JP6794880B2 - 縦型熱処理装置及び縦型熱処理装置の運転方法 - Google Patents

縦型熱処理装置及び縦型熱処理装置の運転方法 Download PDF

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Publication number
JP6794880B2
JP6794880B2 JP2017047960A JP2017047960A JP6794880B2 JP 6794880 B2 JP6794880 B2 JP 6794880B2 JP 2017047960 A JP2017047960 A JP 2017047960A JP 2017047960 A JP2017047960 A JP 2017047960A JP 6794880 B2 JP6794880 B2 JP 6794880B2
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warp
substrate
wafer
heat treatment
cooling gas
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Japanese (ja)
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JP2018152472A (ja
Inventor
雄一 大岡
雄一 大岡
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2017047960A priority Critical patent/JP6794880B2/ja
Priority to KR1020180029290A priority patent/KR102230545B1/ko
Priority to CN201810207976.4A priority patent/CN108573902B/zh
Publication of JP2018152472A publication Critical patent/JP2018152472A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
JP2017047960A 2017-03-14 2017-03-14 縦型熱処理装置及び縦型熱処理装置の運転方法 Active JP6794880B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017047960A JP6794880B2 (ja) 2017-03-14 2017-03-14 縦型熱処理装置及び縦型熱処理装置の運転方法
KR1020180029290A KR102230545B1 (ko) 2017-03-14 2018-03-13 종형 열처리 장치 및 종형 열처리 장치의 운전 방법
CN201810207976.4A CN108573902B (zh) 2017-03-14 2018-03-14 纵式热处理装置和纵式热处理装置的运转方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017047960A JP6794880B2 (ja) 2017-03-14 2017-03-14 縦型熱処理装置及び縦型熱処理装置の運転方法

Publications (2)

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JP2018152472A JP2018152472A (ja) 2018-09-27
JP6794880B2 true JP6794880B2 (ja) 2020-12-02

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JP (1) JP6794880B2 (ko)
KR (1) KR102230545B1 (ko)
CN (1) CN108573902B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110416110A (zh) * 2018-04-28 2019-11-05 北京北方华创微电子装备有限公司 Sog片预处理方法、sog片传输方法、系统及翘曲度检测装置
CN111377075A (zh) * 2018-12-27 2020-07-07 上海仪电显示材料有限公司 装箱装置及其工作方法
KR102282148B1 (ko) * 2019-07-02 2021-07-28 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
CN110277327B (zh) * 2019-07-22 2024-03-22 深圳市艾特自动化有限公司 一种在线式石墨舟中硅片的检测系统及检测方法
CN111180378B (zh) * 2019-12-31 2023-12-29 中芯集成电路（宁波）有限公司 一种检测晶舟内晶圆斜插的方法及装置
JP7285276B2 (ja) * 2021-03-25 2023-06-01 株式会社Kokusai Electric 冷却方法及び半導体装置の製造方法及び処理装置
CN115125619B (zh) * 2022-07-12 2023-07-04 季华实验室 一种外延片的冷却系统、方法、电子设备及存储介质

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JPH10250236A (ja) 1996-09-30 1998-09-22 Oji Paper Co Ltd 感熱記録体
JP4259942B2 (ja) * 2003-07-31 2009-04-30 株式会社日立国際電気 基板処理装置
JP2005142245A (ja) * 2003-11-05 2005-06-02 Hitachi Kokusai Electric Inc 基板処理装置
JP4516318B2 (ja) * 2004-01-05 2010-08-04 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
WO2006025386A1 (ja) * 2004-08-31 2006-03-09 Nikon Corporation 位置合わせ方法、処理システム、基板の投入再現性計測方法、位置計測方法、露光方法、基板処理装置、計測方法及び計測装置
JP2009200063A (ja) * 2006-05-22 2009-09-03 Tokyo Electron Ltd 基板の変形検出機構，処理システム，基板の変形検出方法及び記録媒体
JP2008277777A (ja) * 2007-04-02 2008-11-13 Hitachi Kokusai Electric Inc 半導体装置の製造方法
CN101740432B (zh) * 2008-11-27 2012-01-25 中芯国际集成电路制造(上海)有限公司 半导体器件的制造方法
JP5545055B2 (ja) * 2010-06-15 2014-07-09 東京エレクトロン株式会社 支持体構造及び処理装置
JP6185722B2 (ja) * 2012-03-08 2017-08-23 株式会社日立国際電気 基板処理装置、基板移載方法及び半導体装置の製造方法並びに状態検知プログラム
JP5953951B2 (ja) * 2012-06-05 2016-07-20 東京エレクトロン株式会社 縦型熱処理装置及び縦型熱処理装置の運転方法
JP6016542B2 (ja) * 2012-09-13 2016-10-26 株式会社日立国際電気 反応管、基板処理装置、及び半導体装置の製造方法
US9574875B2 (en) * 2014-01-21 2017-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer or reticle thermal deformation measuring techniques
WO2016017685A1 (ja) * 2014-07-30 2016-02-04 株式会社日立国際電気 基板処理装置、基板搬送方法及び半導体装置の製造方法並びに記録媒体
JP6394220B2 (ja) * 2014-09-17 2018-09-26 東京エレクトロン株式会社 アライメント装置及び基板処理装置
CN105336637A (zh) * 2015-09-24 2016-02-17 武汉新芯集成电路制造有限公司 量测晶圆变形的方法

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Publication number Publication date
JP2018152472A (ja) 2018-09-27
CN108573902B (zh) 2023-09-29
KR102230545B1 (ko) 2021-03-19
KR20180105086A (ko) 2018-09-27
CN108573902A (zh) 2018-09-25

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