KR102527433B1 - 인듐 또는 인듐 합금 성막을 위한 방법 및 물품 - Google Patents

인듐 또는 인듐 합금 성막을 위한 방법 및 물품 Download PDF

Info

Publication number
KR102527433B1
KR102527433B1 KR1020187012936A KR20187012936A KR102527433B1 KR 102527433 B1 KR102527433 B1 KR 102527433B1 KR 1020187012936 A KR1020187012936 A KR 1020187012936A KR 20187012936 A KR20187012936 A KR 20187012936A KR 102527433 B1 KR102527433 B1 KR 102527433B1
Authority
KR
South Korea
Prior art keywords
indium
alloy
metal
layer
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020187012936A
Other languages
English (en)
Korean (ko)
Other versions
KR20180063295A (ko
Inventor
그리고리 파체닌
얀 슈페를링
슈테판 피퍼
마우로 카슈텔라니
안드레아스 키르브스
디르크 로데
Original Assignee
아토테크 도이칠란트 게엠베하 운트 콤파니 카게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 filed Critical 아토테크 도이칠란트 게엠베하 운트 콤파니 카게
Publication of KR20180063295A publication Critical patent/KR20180063295A/ko
Application granted granted Critical
Publication of KR102527433B1 publication Critical patent/KR102527433B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • C25D5/40—Nickel; Chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00—Electrolytic stripping of metallic layers or coatings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020187012936A 2015-10-06 2016-10-04 인듐 또는 인듐 합금 성막을 위한 방법 및 물품 Active KR102527433B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15188618.1 2015-10-06
EP15188618 2015-10-06
PCT/EP2016/073631 WO2017060216A1 (en) 2015-10-06 2016-10-04 Process for indium or indium alloy deposition and article

Publications (2)

Publication Number Publication Date
KR20180063295A KR20180063295A (ko) 2018-06-11
KR102527433B1 true KR102527433B1 (ko) 2023-04-28

Family

ID=54266445

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187012936A Active KR102527433B1 (ko) 2015-10-06 2016-10-04 인듐 또는 인듐 합금 성막을 위한 방법 및 물품

Country Status (8)

Country Link
US (1) US10753007B2 (enExample)
EP (1) EP3359710B1 (enExample)
JP (1) JP6813574B2 (enExample)
KR (1) KR102527433B1 (enExample)
CN (1) CN108138348B (enExample)
PT (1) PT3359710T (enExample)
TW (1) TWI740849B (enExample)
WO (1) WO2017060216A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180016690A1 (en) * 2016-07-18 2018-01-18 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing 2-imidazolidinethione compounds and methods for electroplating indium
US10428436B2 (en) * 2016-07-18 2019-10-01 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing amine compounds and methods of electroplating indium
EP3540097A1 (en) 2018-03-13 2019-09-18 COVENTYA S.p.A. Electroplated products and electroplating bath for providing such products
TWI684310B (zh) * 2018-11-22 2020-02-01 國家中山科學研究院 雷射系統散熱裝置
US20200240029A1 (en) * 2019-01-25 2020-07-30 Rohm And Haas Electronic Materials Llc Indium electroplating compositions and methods for electroplating indium on nickel
EP4001472A1 (en) * 2020-11-16 2022-05-25 COVENTYA S.p.A. Method for preparing an electroplated product by depositing an underlayer, diffusion barrier layer and top layer on the surface of a substrate and such prepared electroplated product
CN119530908A (zh) * 2024-11-28 2025-02-28 铜陵蔚屹新材料有限公司 一种碱性的电镀铟组合物及其使用方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013174009A (ja) 2012-01-20 2013-09-05 Rohm & Haas Electronic Materials Llc スズおよびスズ合金のための改良されたフラックス方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2287948A (en) 1938-12-16 1942-06-30 Gen Motors Corp Indium plating
GB573848A (en) 1943-05-22 1945-12-10 Vandervell Products Ltd Improvements in and relating to indium plating
US2458839A (en) 1944-04-19 1949-01-11 Indium Corp America Electrodeposition of indium and its alloys
US2426624A (en) 1946-07-02 1947-09-02 Standard Oil Co Extraction of quinonoid hydrocarbons from benzenoid hydrocarbons by means of anhydrous hydrogen fluoride
US4015949A (en) * 1973-06-13 1977-04-05 The Glacier Metal Company Limited Plain bearings
JP2857775B2 (ja) 1989-09-13 1999-02-17 同和ハイテック株式会社 金属表面の耐酸化処理方法
US5554211A (en) 1995-11-15 1996-09-10 Mcgean-Rohco, Inc. Aqueous electroless plating solutions
JP2002249887A (ja) * 2000-12-20 2002-09-06 Seiko Epson Corp 装飾品の表面処理方法および装飾品
EP1475463B2 (en) * 2002-12-20 2017-03-01 Shipley Company, L.L.C. Reverse pulse plating method
US20070227633A1 (en) * 2006-04-04 2007-10-04 Basol Bulent M Composition control for roll-to-roll processed photovoltaic films
JP5497261B2 (ja) 2006-12-15 2014-05-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． インジウム組成物
US20090188808A1 (en) 2008-01-29 2009-07-30 Jiaxiong Wang Indium electroplating baths for thin layer deposition
US8092667B2 (en) 2008-06-20 2012-01-10 Solopower, Inc. Electroplating method for depositing continuous thin layers of indium or gallium rich materials
WO2010046235A1 (en) * 2008-10-21 2010-04-29 Atotech Deutschland Gmbh Method to form solder deposits on substrates
US8956473B2 (en) 2012-11-20 2015-02-17 National Taiwan University Of Science And Technology Method for manufacturing Ni/In/Sn/Cu multilayer structure
JP6247926B2 (ja) * 2013-12-19 2017-12-13 古河電気工業株式会社 可動接点部品用材料およびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013174009A (ja) 2012-01-20 2013-09-05 Rohm & Haas Electronic Materials Llc スズおよびスズ合金のための改良されたフラックス方法

