JP6792700B2 - 加工検査対象物の加熱剥離方法 - Google Patents

加工検査対象物の加熱剥離方法 Download PDF

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Publication number
JP6792700B2
JP6792700B2 JP2019509574A JP2019509574A JP6792700B2 JP 6792700 B2 JP6792700 B2 JP 6792700B2 JP 2019509574 A JP2019509574 A JP 2019509574A JP 2019509574 A JP2019509574 A JP 2019509574A JP 6792700 B2 JP6792700 B2 JP 6792700B2
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Japan
Prior art keywords
pressure
sensitive adhesive
heat
adhesive layer
adhesive sheet
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JP2019509574A
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Japanese (ja)
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JPWO2019031533A1 (ja
Inventor
高志 阿久津
高志 阿久津
岡本　直也
直也 岡本
中山　武人
武人 中山
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Lintec Corp
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Lintec Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
JP2019509574A 2017-08-09 2018-08-08 加工検査対象物の加熱剥離方法 Active JP6792700B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017154372 2017-08-09
JP2017154372 2017-08-09
PCT/JP2018/029699 WO2019031533A1 (ja) 2017-08-09 2018-08-08 加工検査対象物の加熱剥離方法

Publications (2)

Publication Number Publication Date
JPWO2019031533A1 JPWO2019031533A1 (ja) 2020-07-02
JP6792700B2 true JP6792700B2 (ja) 2020-11-25

Family

ID=65272126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019509574A Active JP6792700B2 (ja) 2017-08-09 2018-08-08 加工検査対象物の加熱剥離方法

Country Status (5)

Country Link
JP (1) JP6792700B2 (zh)
KR (1) KR102526158B1 (zh)
CN (1) CN110998799A (zh)
TW (1) TWI783021B (zh)
WO (1) WO2019031533A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210141929A (ko) * 2019-03-15 2021-11-23 린텍 가부시키가이샤 점착 시트 및 반도체 장치의 제조 방법
CN113966372A (zh) * 2019-06-03 2022-01-21 三井化学东赛璐株式会社 电子装置的制造方法
CN112864027A (zh) * 2021-01-12 2021-05-28 浙江荷清柔性电子技术有限公司 一种扇出型板级封装方法及其结构
CN117795027A (zh) * 2021-08-13 2024-03-29 琳得科株式会社 粘合片的膨胀方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594853B2 (ja) 1981-02-23 1984-02-01 株式会社日立製作所 半導体装置
JP3961672B2 (ja) * 1998-06-12 2007-08-22 リンテック株式会社 樹脂封止チップ体の製造方法
JP2000248240A (ja) * 1999-03-01 2000-09-12 Nitto Denko Corp 加熱剥離型粘着シート
JP3594853B2 (ja) 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
JP3979772B2 (ja) * 2000-08-18 2007-09-19 リンテック株式会社 チップ状部品の剥離方法
JP2002322436A (ja) * 2001-04-25 2002-11-08 Nitto Denko Corp 被着物の加熱剥離方法及び被着物加熱剥離装置
JP4877689B2 (ja) * 2001-08-30 2012-02-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP4704017B2 (ja) * 2004-12-09 2011-06-15 日東電工株式会社 被着物の加熱剥離方法及び被着物加熱剥離装置
TWI402325B (zh) * 2005-05-12 2013-07-21 Nitto Denko Corp 切割用黏著片以及使用此黏著片的切割方法
JP5283838B2 (ja) * 2006-11-04 2013-09-04 日東電工株式会社 熱剥離性粘着シート及び被着体回収方法
JP5456431B2 (ja) * 2009-10-20 2014-03-26 日東電工株式会社 加熱剥離型粘着シート
JP5950561B2 (ja) * 2011-12-13 2016-07-13 株式会社ディスコ 発光素子パッケージ基板の加工方法
JP6120123B2 (ja) * 2014-11-13 2017-04-26 Dic株式会社 両面粘着テープ、物品及び分離方法

Also Published As

Publication number Publication date
TW201923861A (zh) 2019-06-16
CN110998799A (zh) 2020-04-10
JPWO2019031533A1 (ja) 2020-07-02
KR102526158B1 (ko) 2023-04-26
WO2019031533A1 (ja) 2019-02-14
KR20200035962A (ko) 2020-04-06
TWI783021B (zh) 2022-11-11

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