がった基板も安定的に固定することができる。
Claims (11)
- ベースと、
前記ベースに対して相対的に並進運動及び回転運動が可能なクランプホルダと、
前記クランプホルダに配置され、基板をクランプするためのクランプと、
前記ベース及び前記クランプホルダを連結する連結リンクと、
前記クランプホルダに前記基板に対する垂直方向の力を印加することによって、前記クランプが、前記基板をクランプするクランプ位置と前記基板から解除される解除位置との間で動くようにする駆動部と
を含み、
前記クランプは、前記クランプ位置の近傍で前記クランプ位置に移動する間に、前記クランプの垂直方向の速度は前記クランプ位置に行くほど遅くなる
回転クランプ装置。 - 前記連結リンクは、
前記ベース及びクランプホルダにそれぞれ回転自在に連結される下部リンクと、
前記下部リンク上側に配置され、前記クランプホルダ及び前記ベースにそれぞれ回転自在に連結される上部リンクと、
を含む、請求項1に記載の回転クランプ装置。 - 前記ベースの少なくとも一部は基板移送フレームに固定され、
前記ベース、クランプホルダ、下部リンク、及び上部リンクは、前記クランプホルダに印加される力によって1自由度で4節リンク運動される、請求項2に記載の回転クランプ装置。 - 前記クランプは前記基板の上面に接触するための平らな支持面を含み、
前記クランプ位置で、前記下部リンク及び前記上部リンクは互いに平行であり、
前記クランプホルダに前記駆動部が垂直方向の力を印加するとき、前記クランプホルダの瞬間速度は前記支持面に垂直方向を有する、請求項2に記載の回転クランプ装置。 - 前記下部リンクの両側の回転軸間の長さは、前記上部リンクの両側の回転軸間の長さよりも長く、前記クランプホルダに前記駆動部が垂直方向の力を印加される間に、前記クランプホルダの上側は前記ベースに向かって傾く、請求項2に記載の回転クランプ装置。
- 前記下部リンクが前記ベースに対して一定の角度を超過して回転することを防止するストッパをさらに含み、
前記ストッパは、前記ベースに脱着自在に連結される、請求項2に記載の回転クランプ装置。 - 前記ベース及びクランプホルダのいずれか1つ以上に配置され、磁力を用いて前記クランプを前記解除位置から前記クランプ位置に動くようにする少なくとも1つ以上のマグネット部材をさらに含む、請求項1に記載の回転クランプ装置。
- 前記少なくとも1つ以上のマグネット部材は、
前記ベースに配置される第1マグネットと、
前記クランプホルダに配置される第2マグネットと、を含み、
前記第1マグネットにおいて前記第2マグネットに向かい合う面と、前記第2マグネットにおいて前記第1マグネットに向かい合う面は同じ極性を有する、請求項7に記載の回転クランプ装置。 - 前記クランプ位置において、前記第1マグネットは、前記第2マグネットよりも相対的に上側に位置する、請求項8に記載の回転クランプ装置。
- 前記解除位置において、前記第1マグネットは、前記第2マグネットよりも相対的に下側に位置する、請求項8に記載の回転クランプ装置。
- 前記クランプが前記クランプ位置と前記解除位置との間で動く間、前記第1マグネットの表面に対して垂直方向を基準として、前記第1マグネットの中心は前記第2マグネットとオーバーラップされ、前記第2マグネットの中心は前記第1マグネットとオーバーラップされる、請求項8に記載の回転クランプ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170066342A KR101983895B1 (ko) | 2017-05-29 | 2017-05-29 | 회전 클램핑 장치 |
KR10-2017-0066342 | 2017-05-29 | ||
PCT/KR2018/004369 WO2018221854A1 (ko) | 2017-05-29 | 2018-04-16 | 회전 클램핑 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019527464A JP2019527464A (ja) | 2019-09-26 |
JP6825004B2 true JP6825004B2 (ja) | 2021-02-03 |
Family
ID=64454884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018552026A Active JP6825004B2 (ja) | 2017-05-29 | 2018-04-16 | 回転クランプ装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6825004B2 (ja) |
KR (1) | KR101983895B1 (ja) |
CN (1) | CN109311605B (ja) |
TW (1) | TWI690022B (ja) |
WO (1) | WO2018221854A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102143651B1 (ko) * | 2019-03-08 | 2020-08-11 | 주식회사 뉴런 | Lcd용 글래스를 이송 프레임에 고정하는 글래스 클램프 장치 |
