JP6802726B2 - 基板搬送装置、それを備える基板処理装置および基板搬送方法 - Google Patents

基板搬送装置、それを備える基板処理装置および基板搬送方法 Download PDF

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JP6802726B2
JP6802726B2 JP2017025350A JP2017025350A JP6802726B2 JP 6802726 B2 JP6802726 B2 JP 6802726B2 JP 2017025350 A JP2017025350 A JP 2017025350A JP 2017025350 A JP2017025350 A JP 2017025350A JP 6802726 B2 JP6802726 B2 JP 6802726B2
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substrate
unit
virtual
hand
transfer device
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JP2018133415A (ja
JP2018133415A5 (enExample
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丈二 ▲桑▼原
丈二 ▲桑▼原
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to JP2017025350A priority Critical patent/JP6802726B2/ja
Priority to TW106144945A priority patent/TWI668788B/zh
Priority to US15/861,716 priority patent/US10627800B2/en
Priority to KR1020180011361A priority patent/KR102035923B1/ko
Priority to CN201810094828.6A priority patent/CN108428655B/zh
Publication of JP2018133415A publication Critical patent/JP2018133415A/ja
Publication of JP2018133415A5 publication Critical patent/JP2018133415A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2017025350A 2017-02-14 2017-02-14 基板搬送装置、それを備える基板処理装置および基板搬送方法 Active JP6802726B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017025350A JP6802726B2 (ja) 2017-02-14 2017-02-14 基板搬送装置、それを備える基板処理装置および基板搬送方法
TW106144945A TWI668788B (zh) 2017-02-14 2017-12-21 基板搬送裝置、具備其之基板處理裝置及基板搬送方法
US15/861,716 US10627800B2 (en) 2017-02-14 2018-01-04 Substrate transport device, substrate processing apparatus including the substrate transport device, and substrate transport method
KR1020180011361A KR102035923B1 (ko) 2017-02-14 2018-01-30 기판 반송 장치, 그것을 구비하는 기판 처리 장치 및 기판 반송 방법
CN201810094828.6A CN108428655B (zh) 2017-02-14 2018-01-31 基板搬运装置、基板处理装置以及基板搬运方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017025350A JP6802726B2 (ja) 2017-02-14 2017-02-14 基板搬送装置、それを備える基板処理装置および基板搬送方法

Publications (3)

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JP2018133415A JP2018133415A (ja) 2018-08-23
JP2018133415A5 JP2018133415A5 (enExample) 2020-03-26
JP6802726B2 true JP6802726B2 (ja) 2020-12-16

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US (1) US10627800B2 (enExample)
JP (1) JP6802726B2 (enExample)
KR (1) KR102035923B1 (enExample)
CN (1) CN108428655B (enExample)
TW (1) TWI668788B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
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JP6923344B2 (ja) 2017-04-13 2021-08-18 株式会社Ｓｃｒｅｅｎホールディングス 周縁処理装置および周縁処理方法
JP7303648B2 (ja) * 2019-03-20 2023-07-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置における対象物の搬送方法
KR102763727B1 (ko) * 2019-05-28 2025-02-07 캐논 톡키 가부시키가이샤 기판 반송 시스템, 기판 반송 방법, 기판 처리 시스템 및 기판 처리 방법
US11335578B2 (en) * 2020-02-13 2022-05-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer apparatus and method of measuring positional deviation of substrate
JP7579657B2 (ja) * 2020-09-07 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
TWI781763B (zh) * 2020-09-18 2022-10-21 日商斯庫林集團股份有限公司 基板洗淨裝置及基板洗淨方法
JP2022132087A (ja) * 2021-02-26 2022-09-07 東京エレクトロン株式会社 搬送システム、搬送装置及び搬送方法
JP7664063B2 (ja) * 2021-03-19 2025-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP7667035B2 (ja) * 2021-08-27 2025-04-22 キオクシア株式会社 基板処理装置および半導体装置の製造方法
JP2025043483A (ja) 2023-09-19 2025-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2025079671A (ja) * 2023-11-10 2025-05-22 ヴイエム インコーポレイテッド 搬送された半導体部品の中心位置決め方法及びそのためのシステム

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Also Published As

Publication number Publication date
KR102035923B1 (ko) 2019-10-23
TW201842615A (zh) 2018-12-01
US10627800B2 (en) 2020-04-21
US20180231952A1 (en) 2018-08-16
CN108428655A (zh) 2018-08-21
TWI668788B (zh) 2019-08-11
CN108428655B (zh) 2022-07-22
JP2018133415A (ja) 2018-08-23

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