JP6823669B2 - ２つの回路支持体の間に配置されたデバイスを有する電子モジュールおよびこのような電子モジュールの接合方法 - Google Patents

２つの回路支持体の間に配置されたデバイスを有する電子モジュールおよびこのような電子モジュールの接合方法 Download PDF

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Publication number
JP6823669B2
JP6823669B2 JP2018560067A JP2018560067A JP6823669B2 JP 6823669 B2 JP6823669 B2 JP 6823669B2 JP 2018560067 A JP2018560067 A JP 2018560067A JP 2018560067 A JP2018560067 A JP 2018560067A JP 6823669 B2 JP6823669 B2 JP 6823669B2
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Japan
Prior art keywords
circuit support
mounting surface
contact region
module
circuit
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JP2018560067A
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Japanese (ja)
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JP2019515512A (ja
JP2019515512A5 (enExample
Inventor
ビーグル，トマス
ヘンスラー，アレクサンダー
ノイゲバウアー，シュテファン
プフェッファーライン，シュテファン
シュトロギース，ヨルク
ヴィルケ，クラウス
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Siemens AG
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Siemens AG
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Publication of JP2019515512A5 publication Critical patent/JP2019515512A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H10W76/67—Seals characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2018560067A 2016-05-18 2017-05-02 ２つの回路支持体の間に配置されたデバイスを有する電子モジュールおよびこのような電子モジュールの接合方法 Active JP6823669B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16170185.9A EP3246941A1 (de) 2016-05-18 2016-05-18 Elektronische baugruppe mit einem zwischen zwei schaltungsträgern angeordneten bauelement und verfahren zum fügen einer solchen baugruppe
EP16170185.9 2016-05-18
PCT/EP2017/060361 WO2017198447A1 (de) 2016-05-18 2017-05-02 Elektronische baugruppe mit einem zwischen zwei schaltungsträgern angeordneten bauelement und verfahren zum fügen einer solchen baugruppe

Publications (3)

Publication Number Publication Date
JP2019515512A JP2019515512A (ja) 2019-06-06
JP2019515512A5 JP2019515512A5 (enExample) 2019-07-11
JP6823669B2 true JP6823669B2 (ja) 2021-02-03

Family

ID=56068705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018560067A Active JP6823669B2 (ja) 2016-05-18 2017-05-02 ２つの回路支持体の間に配置されたデバイスを有する電子モジュールおよびこのような電子モジュールの接合方法

Country Status (5)

Country Link
US (1) US10420220B2 (enExample)
EP (2) EP3246941A1 (enExample)
JP (1) JP6823669B2 (enExample)
CN (1) CN109219875B (enExample)
WO (1) WO2017198447A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3246941A1 (de) 2016-05-18 2017-11-22 Siemens Aktiengesellschaft Elektronische baugruppe mit einem zwischen zwei schaltungsträgern angeordneten bauelement und verfahren zum fügen einer solchen baugruppe
DE102017211330A1 (de) * 2017-07-04 2019-01-10 Siemens Aktiengesellschaft Toleranzausgleichselement für Schaltbilder

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4563725A (en) * 1983-01-06 1986-01-07 Welwyn Electronics Limited Electrical assembly
US5904499A (en) * 1994-12-22 1999-05-18 Pace; Benedict G Package for power semiconductor chips
US5759047A (en) * 1996-05-24 1998-06-02 International Business Machines Corporation Flexible circuitized interposer with apertured member and method for making same
US7282932B2 (en) * 2004-03-02 2007-10-16 Micron Technology, Inc. Compliant contact pin assembly, card system and methods thereof
US7906376B2 (en) 2008-06-30 2011-03-15 Intel Corporation Magnetic particle-based composite materials for semiconductor packages
US8033014B2 (en) * 2008-07-07 2011-10-11 Unimicron Technology Corp. Method of making a molded interconnect device
JP2012054449A (ja) * 2010-09-02 2012-03-15 Aisin Aw Co Ltd 電気的接続装置
JP5637156B2 (ja) * 2012-02-22 2014-12-10 トヨタ自動車株式会社 半導体モジュール
KR101444550B1 (ko) * 2012-12-12 2014-09-24 삼성전기주식회사 반도체 모듈
US9355997B2 (en) * 2014-03-12 2016-05-31 Invensas Corporation Integrated circuit assemblies with reinforcement frames, and methods of manufacture
DE102014206601A1 (de) 2014-04-04 2015-10-08 Siemens Aktiengesellschaft Verfahren zum Montieren eines elektrischen Bauelements, bei der eine Haube zum Einsatz kommt, und zur Anwendung in diesem Verfahren geeignete Haube
DE102014206608A1 (de) 2014-04-04 2015-10-08 Siemens Aktiengesellschaft Verfahren zum Montieren eines elektrischen Bauelements, bei der eine Haube zum Einsatz kommt, und zur Anwendung in diesem Verfahren geeignete Haube
DE102014115201B4 (de) 2014-10-20 2025-09-18 Infineon Technologies Ag Verfahren zum verlöten eines schaltungsträgers mit einer trägerplatte
DE102014115815B4 (de) 2014-10-30 2022-11-17 Infineon Technologies Ag Verfahren zur herstellung eines schaltungsträgers, verfahren zur herstellung einer halbleiteranordung, verfahren zum betrieb einer halbleiteranordnung und verfahren zur herstellung eines halbleitermoduls
EP3246941A1 (de) 2016-05-18 2017-11-22 Siemens Aktiengesellschaft Elektronische baugruppe mit einem zwischen zwei schaltungsträgern angeordneten bauelement und verfahren zum fügen einer solchen baugruppe

Also Published As

Publication number Publication date
US10420220B2 (en) 2019-09-17
EP3443589B1 (de) 2021-09-29
CN109219875A (zh) 2019-01-15
EP3246941A1 (de) 2017-11-22
EP3443589A1 (de) 2019-02-20
WO2017198447A1 (de) 2017-11-23
CN109219875B (zh) 2020-06-19
US20190191566A1 (en) 2019-06-20
JP2019515512A (ja) 2019-06-06

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