JP6791474B2 - プリント回路基板 - Google Patents
プリント回路基板 Download PDFInfo
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- JP6791474B2 JP6791474B2 JP2016064662A JP2016064662A JP6791474B2 JP 6791474 B2 JP6791474 B2 JP 6791474B2 JP 2016064662 A JP2016064662 A JP 2016064662A JP 2016064662 A JP2016064662 A JP 2016064662A JP 6791474 B2 JP6791474 B2 JP 6791474B2
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- Japan
- Prior art keywords
- insulating layer
- circuit
- reinforcing material
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000012779 reinforcing material Substances 0.000 claims description 60
- 230000003014 reinforcing effect Effects 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 4
- 239000003351 stiffener Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 35
- 239000010949 copper Substances 0.000 description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 18
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 238000007747 plating Methods 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 239000003365 glass fiber Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
図1は本発明の一実施例に係るプリント回路基板を示す図である。
図2から図9は、本発明の一実施例に係るプリント回路基板の製造方法を示す図である。
100 ビルドアップ絶縁層
110 第1絶縁層
111 第1回路
120 第2絶縁層
121 第2回路
122 開口部
130 補強材
140 ビア
M マスク
Claims (12)
- 少なくとも一部の第1回路が埋め込まれた第1絶縁層と、
前記第1絶縁層上に形成され、少なくとも一部の第2回路が埋め込まれた第2絶縁層と、
前記第1絶縁層及び前記第2絶縁層に含浸された補強材と、を含み、
前記補強材は、前記第2回路の側部に位置し、
前記第2回路の厚さは、前記第2絶縁層の厚さと同じである、
プリント回路基板。 - 前記補強材は、前記第2回路を貫通する請求項1に記載のプリント回路基板。
- 前記補強材は、前記第2回路の一側面を貫通する請求項1または請求項2に記載のプリント回路基板。
- 前記第2絶縁層は、感光性である請求項1から請求項3のいずれか1項に記載のプリント回路基板。
- 前記第1絶縁層を貫通して前記第1回路及び前記第2回路を電気的に接続させるビアをさらに含む請求項1から請求項4のいずれか1項に記載のプリント回路基板。
- 前記ビアは、前記補強材を貫通する請求項5に記載のプリント回路基板。
- 前記補強材の熱膨張係数は、前記第2回路の熱膨張係数より小さい請求項1から請求項6のいずれか1項に記載のプリント回路基板。
- 前記補強材の一部は、前記第1絶縁層内に配置され、
前記補強材の残りは、前記第2絶縁層内に配置される請求項1から請求項7のいずれか1項に記載のプリント回路基板。 - 前記第1回路の一面は、前記第1絶縁層に対して露出され、
前記第2回路の両面は、前記第2絶縁層に対して露出される請求項1から請求項8のいずれか1項に記載のプリント回路基板。 - 絶縁層と、
前記絶縁層に少なくとも一部が埋め込まれた回路と、
少なくとも一部が前記回路の側部に配置されるように、前記絶縁層内に形成された補強材と、を含み、
前記補強材は、前記回路の少なくとも一部を貫通する、
プリント回路基板。 - 前記補強材は、前記回路の一側面を貫通する請求項10に記載のプリント回路基板。
- 前記補強材の熱膨張係数は、前記回路の熱膨張係数より小さい請求項10又は請求項11に記載のプリント回路基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2015-0152365 | 2015-10-30 | ||
KR1020150152365A KR20170050606A (ko) | 2015-10-30 | 2015-10-30 | 인쇄회로기판 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017085075A JP2017085075A (ja) | 2017-05-18 |
JP6791474B2 true JP6791474B2 (ja) | 2020-11-25 |
Family
ID=58712028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016064662A Active JP6791474B2 (ja) | 2015-10-30 | 2016-03-28 | プリント回路基板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6791474B2 (ja) |
KR (1) | KR20170050606A (ja) |
-
2015
- 2015-10-30 KR KR1020150152365A patent/KR20170050606A/ko unknown
-
2016
- 2016-03-28 JP JP2016064662A patent/JP6791474B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017085075A (ja) | 2017-05-18 |
KR20170050606A (ko) | 2017-05-11 |
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