JP6802207B2 - 感光性樹脂組成物 - Google Patents
感光性樹脂組成物 Download PDFInfo
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- JP6802207B2 JP6802207B2 JP2018057061A JP2018057061A JP6802207B2 JP 6802207 B2 JP6802207 B2 JP 6802207B2 JP 2018057061 A JP2018057061 A JP 2018057061A JP 2018057061 A JP2018057061 A JP 2018057061A JP 6802207 B2 JP6802207 B2 JP 6802207B2
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- Prior art keywords
- photosensitive resin
- resin composition
- acid
- mass
- carboxyl group
- Prior art date
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- -1 aliphatic urea compound Chemical class 0.000 claims description 51
- 229920005989 resin Polymers 0.000 claims description 46
- 239000011347 resin Substances 0.000 claims description 46
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 40
- 150000001875 compounds Chemical class 0.000 claims description 30
- 239000004593 Epoxy Substances 0.000 claims description 26
- 239000004202 carbamide Substances 0.000 claims description 23
- 239000003085 diluting agent Substances 0.000 claims description 15
- 239000003999 initiator Substances 0.000 claims description 12
- 125000001931 aliphatic group Chemical group 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
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- 238000000576 coating method Methods 0.000 description 25
- 239000011248 coating agent Substances 0.000 description 24
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- 239000000126 substance Substances 0.000 description 12
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 7
- 238000011161 development Methods 0.000 description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 7
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- 125000003700 epoxy group Chemical group 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
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- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000013039 cover film Substances 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- DPZSNGJNFHWQDC-ARJAWSKDSA-N (z)-2,3-diaminobut-2-enedinitrile Chemical compound N#CC(/N)=C(/N)C#N DPZSNGJNFHWQDC-ARJAWSKDSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 239000000038 blue colorant Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 2
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000040 green colorant Substances 0.000 description 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
