KR102649185B1 - 절연 피복 도전 입자, 이방 도전성 접착제, 및 접속 구조체 - Google Patents

절연 피복 도전 입자, 이방 도전성 접착제, 및 접속 구조체 Download PDF

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KR102649185B1
KR102649185B1 KR1020187025418A KR20187025418A KR102649185B1 KR 102649185 B1 KR102649185 B1 KR 102649185B1 KR 1020187025418 A KR1020187025418 A KR 1020187025418A KR 20187025418 A KR20187025418 A KR 20187025418A KR 102649185 B1 KR102649185 B1 KR 102649185B1
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KR
South Korea
Prior art keywords
particles
insulating
conductive particles
conductive
layer
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KR1020187025418A
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Korean (ko)
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KR20180110019A (ko
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마사시 나카가와
구니히코 아카이
요시노리 에지리
쇼헤이 야마자키
야스시 와타나베
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가부시끼가이샤 레조낙
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/12—Treatment with organosilicon compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
KR1020187025418A 2016-02-10 2017-02-06 절연 피복 도전 입자, 이방 도전성 접착제, 및 접속 구조체 KR102649185B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-023927 2016-02-10
JP2016023927 2016-02-10
PCT/JP2017/004175 WO2017138483A1 (ja) 2016-02-10 2017-02-06 絶縁被覆導電粒子、異方導電性接着剤、及び接続構造体

Publications (2)

Publication Number Publication Date
KR20180110019A KR20180110019A (ko) 2018-10-08
KR102649185B1 true KR102649185B1 (ko) 2024-03-18

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KR1020187025418A KR102649185B1 (ko) 2016-02-10 2017-02-06 절연 피복 도전 입자, 이방 도전성 접착제, 및 접속 구조체

Country Status (5)

Country Link
JP (1) JP6798509B2 (zh)
KR (1) KR102649185B1 (zh)
CN (2) CN113345624B (zh)
TW (1) TWI722109B (zh)
WO (1) WO2017138483A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102180143B1 (ko) * 2017-12-29 2020-11-17 국도화학 주식회사 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및／또는 이를 포함하는 반도체 장치
KR20210083246A (ko) * 2018-11-07 2021-07-06 니폰 가가쿠 고교 가부시키가이샤 피복 입자 및 그것을 함유하는 도전성 재료, 그리고 피복 입자의 제조 방법
DE102019107633A1 (de) * 2019-03-25 2020-10-29 Sphera Technology Gmbh Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems
KR102598343B1 (ko) * 2020-10-06 2023-11-06 덕산네오룩스 주식회사 도전입자, 도전재료 및 접속 구조체
WO2022075663A1 (ko) * 2020-10-06 2022-04-14 덕산하이메탈(주) 도전입자, 도전재료 및 접속 구조체

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050086A (ja) * 2008-07-23 2010-03-04 Hitachi Chem Co Ltd 絶縁被覆導電粒子及びその製造方法
JP2014017213A (ja) * 2012-07-11 2014-01-30 Hitachi Chemical Co Ltd 絶縁被覆導電粒子及びそれを用いた異方導電性接着剤
JP2015187983A (ja) * 2014-03-10 2015-10-29 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE759730R (fr) 1969-12-03 1971-05-17 Ekco Instr Ltd Appareil indicateur ou detecteur pour un rayonnement nucleaire,tel que des rayons
JP4563110B2 (ja) * 2004-08-20 2010-10-13 積水化学工業株式会社 導電性微粒子の製造方法
US20080070146A1 (en) * 2006-09-15 2008-03-20 Cabot Corporation Hydrophobic-treated metal oxide
US8202502B2 (en) * 2006-09-15 2012-06-19 Cabot Corporation Method of preparing hydrophobic silica
JP5899063B2 (ja) * 2011-06-22 2016-04-06 積水化学工業株式会社 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体
US9150736B2 (en) * 2012-11-27 2015-10-06 Ppg Industries Ohio, Inc. Methods of coating an electrically conductive substrate and related electrodepositable compositions
JP5926942B2 (ja) * 2011-12-09 2016-05-25 サカタインクス株式会社 非磁性静電荷像現像用トナーの製造方法
KR102076066B1 (ko) * 2012-07-03 2020-02-11 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체
JP6151990B2 (ja) * 2012-07-03 2017-06-21 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
KR20140017213A (ko) 2012-07-31 2014-02-11 건국대학교 산학협력단 카르도 구조를 갖는 황산화 고분자 전해질막 및 이를 포함하는 연료전지
JP6318025B2 (ja) * 2013-06-27 2018-04-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6577723B2 (ja) * 2014-03-10 2019-09-18 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6379761B2 (ja) * 2014-07-09 2018-08-29 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050086A (ja) * 2008-07-23 2010-03-04 Hitachi Chem Co Ltd 絶縁被覆導電粒子及びその製造方法
JP2014017213A (ja) * 2012-07-11 2014-01-30 Hitachi Chemical Co Ltd 絶縁被覆導電粒子及びそれを用いた異方導電性接着剤
JP2015187983A (ja) * 2014-03-10 2015-10-29 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
TWI722109B (zh) 2021-03-21
JP6798509B2 (ja) 2020-12-09
JPWO2017138483A1 (ja) 2018-12-20
KR20180110019A (ko) 2018-10-08
WO2017138483A1 (ja) 2017-08-17
CN113345624B (zh) 2023-05-12
TW201803960A (zh) 2018-02-01
CN108604481A (zh) 2018-09-28
CN113345624A (zh) 2021-09-03

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