TWI668788B - 基板搬送裝置、具備其之基板處理裝置及基板搬送方法 - Google Patents
基板搬送裝置、具備其之基板處理裝置及基板搬送方法 Download PDFInfo
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- TWI668788B TWI668788B TW106144945A TW106144945A TWI668788B TW I668788 B TWI668788 B TW I668788B TW 106144945 A TW106144945 A TW 106144945A TW 106144945 A TW106144945 A TW 106144945A TW I668788 B TWI668788 B TW I668788B
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- 239000000758 substrate Substances 0.000 title claims abstract description 550
- 238000012545 processing Methods 0.000 title claims description 190
- 238000000034 method Methods 0.000 title claims description 20
- 238000012546 transfer Methods 0.000 claims abstract description 202
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- 238000012937 correction Methods 0.000 claims description 10
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017025350A JP6802726B2 (ja) | 2017-02-14 | 2017-02-14 | 基板搬送装置、それを備える基板処理装置および基板搬送方法 |
| JP2017-025350 | 2017-02-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201842615A TW201842615A (zh) | 2018-12-01 |
| TWI668788B true TWI668788B (zh) | 2019-08-11 |
Family
ID=63104593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106144945A TWI668788B (zh) | 2017-02-14 | 2017-12-21 | 基板搬送裝置、具備其之基板處理裝置及基板搬送方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10627800B2 (enExample) |
| JP (1) | JP6802726B2 (enExample) |
| KR (1) | KR102035923B1 (enExample) |
| CN (1) | CN108428655B (enExample) |
| TW (1) | TWI668788B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6923344B2 (ja) | 2017-04-13 | 2021-08-18 | 株式会社Ｓｃｒｅｅｎホールディングス | 周縁処理装置および周縁処理方法 |
| JP7303648B2 (ja) * | 2019-03-20 | 2023-07-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理装置における対象物の搬送方法 |
| KR102763727B1 (ko) * | 2019-05-28 | 2025-02-07 | 캐논 톡키 가부시키가이샤 | 기판 반송 시스템, 기판 반송 방법, 기판 처리 시스템 및 기판 처리 방법 |
| US11335578B2 (en) * | 2020-02-13 | 2022-05-17 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer apparatus and method of measuring positional deviation of substrate |
| JP7579657B2 (ja) * | 2020-09-07 | 2024-11-08 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板搬送装置および基板搬送方法 |
| TWI781763B (zh) * | 2020-09-18 | 2022-10-21 | 日商斯庫林集團股份有限公司 | 基板洗淨裝置及基板洗淨方法 |
| JP2022132087A (ja) * | 2021-02-26 | 2022-09-07 | 東京エレクトロン株式会社 | 搬送システム、搬送装置及び搬送方法 |
| JP7664063B2 (ja) * | 2021-03-19 | 2025-04-17 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板搬送装置および基板搬送方法 |
| JP7667035B2 (ja) * | 2021-08-27 | 2025-04-22 | キオクシア株式会社 | 基板処理装置および半導体装置の製造方法 |
| JP2025043483A (ja) | 2023-09-19 | 2025-04-01 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP2025079671A (ja) * | 2023-11-10 | 2025-05-22 | ヴイエム インコーポレイテッド | 搬送された半導体部品の中心位置決め方法及びそのためのシステム |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200714537A (en) * | 2005-07-11 | 2007-04-16 | Brooks Automation Inc | Substrate transport apparatus with automated alignment |
| TW201409601A (zh) * | 2012-07-19 | 2014-03-01 | 大日本網屏製造股份有限公司 | 基板處理裝置及基板處理方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| NL8203318A (nl) * | 1982-08-24 | 1984-03-16 | Integrated Automation | Inrichting voor processing van substraten. |