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- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
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- 239000011574 phosphorus Substances 0.000 description 2
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- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
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- NIDNOXCRFUCAKQ-UMRXKNAASA-N (1s,2r,3s,4r)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1[C@H]2C=C[C@@H]1[C@H](C(=O)O)[C@@H]2C(O)=O NIDNOXCRFUCAKQ-UMRXKNAASA-N 0.000 description 1
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- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- YJQMXVDKXSQCDI-UHFFFAOYSA-N 2-ethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3SC2=C1 YJQMXVDKXSQCDI-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
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- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 description 1
- VRRIVXLVXXAHJA-UHFFFAOYSA-N tris(2,3,4-tribromophenyl) phosphate Chemical compound BrC1=C(Br)C(Br)=CC=C1OP(=O)(OC=1C(=C(Br)C(Br)=CC=1)Br)OC1=CC=C(Br)C(Br)=C1Br VRRIVXLVXXAHJA-UHFFFAOYSA-N 0.000 description 1
- MHEGXVLDEDJADA-UHFFFAOYSA-N tris(2,3,4-trimethylphenyl) phosphate Chemical compound CC1=C(C)C(C)=CC=C1OP(=O)(OC=1C(=C(C)C(C)=CC=1)C)OC1=CC=C(C)C(C)=C1C MHEGXVLDEDJADA-UHFFFAOYSA-N 0.000 description 1
- LRSNDFOWYYKLHB-UHFFFAOYSA-N tris(2,3-dibromophenyl) phosphate Chemical compound BrC1=CC=CC(OP(=O)(OC=2C(=C(Br)C=CC=2)Br)OC=2C(=C(Br)C=CC=2)Br)=C1Br LRSNDFOWYYKLHB-UHFFFAOYSA-N 0.000 description 1
- JZZBTMVTLBHJHL-UHFFFAOYSA-N tris(2,3-dichloropropyl) phosphate Chemical compound ClCC(Cl)COP(=O)(OCC(Cl)CCl)OCC(Cl)CCl JZZBTMVTLBHJHL-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- GTRSAMFYSUBAGN-UHFFFAOYSA-N tris(2-chloropropyl) phosphate Chemical compound CC(Cl)COP(=O)(OCC(C)Cl)OCC(C)Cl GTRSAMFYSUBAGN-UHFFFAOYSA-N 0.000 description 1
- LIPMRGQQBZJCTM-UHFFFAOYSA-N tris(2-propan-2-ylphenyl) phosphate Chemical compound CC(C)C1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C(C)C)OC1=CC=CC=C1C(C)C LIPMRGQQBZJCTM-UHFFFAOYSA-N 0.000 description 1
- SPUXJWDKFVXXBI-UHFFFAOYSA-N tris(2-tert-butylphenyl) phosphate Chemical compound CC(C)(C)C1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C(C)(C)C)OC1=CC=CC=C1C(C)(C)C SPUXJWDKFVXXBI-UHFFFAOYSA-N 0.000 description 1
- BHYQWBKCXBXPKM-UHFFFAOYSA-N tris[3-bromo-2,2-bis(bromomethyl)propyl] phosphate Chemical compound BrCC(CBr)(CBr)COP(=O)(OCC(CBr)(CBr)CBr)OCC(CBr)(CBr)CBr BHYQWBKCXBXPKM-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000001060 yellow colorant Substances 0.000 description 1
