JP6821327B2 - オンデマンド充填アンプルの補充 - Google Patents

オンデマンド充填アンプルの補充 Download PDF

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Publication number
JP6821327B2
JP6821327B2 JP2016096649A JP2016096649A JP6821327B2 JP 6821327 B2 JP6821327 B2 JP 6821327B2 JP 2016096649 A JP2016096649 A JP 2016096649A JP 2016096649 A JP2016096649 A JP 2016096649A JP 6821327 B2 JP6821327 B2 JP 6821327B2
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JP
Japan
Prior art keywords
ampoule
filling
precursor
substrate processing
deposition
Prior art date
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Active
Application number
JP2016096649A
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English (en)
Japanese (ja)
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JP2017014614A (ja
JP2017014614A5 (enrdf_load_stackoverflow
Inventor
チュアン・グエン
イーシュワー・ランガナタン
シャンカー・スワミナタン
エイドリアン・ラボイエ
クロエ・バルダッセローニ
ラメッシュ・チャンドラセカーラン
フランク・エル．・パスクァーレ
ジェニファー・エル．・ペトラグリア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/720,595 external-priority patent/US11072860B2/en
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2017014614A publication Critical patent/JP2017014614A/ja
Publication of JP2017014614A5 publication Critical patent/JP2017014614A5/ja
Application granted granted Critical
Publication of JP6821327B2 publication Critical patent/JP6821327B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B3/04—Methods of, or means for, filling the material into the containers or receptacles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C23C16/45525—Atomic layer deposition [ALD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2016096649A 2015-05-22 2016-05-13 オンデマンド充填アンプルの補充 Active JP6821327B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/720,595 US11072860B2 (en) 2014-08-22 2015-05-22 Fill on demand ampoule refill
US14/720,595 2015-05-22

Publications (3)

Publication Number Publication Date
JP2017014614A JP2017014614A (ja) 2017-01-19
JP2017014614A5 JP2017014614A5 (enrdf_load_stackoverflow) 2019-06-13
JP6821327B2 true JP6821327B2 (ja) 2021-01-27

Family

ID=57359190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016096649A Active JP6821327B2 (ja) 2015-05-22 2016-05-13 オンデマンド充填アンプルの補充

Country Status (5)

Country Link
JP (1) JP6821327B2 (enrdf_load_stackoverflow)
KR (1) KR102647515B1 (enrdf_load_stackoverflow)
CN (2) CN106169432B (enrdf_load_stackoverflow)
SG (2) SG10201910926YA (enrdf_load_stackoverflow)
TW (1) TWI713524B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10351953B2 (en) * 2017-03-16 2019-07-16 Lam Research Corporation Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing system
CN108962781B (zh) * 2017-05-23 2020-12-08 北京北方华创微电子装备有限公司 一种药液供给系统
US12084771B2 (en) 2021-03-02 2024-09-10 Applied Materials, Inc. Control of liquid delivery in auto-refill systems

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136614A (ja) * 1986-11-28 1988-06-08 Hitachi Ltd 処理装置
JP2742327B2 (ja) * 1990-10-19 1998-04-22 富士写真フイルム株式会社 現像装置運転方法
US5465766A (en) * 1993-04-28 1995-11-14 Advanced Delivery & Chemical Systems, Inc. Chemical refill system for high purity chemicals
JP3409910B2 (ja) * 1994-02-20 2003-05-26 株式会社エステック 液体材料気化供給装置
US5944940A (en) * 1996-07-09 1999-08-31 Gamma Precision Technology, Inc. Wafer transfer system and method of using the same
US6443435B1 (en) * 2000-10-23 2002-09-03 Applied Materials, Inc. Vaporization of precursors at point of use
US20040093938A1 (en) * 2002-11-15 2004-05-20 Chung-Te Tsai Liquid in pipeline and liquid level detection and warning system
JP2006016641A (ja) 2004-06-30 2006-01-19 L'air Liquide Sa Pour L'etude & L'exploitation Des Procede S Georges Claude 金属シリコンオキサイドの製造方法、金属シリコンオキシナイトライドの製造方法、およびシリコンドープされた金属ナイトライドの製造方法
US8268078B2 (en) * 2006-03-16 2012-09-18 Tokyo Electron Limited Method and apparatus for reducing particle contamination in a deposition system
US20100151261A1 (en) * 2006-07-21 2010-06-17 Ce Ma Methods and apparatus for the vaporization and delivery of solution precursors for atomic layer deposition
KR100855582B1 (ko) * 2007-01-12 2008-09-03 삼성전자주식회사 액 공급 장치 및 방법, 상기 장치를 가지는 기판 처리설비, 그리고 기판 처리 방법
US20090214777A1 (en) * 2008-02-22 2009-08-27 Demetrius Sarigiannis Multiple ampoule delivery systems
WO2010056576A1 (en) * 2008-11-11 2010-05-20 Praxair Technology, Inc. Reagent dispensing apparatuses and delivery methods
KR20110122823A (ko) * 2009-01-16 2011-11-11 비코 인스트루먼츠 인코포레이티드 루테늄의 저온 부착용 조성물 및 방법
SG195152A1 (en) * 2011-05-28 2013-12-30 Advanced Tech Materials Refillable ampoule with purge capability
CN103041954A (zh) * 2011-10-13 2013-04-17 北大方正集团有限公司 一种用于旋涂设备的液位报警系统
JP5841007B2 (ja) * 2012-05-28 2016-01-06 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 薬液供給方法と基板処理装置
JP6199037B2 (ja) * 2013-01-15 2017-09-20 鳴香株式会社 液肥供給システム及び自動潅水機

Also Published As

Publication number Publication date
SG10201604041SA (en) 2016-12-29
CN111508870B (zh) 2024-03-01
TWI713524B (zh) 2020-12-21
CN106169432B (zh) 2020-03-17
TW201708599A (zh) 2017-03-01
CN111508870A (zh) 2020-08-07
JP2017014614A (ja) 2017-01-19
KR102647515B1 (ko) 2024-03-13
CN106169432A (zh) 2016-11-30
KR20160137400A (ko) 2016-11-30
SG10201910926YA (en) 2020-01-30

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