JP6798509B2 - 絶縁被覆導電粒子、異方導電性接着剤、及び接続構造体 - Google Patents
絶縁被覆導電粒子、異方導電性接着剤、及び接続構造体 Download PDFInfo
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- JP6798509B2 JP6798509B2 JP2017566931A JP2017566931A JP6798509B2 JP 6798509 B2 JP6798509 B2 JP 6798509B2 JP 2017566931 A JP2017566931 A JP 2017566931A JP 2017566931 A JP2017566931 A JP 2017566931A JP 6798509 B2 JP6798509 B2 JP 6798509B2
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- CALMYRPSSNRCFD-UHFFFAOYSA-J tetrachloroiridium Chemical compound Cl[Ir](Cl)(Cl)Cl CALMYRPSSNRCFD-UHFFFAOYSA-J 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
- SDVHRXOTTYYKRY-UHFFFAOYSA-J tetrasodium;dioxido-oxo-phosphonato-$l^{5}-phosphane Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)P([O-])([O-])=O SDVHRXOTTYYKRY-UHFFFAOYSA-J 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DANYXEHCMQHDNX-UHFFFAOYSA-K trichloroiridium Chemical compound Cl[Ir](Cl)Cl DANYXEHCMQHDNX-UHFFFAOYSA-K 0.000 description 1
- FOQJQXVUMYLJSU-UHFFFAOYSA-N triethoxy(1-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)C(C)[Si](OCC)(OCC)OCC FOQJQXVUMYLJSU-UHFFFAOYSA-N 0.000 description 1
- FZMJEGJVKFTGMU-UHFFFAOYSA-N triethoxy(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC FZMJEGJVKFTGMU-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- PHPGKIATZDCVHL-UHFFFAOYSA-N trimethyl(propoxy)silane Chemical compound CCCO[Si](C)(C)C PHPGKIATZDCVHL-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/12—Treatment with organosilicon compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016023927 | 2016-02-10 | ||
| JP2016023927 | 2016-02-10 | ||
| PCT/JP2017/004175 WO2017138483A1 (ja) | 2016-02-10 | 2017-02-06 | 絶縁被覆導電粒子、異方導電性接着剤、及び接続構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2017138483A1 JPWO2017138483A1 (ja) | 2018-12-20 |
| JP6798509B2 true JP6798509B2 (ja) | 2020-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017566931A Active JP6798509B2 (ja) | 2016-02-10 | 2017-02-06 | 絶縁被覆導電粒子、異方導電性接着剤、及び接続構造体 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6798509B2 (zh) |
| KR (1) | KR102649185B1 (zh) |
| CN (2) | CN113345624B (zh) |
| TW (1) | TWI722109B (zh) |
| WO (1) | WO2017138483A1 (zh) |
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| KR102180143B1 (ko) * | 2017-12-29 | 2020-11-17 | 국도화학 주식회사 | 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및／또는 이를 포함하는 반도체 장치 |
| KR20210083246A (ko) * | 2018-11-07 | 2021-07-06 | 니폰 가가쿠 고교 가부시키가이샤 | 피복 입자 및 그것을 함유하는 도전성 재료, 그리고 피복 입자의 제조 방법 |
| DE102019107633A1 (de) * | 2019-03-25 | 2020-10-29 | Sphera Technology Gmbh | Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems |
| KR102598343B1 (ko) * | 2020-10-06 | 2023-11-06 | 덕산네오룩스 주식회사 | 도전입자, 도전재료 및 접속 구조체 |
| WO2022075663A1 (ko) * | 2020-10-06 | 2022-04-14 | 덕산하이메탈(주) | 도전입자, 도전재료 및 접속 구조체 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE759730R (fr) | 1969-12-03 | 1971-05-17 | Ekco Instr Ltd | Appareil indicateur ou detecteur pour un rayonnement nucleaire,tel que des rayons |
| JP4563110B2 (ja) * | 2004-08-20 | 2010-10-13 | 積水化学工業株式会社 | 導電性微粒子の製造方法 |
| US20080070146A1 (en) * | 2006-09-15 | 2008-03-20 | Cabot Corporation | Hydrophobic-treated metal oxide |
| US8202502B2 (en) * | 2006-09-15 | 2012-06-19 | Cabot Corporation | Method of preparing hydrophobic silica |
| JP5644067B2 (ja) * | 2008-07-23 | 2014-12-24 | 日立化成株式会社 | 絶縁被覆導電粒子 |
| JP5899063B2 (ja) * | 2011-06-22 | 2016-04-06 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体 |
| US9150736B2 (en) * | 2012-11-27 | 2015-10-06 | Ppg Industries Ohio, Inc. | Methods of coating an electrically conductive substrate and related electrodepositable compositions |
| JP5926942B2 (ja) * | 2011-12-09 | 2016-05-25 | サカタインクス株式会社 | 非磁性静電荷像現像用トナーの製造方法 |
| KR102076066B1 (ko) * | 2012-07-03 | 2020-02-11 | 세키스이가가쿠 고교가부시키가이샤 | 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체 |
| JP6151990B2 (ja) * | 2012-07-03 | 2017-06-21 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 |
| JP5939063B2 (ja) * | 2012-07-11 | 2016-06-22 | 日立化成株式会社 | 絶縁被覆導電粒子及びそれを用いた異方導電性接着剤 |
| KR20140017213A (ko) | 2012-07-31 | 2014-02-11 | 건국대학교 산학협력단 | 카르도 구조를 갖는 황산화 고분자 전해질막 및 이를 포함하는 연료전지 |
| JP6318025B2 (ja) * | 2013-06-27 | 2018-04-25 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| JP6431411B2 (ja) * | 2014-03-10 | 2018-11-28 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 |
| JP6577723B2 (ja) * | 2014-03-10 | 2019-09-18 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 |
| JP6379761B2 (ja) * | 2014-07-09 | 2018-08-29 | 日立化成株式会社 | 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法 |
-
2017
- 2017-02-06 KR KR1020187025418A patent/KR102649185B1/ko active IP Right Grant
- 2017-02-06 CN CN202110756882.4A patent/CN113345624B/zh active Active
- 2017-02-06 WO PCT/JP2017/004175 patent/WO2017138483A1/ja active Application Filing
- 2017-02-06 JP JP2017566931A patent/JP6798509B2/ja active Active
- 2017-02-06 CN CN201780010665.2A patent/CN108604481A/zh active Pending
- 2017-02-10 TW TW106104320A patent/TWI722109B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI722109B (zh) | 2021-03-21 |
| KR102649185B1 (ko) | 2024-03-18 |
| JPWO2017138483A1 (ja) | 2018-12-20 |
| KR20180110019A (ko) | 2018-10-08 |
| WO2017138483A1 (ja) | 2017-08-17 |
| CN113345624B (zh) | 2023-05-12 |
| TW201803960A (zh) | 2018-02-01 |
| CN108604481A (zh) | 2018-09-28 |
| CN113345624A (zh) | 2021-09-03 |
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