- PJEUXMXPJGWZOZ-UHFFFAOYSA-L zinc;diphenylphosphinate Chemical compound [Zn+2].C=1C=CC=CC=1P(=O)([O-])C1=CC=CC=C1.C=1C=CC=CC=1P(=O)([O-])C1=CC=CC=C1 PJEUXMXPJGWZOZ-UHFFFAOYSA-L 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
カルボキシル基含有感光性樹脂は、特に限定されず、例えば、1分子中に、感光性の不飽和二重結合を1個以上、好ましくは2個以上有する樹脂が挙げられる。カルボキシル基含有感光性樹脂として、例えば、1分子中にエポキシ基を2個以上有する多官能エポキシ樹脂のエポキシ基の少なくとも一部に、アクリル酸やメタクリル酸(以下、「(メタ)アクリル酸」ということがある。)等のラジカル重合性不飽和モノカルボン酸を反応させて、エポキシ(メタ)アクリレート等のラジカル重合性不飽和モノカルボン酸化エポキシ樹脂を得て、生成した水酸基に多塩基酸又はその無水物を反応させて得られる、多塩基酸変性エポキシ(メタ)アクリレート等の多塩基酸変性ラジカル重合性不飽和モノカルボン酸化エポキシ樹脂を挙げることができる。
光重合開始剤は、特に限定されず、いずれも使用することができる。光重合開始剤としては、例えば、1,2−オクタンジオン,1−〔4−(フェニルチオ)−2−(O−ベンゾイルオキシム)〕、エタノン1−〔9−エチル−6−(2−メチルベンゾイル)−9H−カルバゾール−3−イル]−1−(0−アセチルオキシム)、2−(アセチルオキシイミノメチル)チオキサンテン−9−オン、1,8−オクタンジオン,1,8−ビス[9−エチル−6−ニトロ−9H−カルバゾール−3−イル]−,1,8−ビス(O−アセチルオキシム)、1,8−オクタンジオン,1,8−ビス[9−(2−エチルヘキシル)−6−ニトロ−9H−カルバゾール−3−イル]−,1,8−ビス(O−アセチルオキシム)、(Z) −(9−エチル−6−ニトロ−9H−カルバゾール−3−イル)(4−((1−メトキシプロパン−2−イル)オキシ) −2−メチルフェニル)メタノン O−アセチルオキシム等のオキシムエステル系光重合開始剤、フェニルビス(2,4,6−トリメチルベンゾイル)ホスフィンオキシド、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンゾイン‐n‐ブチルエーテル、ベンゾインイソブチルエーテル、アセトフェノン、ジメチルアミノアセトフェノン、2,2‐ジメトキシ‐2‐フェニルアセトフェノン、2,2‐ジエトキシ‐2‐フェニルアセトフェノン、1−ベンジル−1−(ジメチルアミノ)プロピル−4−モルフォリノフェニル−ケトン、2−メチル−4’−(メチルチオ)−2−モルフォリノプロピオフェノン、2−ベンジル−2−ジメチルアミノ−1−(4−モルフォリノフェニル)−ブタノン−1、2‐ヒドロキシ‐2‐メチル‐1‐フェニルプロパン‐1‐オン、1‐ヒドロキシシクロヘキシルフェニルケトン、4‐(2‐ヒドロキシエトキシ)フェニル‐2‐(ヒドロキシ‐2‐プロピル)ケトン、ベンゾフェノン、p‐フェニルベンゾフェノン、4,4′‐ビス(ジエチルアミノ)ベンゾフェノン、ジクロルベンゾフェノン、2‐メチルアントラキノン、2‐エチルアントラキノン、2‐ターシャリーブチルアントラキノン、2‐アミノアントラキノン、2‐メチルチオキサントン、2‐エチルチオキサントン、2‐クロルチオキサントン、2,4‐ジメチルチオキサントン、2,4‐ジエチルチオキサントン、ベンジルジメチルケタール、アセトフェノンジメチルケタール、P‐ジメチルアミノ安息香酸エチルエステル等が挙げられる。これらの化合物は、単独で使用してもよく、2種以上を併用してもよい。光重合開始剤の含有量は、特に限定されないが、カルボキシル基含有感光性樹脂100質量部(固形分、以下同じ。)に対して、1.0〜10質量部が好ましく、2.0〜8.0質量部が特に好ましい。
エポキシ化合物は、感光性樹脂組成物の光硬化物の架橋密度を上げて、十分な機械的強度を有する硬化塗膜を得るためのものである。エポキシ化合物としては、例えば、エポキシ樹脂を挙げることができる。エポキシ樹脂としては、例えば、ビフェニル型エポキシ樹脂、ビフェニルアラルキル型エポキシ樹脂、ビスフェノールA型エポキシ樹脂、テトラメチルビスフェノールF型エポキシ樹脂等のビスフェノールF型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、アダマンタン型エポキシ樹脂を挙げることができる。これらのうち、ポットライフをさらに向上させる点から、ビスフェノールA型エポキシ樹脂、ビフェニル型エポキシ樹脂、テトラメチルビスフェノールF型エポキシ樹脂が好ましく、ビフェニル型エポキシ樹脂、テトラメチルビスフェノールF型エポキシ樹脂が特に好ましい。これらの化合物は単独で使用してもよく、2種以上を併用してもよい。
カルボキシル基含有感光性樹脂とエポキシ化合物とを含有する本発明の感光性樹脂組成物に脂肪族系ウレア化合物が配合されることにより、感光性樹脂組成物を一液型としても、常温(25℃)での保存中にカルボキシル基含有感光性樹脂とエポキシ化合物との反応が進んでしまうことを防止して、常温でも優れたポットライフを得ることができる。従って、常温での取り扱い可能時間を長期化できるので、本発明の感光性樹脂組成物の塗工作業等における取り扱い性が向上する。また、本発明の感光性樹脂組成物に脂肪族系ウレア化合物が配合されることにより、感光性樹脂組成物の光硬化物の耐薬品性も得ることもできる。
