JP6793048B2 - 基板処理装置、ダミーディスペンス方法及びコンピュータ読み取り可能な記録媒体 - Google Patents

基板処理装置、ダミーディスペンス方法及びコンピュータ読み取り可能な記録媒体 Download PDF

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Publication number
JP6793048B2
JP6793048B2 JP2017013274A JP2017013274A JP6793048B2 JP 6793048 B2 JP6793048 B2 JP 6793048B2 JP 2017013274 A JP2017013274 A JP 2017013274A JP 2017013274 A JP2017013274 A JP 2017013274A JP 6793048 B2 JP6793048 B2 JP 6793048B2
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Japan
Prior art keywords
nozzle
cleaning liquid
region
rotation holding
holding portion
Prior art date
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JP2017013274A
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English (en)
Japanese (ja)
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JP2018121024A (ja
Inventor
稔 久保田
稔 久保田
晋一郎 山中
晋一郎 山中
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Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2017013274A priority Critical patent/JP6793048B2/ja
Priority to KR1020180008669A priority patent/KR102261616B1/ko
Priority to CN201810076767.0A priority patent/CN108355869B/zh
Publication of JP2018121024A publication Critical patent/JP2018121024A/ja
Application granted granted Critical
Publication of JP6793048B2 publication Critical patent/JP6793048B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B05B13/0228—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the movement of the objects being rotative
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/32—Shielding elements, i.e. elements preventing overspray from reaching areas other than the object to be sprayed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2017013274A 2017-01-27 2017-01-27 基板処理装置、ダミーディスペンス方法及びコンピュータ読み取り可能な記録媒体 Active JP6793048B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017013274A JP6793048B2 (ja) 2017-01-27 2017-01-27 基板処理装置、ダミーディスペンス方法及びコンピュータ読み取り可能な記録媒体
KR1020180008669A KR102261616B1 (ko) 2017-01-27 2018-01-24 기판 처리 장치, 더미 디스펜스 방법 및 컴퓨터 판독 가능한 기록 매체
CN201810076767.0A CN108355869B (zh) 2017-01-27 2018-01-26 基板处理装置、模拟分配方法和计算机可读取记录介质

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017013274A JP6793048B2 (ja) 2017-01-27 2017-01-27 基板処理装置、ダミーディスペンス方法及びコンピュータ読み取り可能な記録媒体

Publications (2)

Publication Number Publication Date
JP2018121024A JP2018121024A (ja) 2018-08-02
JP6793048B2 true JP6793048B2 (ja) 2020-12-02

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JP2017013274A Active JP6793048B2 (ja) 2017-01-27 2017-01-27 基板処理装置、ダミーディスペンス方法及びコンピュータ読み取り可能な記録媒体

Country Status (3)

Country Link
JP (1) JP6793048B2 (ko)
KR (1) KR102261616B1 (ko)
CN (1) CN108355869B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7203685B2 (ja) 2019-05-27 2023-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法およびプログラム
KR102666439B1 (ko) 2020-04-08 2024-05-17 세메스 주식회사 노즐 장치 및 기판 처리 장치
KR20230043947A (ko) * 2020-10-23 2023-03-31 가부시키가이샤 사무코 매엽식 웨이퍼 세정 장치의 배관의 세정 방법
CN112768377B (zh) * 2020-12-31 2022-08-12 上海至纯洁净系统科技股份有限公司 一种有效解决晶圆干燥颗粒数干燥后二次污染的结构

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3625752B2 (ja) * 1999-08-17 2005-03-02 東京エレクトロン株式会社 液処理装置
JP4324527B2 (ja) * 2004-09-09 2009-09-02 東京エレクトロン株式会社 基板洗浄方法及び現像装置
JP4924467B2 (ja) * 2008-02-22 2012-04-25 東京エレクトロン株式会社 処理装置及び洗浄方法並びに記憶媒体
JP3155940U (ja) * 2009-09-25 2009-12-10 東京エレクトロン株式会社 ノズル待機ボックス
JP5220839B2 (ja) * 2010-12-28 2013-06-26 東京エレクトロン株式会社 液処理装置および液処理方法
JP5220838B2 (ja) * 2010-12-28 2013-06-26 東京エレクトロン株式会社 液処理装置および液処理方法
JP6051858B2 (ja) * 2012-12-28 2016-12-27 東京エレクトロン株式会社 基板処理装置
JP2015179728A (ja) * 2014-03-19 2015-10-08 東京エレクトロン株式会社 流路切替装置、液供給システム、液供給方法及びコンピュータ読み取り可能な記録媒体
JP6230455B2 (ja) * 2014-03-19 2017-11-15 株式会社東芝 半導体装置
JP6316703B2 (ja) 2014-08-19 2018-04-25 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6331961B2 (ja) * 2014-10-22 2018-05-30 東京エレクトロン株式会社 基板液処理装置

Also Published As

Publication number Publication date
CN108355869B (zh) 2021-06-29
JP2018121024A (ja) 2018-08-02
KR20180088588A (ko) 2018-08-06
CN108355869A (zh) 2018-08-03
KR102261616B1 (ko) 2021-06-04

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