JP2018529848A5 - - Google Patents
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- Publication number
- JP2018529848A5 JP2018529848A5 JP2018517570A JP2018517570A JP2018529848A5 JP 2018529848 A5 JP2018529848 A5 JP 2018529848A5 JP 2018517570 A JP2018517570 A JP 2018517570A JP 2018517570 A JP2018517570 A JP 2018517570A JP 2018529848 A5 JP2018529848 A5 JP 2018529848A5
- Authority
- JP
- Japan
- Prior art keywords
- indium
- alloy
- nickel
- metal
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15188618.1 | 2015-10-06 | ||
| EP15188618 | 2015-10-06 | ||
| PCT/EP2016/073631 WO2017060216A1 (en) | 2015-10-06 | 2016-10-04 | Process for indium or indium alloy deposition and article |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018529848A JP2018529848A (ja) | 2018-10-11 |
| JP2018529848A5 true JP2018529848A5 (enExample) | 2019-09-26 |
| JP6813574B2 JP6813574B2 (ja) | 2021-01-13 |
Family
ID=54266445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018517570A Expired - Fee Related JP6813574B2 (ja) | 2015-10-06 | 2016-10-04 | インジウムまたはインジウム合金の堆積方法および物品 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10753007B2 (enExample) |
| EP (1) | EP3359710B1 (enExample) |
| JP (1) | JP6813574B2 (enExample) |
| KR (1) | KR102527433B1 (enExample) |
| CN (1) | CN108138348B (enExample) |
| PT (1) | PT3359710T (enExample) |
| TW (1) | TWI740849B (enExample) |
| WO (1) | WO2017060216A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180016690A1 (en) * | 2016-07-18 | 2018-01-18 | Rohm And Haas Electronic Materials Llc | Indium electroplating compositions containing 2-imidazolidinethione compounds and methods for electroplating indium |
| US10428436B2 (en) * | 2016-07-18 | 2019-10-01 | Rohm And Haas Electronic Materials Llc | Indium electroplating compositions containing amine compounds and methods of electroplating indium |
| EP3540097A1 (en) | 2018-03-13 | 2019-09-18 | COVENTYA S.p.A. | Electroplated products and electroplating bath for providing such products |
| TWI684310B (zh) * | 2018-11-22 | 2020-02-01 | 國家中山科學研究院 | 雷射系統散熱裝置 |
| US20200240029A1 (en) * | 2019-01-25 | 2020-07-30 | Rohm And Haas Electronic Materials Llc | Indium electroplating compositions and methods for electroplating indium on nickel |
| EP4001472A1 (en) * | 2020-11-16 | 2022-05-25 | COVENTYA S.p.A. | Method for preparing an electroplated product by depositing an underlayer, diffusion barrier layer and top layer on the surface of a substrate and such prepared electroplated product |
| CN119530908A (zh) * | 2024-11-28 | 2025-02-28 | 铜陵蔚屹新材料有限公司 | 一种碱性的电镀铟组合物及其使用方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2287948A (en) | 1938-12-16 | 1942-06-30 | Gen Motors Corp | Indium plating |
| GB573848A (en) | 1943-05-22 | 1945-12-10 | Vandervell Products Ltd | Improvements in and relating to indium plating |
| US2458839A (en) | 1944-04-19 | 1949-01-11 | Indium Corp America | Electrodeposition of indium and its alloys |
| US2426624A (en) | 1946-07-02 | 1947-09-02 | Standard Oil Co | Extraction of quinonoid hydrocarbons from benzenoid hydrocarbons by means of anhydrous hydrogen fluoride |
| US4015949A (en) * | 1973-06-13 | 1977-04-05 | The Glacier Metal Company Limited | Plain bearings |
| JP2857775B2 (ja) | 1989-09-13 | 1999-02-17 | 同和ハイテック株式会社 | 金属表面の耐酸化処理方法 |
| US5554211A (en) | 1995-11-15 | 1996-09-10 | Mcgean-Rohco, Inc. | Aqueous electroless plating solutions |
| JP2002249887A (ja) * | 2000-12-20 | 2002-09-06 | Seiko Epson Corp | 装飾品の表面処理方法および装飾品 |
| EP1475463B2 (en) * | 2002-12-20 | 2017-03-01 | Shipley Company, L.L.C. | Reverse pulse plating method |
| US20070227633A1 (en) * | 2006-04-04 | 2007-10-04 | Basol Bulent M | Composition control for roll-to-roll processed photovoltaic films |
| JP5497261B2 (ja) | 2006-12-15 | 2014-05-21 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | インジウム組成物 |
| US20090188808A1 (en) | 2008-01-29 | 2009-07-30 | Jiaxiong Wang | Indium electroplating baths for thin layer deposition |
| US8092667B2 (en) | 2008-06-20 | 2012-01-10 | Solopower, Inc. | Electroplating method for depositing continuous thin layers of indium or gallium rich materials |
| WO2010046235A1 (en) * | 2008-10-21 | 2010-04-29 | Atotech Deutschland Gmbh | Method to form solder deposits on substrates |
| JP6099256B2 (ja) * | 2012-01-20 | 2017-03-22 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | スズおよびスズ合金のための改良されたフラックス方法 |
| US8956473B2 (en) | 2012-11-20 | 2015-02-17 | National Taiwan University Of Science And Technology | Method for manufacturing Ni/In/Sn/Cu multilayer structure |
| JP6247926B2 (ja) * | 2013-12-19 | 2017-12-13 | 古河電気工業株式会社 | 可動接点部品用材料およびその製造方法 |
-
2016
- 2016-10-04 KR KR1020187012936A patent/KR102527433B1/ko active Active
- 2016-10-04 WO PCT/EP2016/073631 patent/WO2017060216A1/en not_active Ceased
- 2016-10-04 CN CN201680058684.8A patent/CN108138348B/zh not_active Expired - Fee Related
- 2016-10-04 JP JP2018517570A patent/JP6813574B2/ja not_active Expired - Fee Related
- 2016-10-04 EP EP16775716.0A patent/EP3359710B1/en active Active
- 2016-10-04 TW TW105132024A patent/TWI740849B/zh not_active IP Right Cessation
- 2016-10-04 PT PT167757160T patent/PT3359710T/pt unknown
- 2016-10-04 US US15/766,016 patent/US10753007B2/en active Active
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