下記表1に示す各成分を下記表1に示す配合割合にて配合し、3本ロールを用いて室温(25℃)にて混合分散させて、実施例1〜5、比較例1〜6にて使用する感光性樹脂組成物を調製した。下記表1に示す各成分の配合量は、特に断りのない限り質量部を示す。なお、下記表1中の配合量の空欄部は、配合なしを意味する。
(A)カルボキシル基含有感光性樹脂
・KAYARAD ZAR-2000:固形分(樹脂分)65質量%、日本化薬(株)
なお、KAYARAD ZAR-2000は、エポキシ樹脂(ビスフェノールA型エポキシ樹脂)のエポキシ基の少なくとも一部に、アクリル酸を反応させて、エポキシアクリレートを得、エポキシアクリレートの生成した水酸基に多塩基酸を反応させて得られる、多塩基酸変性エポキシアクリレート樹脂である。
・IRGACURE369:チバスペシャリティケミカルズ(株)
・EAB:保土谷化学工業(株)
・IRGACURE OXE02:チバスペシャルティケミカルズ(株)
(C)エポキシ化合物
・NC-3000:日本化薬(株)
・エピクロン860、エピクロンN-695:DIC(株)
・YX-4000HK:三菱化学(株)
・YSLV-80XY:新日鐵住金化学(株)
・DPCA-120:日本化薬(株)
硬化触媒
・ジシアンジアミド:東京化成工業(株)
・メラミン:東京化成工業(株)
・2−メルカプトベンゾオキサザール:東京化成工業(株)
難燃剤
・エクソリット OP-935:クラリアントジャパン(株)
着色剤
・クロモフタルDPPオレンジTR:チバスペシャルティケミカルズ(株)
・リオノールブルーFG-7351:東洋インキ製造(株)
消泡剤
・KS-66:信越化学工業(株)
非反応性希釈剤
・EDGAC:三洋化成品(株)
塗布基板:ポリエチレンテレフタレートフィルム(PETフィルム)
塗工法:バーコータ
予備乾燥:110℃、5分
評価基板:二層銅張積層板(CCL)(ポリイミド(厚さ25μm)基板、銅箔(厚さ12.5μm))
表面処理:5質量%硫酸処理
ラミネート条件:50℃、加圧50MPa、真空30秒/加圧30秒
DRY膜厚:25μm
露光:塗膜上に150mJ/cm2、USHIO(株)製投影露光装置(光源は高圧水銀灯)
現像:1質量%炭酸ナトリウム水溶液 温度30℃、スプレー圧0.2MPa、現像時間60秒
ポストキュア:150℃、60分
(1)ポットライフ
上記のように調製した感光性樹脂組成物を塗布基板であるPETフィルムに塗工して塗膜を形成後、塗布基板を予備乾燥してから25℃に放置した。25℃に放置した塗布基板を24時間毎に取り出し、評価基板である二層CCLにラミネート後、露光をせずに現像を行なった。現像開始から塗膜下地の銅箔が見えるまでの時間を計測した。現像開始から塗膜下地の銅箔が見えるまでの時間が30秒以内を○、現像開始から塗膜下地の銅箔が見えるまでの時間が30秒超を×と評価し、72時間放置以上で○評価を、合格とした。なお、表1には、○評価を維持できた最大放置時間を記載し、24時間放置にて×評価の場合には、「24時間×」と表記した。
塗布基板の塗膜上に感度測定用ステップタブレット(Stouffer 21段)を設置し、感度測定用ステップタブレットを通して、波長のメインピ−クが365nmの紫外線を、150mJ/cm2照射したものをテストピ−スとした。紫外線の照射光量は、オ−ク製作所(株)製の積算光量計を用いて測定した。紫外線を露光後、上記試験片作製工程に準じて現像を行い、露光部分の除去されない部分を数字(ステップ数)で表した。ステップ数が大きいほど感度が良好であることを示す。
上記試験片作製工程で得られた試験片を10質量%のHCl水溶液に常温で30分間浸漬し、浸漬後、十分に水洗を行ない、柔らかい布で水分を除去した。その後、塗膜表面を200倍の光学顕微鏡で観察して、塗膜の剥離(浮き)の状況を、下記3段階にて評価し、○評価を合格とした。
○:剥離(浮き)の発生無し
△:若干の剥離(浮き)有り
×:大きな剥離(浮き)有り
上記試験片作製工程で得られた試験片を10質量%のイソプロピルアルコール(IPA)水溶液に常温で30分間浸漬し、浸漬後、十分に水洗を行ない、柔らかい布で水分を除去した。その後、塗膜表面を200倍の光学顕微鏡で観察して、塗膜の剥離(浮き)の状況を、下記3段階にて評価し、○評価を合格とした。
○:剥離(浮き)の発生無し
△:若干の剥離(浮き)有り
×:大きな剥離(浮き)有り
Claims (9)
- 前記R1、R2、R3、R4、R5、R6、R7は、それぞれ、独立して、炭素数1〜5個の飽和脂肪族炭化水素基であることを特徴とする請求項1に記載の感光性樹脂組成物。
- 前記R1、R2、R3、R4、R5、R6、R7は、メチル基であることを特徴とする請求項1または2に記載の感光性樹脂組成物。
- 前記(A)カルボキシル基含有感光性樹脂100質量部に対し、前記(D)脂肪族系ウレア化合物が、10質量部以上30質量部以下含有することを特徴とする請求項1乃至3のいずれか1項に記載の感光性樹脂組成物。
- さらに、(E)反応性希釈剤を含有することを特徴とする請求項1乃至4のいずれか1項に記載の感光性樹脂組成物。
- さらに、メルカプトベンゾオキサザール及び/またはメルカプトベンゾオキサザール誘導体を含有することを特徴とする請求項1乃至5のいずれか1項に記載の感光性樹脂組成物。
- 請求項1乃至6のいずれか1項に記載の感光性樹脂組成物の光硬化物。
- 請求項1乃至6のいずれか1項に記載の感光性樹脂組成物を有するドライフィルム。
- 請求項7に記載の光硬化物を有するプリント配線板。
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