| JP2626582B2 (ja) * | 1994-10-27 | 1997-07-02 | 日本電気株式会社 | ウエハ位置の計測ユニットならびにウエハアライメントユニットおよび方法 |
| US5831851A (en) * | 1995-03-21 | 1998-11-03 | Seagate Technology, Inc. | Apparatus and method for controlling high throughput sputtering |
| US5882413A (en) * | 1997-07-11 | 1999-03-16 | Brooks Automation, Inc. | Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer |
| US20070269297A1 (en) * | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
| JP2005209954A (ja) * | 2004-01-23 | 2005-08-04 | Kawasaki Heavy Ind Ltd | 基板保持装置 |
| JP2007335613A (ja) * | 2006-06-15 | 2007-12-27 | Nikon Corp | 基板位置検出装置、基板搬送装置、露光装置、基板位置検出方法及びマイクロデバイスの製造方法 |
| JP2008124194A (ja) * | 2006-11-10 | 2008-05-29 | Canon Inc | 液浸露光方法および液浸露光装置 |
| JP4697192B2 (ja) | 2007-06-12 | 2011-06-08 | 東京エレクトロン株式会社 | 位置ずれ検出装置及びこれを用いた処理システム |
| US8224607B2 (en) * | 2007-08-30 | 2012-07-17 | Applied Materials, Inc. | Method and apparatus for robot calibrations with a calibrating device |
| JP2009071008A (ja) | 2007-09-13 | 2009-04-02 | Sokudo:Kk | 基板処理装置 |
| JP5614326B2 (ja) * | 2010-08-20 | 2014-10-29 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体 |
| JP5490741B2 (ja) | 2011-03-02 | 2014-05-14 | 東京エレクトロン株式会社 | 基板搬送装置の位置調整方法、及び基板処理装置 |
| JP5516482B2 (ja) | 2011-04-11 | 2014-06-11 | 東京エレクトロン株式会社 | 基板搬送方法、基板搬送装置、及び塗布現像装置 |
| CN103561905A (zh) * | 2011-06-08 | 2014-02-05 | 村田机械株式会社 | 工件处理系统 |
| US9862554B2 (en) * | 2011-10-26 | 2018-01-09 | Brooks Automation, Inc. | Semiconductor wafer handling and transport |
| JP5582152B2 (ja) | 2012-02-03 | 2014-09-03 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及び記憶媒体 |
| JP6001961B2 (ja) * | 2012-08-29 | 2016-10-05 | 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ | 基板処理装置および基板処理方法 |
| US9488975B2 (en) * | 2013-12-18 | 2016-11-08 | Globalfoundries Singapore Pte. Ltd. | Methods and media for lot dispatch priority |
| JP6422695B2 (ja) * | 2014-07-18 | 2018-11-14 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6316742B2 (ja) | 2014-12-24 | 2018-04-25 | 東京エレクトロン株式会社 | 基板搬送装置および基板搬送方法 |
| JP6880364B2 (ja) * | 2015-08-18 | 2021-06-02 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6697984B2 (ja) * | 2016-08-31 | 2020-05-27 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
-
2017
- 2017-02-14 JP JP2017025350A patent/JP6802726B2/ja active Active
- 2017-12-21 TW TW106144945A patent/TWI668788B/zh active
-
2018
- 2018-01-04 US US15/861,716 patent/US10627800B2/en active Active
- 2018-01-30 KR KR1020180011361A patent/KR102035923B1/ko active Active
- 2018-01-31 CN CN201810094828.6A patent/CN108428655B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200714537A (en) * | 2005-07-11 | 2007-04-16 | Brooks Automation Inc | Substrate transport apparatus with automated alignment |
| TW201409601A (zh) * | 2012-07-19 | 2014-03-01 | 大日本網屏製造股份有限公司 | 基板處理裝置及基板處理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6802726B2 (ja) | 2020-12-16 |
| KR102035923B1 (ko) | 2019-10-23 |
| TW201842615A (zh) | 2018-12-01 |
| US10627800B2 (en) | 2020-04-21 |
| US20180231952A1 (en) | 2018-08-16 |
| CN108428655A (zh) | 2018-08-21 |
| CN108428655B (zh) | 2022-07-22 |
| JP2018133415A (ja) | 2018-08-23 |
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