KR20210091557A (ko) * | 2020-01-14 | 2021-07-22 | 한국알박(주) | 트레이용 마그넷 클램프 |
CN111883475A (zh) * | 2020-07-17 | 2020-11-03 | 北京北方华创微电子装备有限公司 | 晶圆清洗设备中的卡盘装置及晶圆清洗设备 |
KR102400747B1 (ko) * | 2020-11-16 | 2022-05-25 | 주식회사 저스템 | 기판고정장치 |
CN113013082B (zh) * | 2021-03-01 | 2022-09-13 | 深圳市容微精密电子有限公司 | 一种晶圆检测的夹具机构 |
KR102337329B1 (ko) * | 2021-03-31 | 2021-12-09 | (주)거성 | 이중 자력방식의 클램프장치 |
KR102435481B1 (ko) * | 2021-04-02 | 2022-08-23 | 주식회사 아바코 | 기판 클램핑장치 |
KR102621686B1 (ko) * | 2021-11-17 | 2024-01-08 | 한전케이피에스 주식회사 | 격납건물의 출입문 종합누설률 시험용 클램프 서포트 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001227512A (ja) * | 2000-02-15 | 2001-08-24 | Koganei Corp | 位置決めクランプ装置 |
ITMI20030270A1 (it) * | 2003-02-14 | 2004-08-15 | Univer Spa | Dispositivo di aggancio per pezzi da lavorare. |
JP5463417B2 (ja) * | 2010-05-27 | 2014-04-09 | 株式会社アルバック | トラバース装置及び基板処理装置 |
JP2013154420A (ja) * | 2012-01-27 | 2013-08-15 | Smc Corp | 電動クランプ装置 |
KR101371090B1 (ko) * | 2012-03-14 | 2014-03-20 | 허순 | 글래스 고정용 클램프조립체 |
KR101210296B1 (ko) * | 2012-08-07 | 2012-12-11 | (주)거성 | 평판디스플레이용 글래스를 이송 프레임에 고정하는 클램프 장치 |
KR101342615B1 (ko) * | 2013-03-27 | 2013-12-20 | 창성 주식회사 | 기판 이송장치 |
US9947572B2 (en) * | 2014-03-26 | 2018-04-17 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
CN204721726U (zh) * | 2015-06-02 | 2015-10-21 | 深圳科峤精密机械有限公司 | 基板夹持器及其应用的加工设备 |
-
2017
- 2017-05-29 KR KR1020170066342A patent/KR101983895B1/ko active IP Right Grant
-
2018
- 2018-04-16 CN CN201880001714.0A patent/CN109311605B/zh active Active
- 2018-04-16 WO PCT/KR2018/004369 patent/WO2018221854A1/ko active Application Filing
- 2018-04-16 JP JP2018552026A patent/JP6825004B2/ja active Active
- 2018-05-14 TW TW107116237A patent/TWI690022B/zh active
Also Published As
Publication number | Publication date |
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TWI690022B (zh) | 2020-04-01 |
CN109311605B (zh) | 2021-09-14 |
KR101983895B1 (ko) | 2019-05-29 |
JP2019527464A (ja) | 2019-09-26 |
TW201901849A (zh) | 2019-01-01 |
WO2018221854A1 (ko) | 2018-12-06 |
KR20180130350A (ko) | 2018-12-07 |
CN109311605A (zh) | 2019-02-05 |
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