JP6813574B2 - インジウムまたはインジウム合金の堆積方法および物品 - Google Patents

インジウムまたはインジウム合金の堆積方法および物品 Download PDF

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Publication number
JP6813574B2
JP6813574B2 JP2018517570A JP2018517570A JP6813574B2 JP 6813574 B2 JP6813574 B2 JP 6813574B2 JP 2018517570 A JP2018517570 A JP 2018517570A JP 2018517570 A JP2018517570 A JP 2018517570A JP 6813574 B2 JP6813574 B2 JP 6813574B2
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Japan
Prior art keywords
indium
alloy
metal
layer
nickel
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Expired - Fee Related
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JP2018517570A
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English (en)
Japanese (ja)
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JP2018529848A (ja
JP2018529848A5 (enExample
Inventor
ヴァジェニン グリゴリー
ヴァジェニン グリゴリー
シュペアリング ヤン
シュペアリング ヤン
ピーパー シュテファン
ピーパー シュテファン
カステッラーニ マウロ
カステッラーニ マウロ
キアプス アンドレアス
キアプス アンドレアス
ローデ ディアク
ローデ ディアク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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Publication of JP2018529848A publication Critical patent/JP2018529848A/ja
Publication of JP2018529848A5 publication Critical patent/JP2018529848A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • C25D5/40—Nickel; Chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00—Electrolytic stripping of metallic layers or coatings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2018517570A 2015-10-06 2016-10-04 インジウムまたはインジウム合金の堆積方法および物品 Expired - Fee Related JP6813574B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15188618.1 2015-10-06
EP15188618 2015-10-06
PCT/EP2016/073631 WO2017060216A1 (en) 2015-10-06 2016-10-04 Process for indium or indium alloy deposition and article

Publications (3)

Publication Number Publication Date
JP2018529848A JP2018529848A (ja) 2018-10-11
JP2018529848A5 JP2018529848A5 (enExample) 2019-09-26
JP6813574B2 true JP6813574B2 (ja) 2021-01-13

Family

ID=54266445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018517570A Expired - Fee Related JP6813574B2 (ja) 2015-10-06 2016-10-04 インジウムまたはインジウム合金の堆積方法および物品

Country Status (8)

Country Link
US (1) US10753007B2 (enExample)
EP (1) EP3359710B1 (enExample)
JP (1) JP6813574B2 (enExample)
KR (1) KR102527433B1 (enExample)
CN (1) CN108138348B (enExample)
PT (1) PT3359710T (enExample)
TW (1) TWI740849B (enExample)
WO (1) WO2017060216A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180016690A1 (en) * 2016-07-18 2018-01-18 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing 2-imidazolidinethione compounds and methods for electroplating indium
US10428436B2 (en) * 2016-07-18 2019-10-01 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing amine compounds and methods of electroplating indium
EP3540097A1 (en) 2018-03-13 2019-09-18 COVENTYA S.p.A. Electroplated products and electroplating bath for providing such products
TWI684310B (zh) * 2018-11-22 2020-02-01 國家中山科學研究院 雷射系統散熱裝置
US20200240029A1 (en) * 2019-01-25 2020-07-30 Rohm And Haas Electronic Materials Llc Indium electroplating compositions and methods for electroplating indium on nickel
EP4001472A1 (en) * 2020-11-16 2022-05-25 COVENTYA S.p.A. Method for preparing an electroplated product by depositing an underlayer, diffusion barrier layer and top layer on the surface of a substrate and such prepared electroplated product
CN119530908A (zh) * 2024-11-28 2025-02-28 铜陵蔚屹新材料有限公司 一种碱性的电镀铟组合物及其使用方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
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US2287948A (en) 1938-12-16 1942-06-30 Gen Motors Corp Indium plating
GB573848A (en) 1943-05-22 1945-12-10 Vandervell Products Ltd Improvements in and relating to indium plating
US2458839A (en) 1944-04-19 1949-01-11 Indium Corp America Electrodeposition of indium and its alloys
US2426624A (en) 1946-07-02 1947-09-02 Standard Oil Co Extraction of quinonoid hydrocarbons from benzenoid hydrocarbons by means of anhydrous hydrogen fluoride
US4015949A (en) * 1973-06-13 1977-04-05 The Glacier Metal Company Limited Plain bearings
JP2857775B2 (ja) 1989-09-13 1999-02-17 同和ハイテック株式会社 金属表面の耐酸化処理方法
US5554211A (en) 1995-11-15 1996-09-10 Mcgean-Rohco, Inc. Aqueous electroless plating solutions
JP2002249887A (ja) * 2000-12-20 2002-09-06 Seiko Epson Corp 装飾品の表面処理方法および装飾品
EP1475463B2 (en) * 2002-12-20 2017-03-01 Shipley Company, L.L.C. Reverse pulse plating method
US20070227633A1 (en) * 2006-04-04 2007-10-04 Basol Bulent M Composition control for roll-to-roll processed photovoltaic films
JP5497261B2 (ja) 2006-12-15 2014-05-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． インジウム組成物
US20090188808A1 (en) 2008-01-29 2009-07-30 Jiaxiong Wang Indium electroplating baths for thin layer deposition
US8092667B2 (en) 2008-06-20 2012-01-10 Solopower, Inc. Electroplating method for depositing continuous thin layers of indium or gallium rich materials
WO2010046235A1 (en) * 2008-10-21 2010-04-29 Atotech Deutschland Gmbh Method to form solder deposits on substrates
JP6099256B2 (ja) * 2012-01-20 2017-03-22 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ スズおよびスズ合金のための改良されたフラックス方法
US8956473B2 (en) 2012-11-20 2015-02-17 National Taiwan University Of Science And Technology Method for manufacturing Ni/In/Sn/Cu multilayer structure
JP6247926B2 (ja) * 2013-12-19 2017-12-13 古河電気工業株式会社 可動接点部品用材料およびその製造方法

Also Published As

Publication number Publication date
TW201732085A (zh) 2017-09-16
CN108138348B (zh) 2020-04-24
TWI740849B (zh) 2021-10-01
US20180298511A1 (en) 2018-10-18
JP2018529848A (ja) 2018-10-11
WO2017060216A1 (en) 2017-04-13
PT3359710T (pt) 2020-07-15
KR20180063295A (ko) 2018-06-11
EP3359710B1 (en) 2020-04-08
US10753007B2 (en) 2020-08-25
EP3359710A1 (en) 2018-08-15
KR102527433B1 (ko) 2023-04-28
CN108138348A (zh) 2018-06-08

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