JP6814216B2 - 反射光学素子 - Google Patents
反射光学素子 Download PDFInfo
- Publication number
- JP6814216B2 JP6814216B2 JP2018531591A JP2018531591A JP6814216B2 JP 6814216 B2 JP6814216 B2 JP 6814216B2 JP 2018531591 A JP2018531591 A JP 2018531591A JP 2018531591 A JP2018531591 A JP 2018531591A JP 6814216 B2 JP6814216 B2 JP 6814216B2
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- JP
- Japan
- Prior art keywords
- layer
- optical element
- reflective
- optical
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 claims description 101
- 239000000758 substrate Substances 0.000 claims description 46
- 230000017525 heat dissipation Effects 0.000 claims description 27
- 230000005855 radiation Effects 0.000 claims description 22
- 230000005670 electromagnetic radiation Effects 0.000 claims description 19
- 238000007689 inspection Methods 0.000 claims description 19
- 238000010943 off-gassing Methods 0.000 claims description 18
- 238000001393 microlithography Methods 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 124
- 239000000463 material Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000005286 illumination Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000006094 Zerodur Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000484 niobium oxide Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 210000001747 pupil Anatomy 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N Oxozirconium Chemical compound [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- GALOTNBSUVEISR-UHFFFAOYSA-N molybdenum;silicon Chemical compound [Mo]#[Si] GALOTNBSUVEISR-UHFFFAOYSA-N 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
- G21K1/062—Devices having a multilayer structure
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/065—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements provided with cooling means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Optical Elements Other Than Lenses (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015225509.3A DE102015225509A1 (de) | 2015-12-16 | 2015-12-16 | Reflektives optisches Element |
| DE102015225509.3 | 2015-12-16 | ||
| PCT/EP2016/078343 WO2017102256A1 (de) | 2015-12-16 | 2016-11-21 | Reflektives optisches element |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019500652A JP2019500652A (ja) | 2019-01-10 |
| JP2019500652A5 JP2019500652A5 (enExample) | 2020-01-09 |
| JP6814216B2 true JP6814216B2 (ja) | 2021-01-13 |
Family
ID=57389426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018531591A Active JP6814216B2 (ja) | 2015-12-16 | 2016-11-21 | 反射光学素子 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10338476B2 (enExample) |
| JP (1) | JP6814216B2 (enExample) |
| DE (1) | DE102015225509A1 (enExample) |
| WO (1) | WO2017102256A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112713499A (zh) * | 2020-12-30 | 2021-04-27 | 武汉光谷航天三江激光产业技术研究院有限公司 | 光学元件散热装置及方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7424729B2 (en) * | 2000-04-17 | 2008-09-09 | Lg Electronics Inc. | Differentiated PSIP table update interval technology |
| DE10040998A1 (de) * | 2000-08-22 | 2002-03-14 | Zeiss Carl | Projektionsbelichtungsanlage |
| US6806006B2 (en) * | 2002-07-15 | 2004-10-19 | International Business Machines Corporation | Integrated cooling substrate for extreme ultraviolet reticle |
| EP1624467A3 (en) * | 2003-10-20 | 2007-05-30 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
| DE102004060184A1 (de) * | 2004-12-14 | 2006-07-06 | Carl Zeiss Smt Ag | EUV-Spiegelanordnung |
| US7332416B2 (en) * | 2005-03-28 | 2008-02-19 | Intel Corporation | Methods to manufacture contaminant-gettering materials in the surface of EUV optics |
| US7736820B2 (en) * | 2006-05-05 | 2010-06-15 | Asml Netherlands B.V. | Anti-reflection coating for an EUV mask |
| WO2009152959A1 (en) * | 2008-06-17 | 2009-12-23 | Carl Zeiss Smt Ag | Projection exposure apparatus for semiconductor lithography comprising a device for the thermal manipulation of an optical element |
| JP5511818B2 (ja) * | 2008-08-06 | 2014-06-04 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置用の光学素子、かかる光学素子を含むリソグラフィ装置、およびかかる光学素子を製造する方法 |
| DE102009054869B4 (de) * | 2009-04-09 | 2022-02-17 | Carl Zeiss Smt Gmbh | Spiegel zur Führung eines Strahlungsbündels, Vorrichtungen mit einem derartigen Spiegel sowie Verfahren zur Herstellung mikro- oder nanostrukturierter Bauelemente |
| DE102009044462A1 (de) * | 2009-11-06 | 2011-01-05 | Carl Zeiss Smt Ag | Optisches Element, Beleuchtungssystem und Projektionsbelichtungsanlage |
| JP2011222958A (ja) * | 2010-03-25 | 2011-11-04 | Komatsu Ltd | ミラーおよび極端紫外光生成装置 |
| TWI475330B (zh) * | 2010-07-30 | 2015-03-01 | 卡爾蔡司Smt有限公司 | 超紫外線曝光裝置 |
| DE102010039930A1 (de) | 2010-08-30 | 2012-03-01 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage |
| DE102011080052A1 (de) | 2011-07-28 | 2013-01-31 | Carl Zeiss Smt Gmbh | Spiegel, optisches System mit Spiegel und Verfahren zur Herstellung eines Spiegels |
| DE102012212898A1 (de) * | 2012-07-24 | 2014-01-30 | Carl Zeiss Smt Gmbh | Spiegelanordnung für eine EUV-Projektionsbelichtungsanlage, Verfahren zum Betreiben derselben, sowie EUV-Projektionsbelichtungsanlage |
| US20150219874A1 (en) * | 2012-11-29 | 2015-08-06 | Carl Zeiss Smt Gmbh | Cooling system for at least one system component of an optical system for euv applications and system component of this type and optical system of this type |
| DE102013204427A1 (de) * | 2013-03-14 | 2014-09-18 | Carl Zeiss Smt Gmbh | Anordnung zur thermischen Aktuierung eines Spiegels, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage |
| DE102013102670A1 (de) | 2013-03-15 | 2014-10-02 | Asml Netherlands B.V. | Optisches Element und optisches System für die EUV-Lithographie sowie Verfahren zur Behandlung eines solchen optischen Elements |
| DE102014219755A1 (de) | 2013-10-30 | 2015-04-30 | Carl Zeiss Smt Gmbh | Reflektives optisches Element |
| DE102014204171A1 (de) * | 2014-03-06 | 2015-09-24 | Carl Zeiss Smt Gmbh | Optisches Element und optische Anordnung damit |
| DE102014206765A1 (de) * | 2014-04-08 | 2015-10-08 | Carl Zeiss Smt Gmbh | Spiegelanordnung, Projektionsobjektiv und EUV-Lithographieanlage |
| DE102014216240A1 (de) | 2014-08-15 | 2016-02-18 | Carl Zeiss Smt Gmbh | Reflektives optisches Element |
| DE102014222534A1 (de) * | 2014-11-05 | 2015-11-12 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines reflektiven optischen Elements, sowie reflektives optisches Element |
-
2015
- 2015-12-16 DE DE102015225509.3A patent/DE102015225509A1/de not_active Ceased
-
2016
- 2016-11-21 JP JP2018531591A patent/JP6814216B2/ja active Active
- 2016-11-21 WO PCT/EP2016/078343 patent/WO2017102256A1/de not_active Ceased
-
2018
- 2018-06-18 US US16/011,019 patent/US10338476B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DE102015225509A1 (de) | 2017-06-22 |
| US20180307142A1 (en) | 2018-10-25 |
| US10338476B2 (en) | 2019-07-02 |
| WO2017102256A1 (de) | 2017-06-22 |
| JP2019500652A (ja) | 2019-01-10 |
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