Also Published As

Publication number Publication date
TW201732085A (zh) 2017-09-16
CN108138348B (zh) 2020-04-24
TWI740849B (zh) 2021-10-01
US20180298511A1 (en) 2018-10-18
JP2018529848A (ja) 2018-10-11
WO2017060216A1 (en) 2017-04-13
PT3359710T (pt) 2020-07-15
KR20180063295A (ko) 2018-06-11
EP3359710B1 (en) 2020-04-08
US10753007B2 (en) 2020-08-25
EP3359710A1 (en) 2018-08-15
CN108138348A (zh) 2018-06-08
JP6813574B2 (ja) 2021-01-13

Similar Documents

Publication Publication Date Title
KR102527433B1 (ko) 인듐 또는 인듐 합금 성막을 위한 방법 및 물품
TWI723126B (zh) 水性銦或銦合金電鍍浴及沉積銦或銦合金之方法
JP2002506927A (ja) 作業部材の上に金属を電解により沈着させる装置および方法
TW201407003A (zh) 使用反向電流除鍍以清洗電鍍基板夾持具
KR20130130000A (ko) 전기 도금 방식의 무연 범프 퇴적
US20050067297A1 (en) Copper bath for electroplating fine circuitry on semiconductor chips
KR20180136886A (ko) 환경 친화적인 니켈 전기도금 조성물 및 방법
CN1936095A (zh) 金属二相体及其制备方法
US20020074242A1 (en) Seed layer recovery
Reid Damascene copper electroplating
EP3312308A1 (en) Nickel plating solution
Cho et al. An empirical relation between the plating process and accelerator coverage in Cu superfilling
CN114761620B (zh) 用于平滑拓扑的钴化学
US8114770B2 (en) Pre-treatment method to increase copper island density of CU on barrier layers
Podlaha-Murphy Electronics and 3-D Packaging 4
Delbos et al. Study of Seed-Layer Stability on Copper Electrolytic Bath
Forman High-speed SnAG Solder Electroplating Process and Developments on Cost Reduction

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20180504

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20210728

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20220913

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20230327

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20230426

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20230426

End annual number: 3

Start annual number: 1

PG1601 Publication of registration