JP6808386B2 - インプリント装置および物品製造方法 - Google Patents

インプリント装置および物品製造方法 Download PDF

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Publication number
JP6808386B2
JP6808386B2 JP2016137956A JP2016137956A JP6808386B2 JP 6808386 B2 JP6808386 B2 JP 6808386B2 JP 2016137956 A JP2016137956 A JP 2016137956A JP 2016137956 A JP2016137956 A JP 2016137956A JP 6808386 B2 JP6808386 B2 JP 6808386B2
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Japan
Prior art keywords
mold
substrate
imprinting apparatus
gas
imprinting
Prior art date
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Active
Application number
JP2016137956A
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English (en)
Japanese (ja)
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JP2018010941A5 (enExample
JP2018010941A (ja
Inventor
一樹 中川
一樹 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016137956A priority Critical patent/JP6808386B2/ja
Priority to KR1020170087574A priority patent/KR102193919B1/ko
Publication of JP2018010941A publication Critical patent/JP2018010941A/ja
Publication of JP2018010941A5 publication Critical patent/JP2018010941A5/ja
Application granted granted Critical
Publication of JP6808386B2 publication Critical patent/JP6808386B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
JP2016137956A 2016-07-12 2016-07-12 インプリント装置および物品製造方法 Active JP6808386B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016137956A JP6808386B2 (ja) 2016-07-12 2016-07-12 インプリント装置および物品製造方法
KR1020170087574A KR102193919B1 (ko) 2016-07-12 2017-07-11 임프린트 장치 및 물품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016137956A JP6808386B2 (ja) 2016-07-12 2016-07-12 インプリント装置および物品製造方法

Publications (3)

Publication Number Publication Date
JP2018010941A JP2018010941A (ja) 2018-01-18
JP2018010941A5 JP2018010941A5 (enExample) 2019-08-22
JP6808386B2 true JP6808386B2 (ja) 2021-01-06

Family

ID=60995796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016137956A Active JP6808386B2 (ja) 2016-07-12 2016-07-12 インプリント装置および物品製造方法

Country Status (2)

Country Link
JP (1) JP6808386B2 (enExample)
KR (1) KR102193919B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7495814B2 (ja) * 2020-05-13 2024-06-05 キヤノン株式会社 インプリント装置、および物品の製造方法
KR102599372B1 (ko) 2021-04-21 2023-11-06 엘에스일렉트릭(주) 냉각 유닛을 구비한 배전반

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7377764B2 (en) * 2005-06-13 2008-05-27 Asml Netherlands B.V. Imprint lithography
US7316554B2 (en) * 2005-09-21 2008-01-08 Molecular Imprints, Inc. System to control an atmosphere between a body and a substrate
US20110140304A1 (en) * 2009-12-10 2011-06-16 Molecular Imprints, Inc. Imprint lithography template
JP5647029B2 (ja) * 2011-02-18 2014-12-24 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2013026573A (ja) * 2011-07-25 2013-02-04 Canon Inc インプリント装置、および、物品の製造方法
WO2014112495A1 (ja) * 2013-01-17 2014-07-24 キヤノン株式会社 インプリント方法、およびインプリント装置
JP6064466B2 (ja) * 2012-09-11 2017-01-25 大日本印刷株式会社 インプリント方法およびそれを実施するためのインプリント装置
US10279538B2 (en) * 2012-10-04 2019-05-07 Dai Nippon Printing Co., Ltd. Imprinting method and imprinting apparatus
JP5949430B2 (ja) * 2012-10-18 2016-07-06 富士通株式会社 インプリント装置及びインプリント方法
JP6230041B2 (ja) * 2013-04-18 2017-11-15 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6177346B2 (ja) * 2013-11-06 2017-08-09 キヤノン株式会社 インプリント用型のパターンの決定方法、インプリント方法及び装置
JP6497839B2 (ja) * 2013-11-07 2019-04-10 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2016021442A (ja) * 2014-07-11 2016-02-04 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2016031952A (ja) * 2014-07-25 2016-03-07 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2016054231A (ja) * 2014-09-04 2016-04-14 キヤノン株式会社 インプリント装置
JP2016054232A (ja) * 2014-09-04 2016-04-14 キヤノン株式会社 インプリント装置

Also Published As

Publication number Publication date
KR20180007331A (ko) 2018-01-22
KR102193919B1 (ko) 2020-12-22
JP2018010941A (ja) 2018-01-18

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