JP6789859B2 - 電子部品実装システム - Google Patents

電子部品実装システム Download PDF

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Publication number
JP6789859B2
JP6789859B2 JP2017048775A JP2017048775A JP6789859B2 JP 6789859 B2 JP6789859 B2 JP 6789859B2 JP 2017048775 A JP2017048775 A JP 2017048775A JP 2017048775 A JP2017048775 A JP 2017048775A JP 6789859 B2 JP6789859 B2 JP 6789859B2
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Japan
Prior art keywords
electronic component
substrate
component mounting
solder
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2017048775A
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English (en)
Japanese (ja)
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JP2018152502A (ja
Inventor
秀典 太田
秀典 太田
Original Assignee
ハンファ精密機械株式会社
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Publication date
Application filed by ハンファ精密機械株式会社 filed Critical ハンファ精密機械株式会社
Priority to JP2017048775A priority Critical patent/JP6789859B2/ja
Priority to KR1020170085921A priority patent/KR101994293B1/ko
Publication of JP2018152502A publication Critical patent/JP2018152502A/ja
Application granted granted Critical
Publication of JP6789859B2 publication Critical patent/JP6789859B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2017048775A 2017-03-14 2017-03-14 電子部品実装システム Active JP6789859B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017048775A JP6789859B2 (ja) 2017-03-14 2017-03-14 電子部品実装システム
KR1020170085921A KR101994293B1 (ko) 2017-03-14 2017-07-06 전자 부품 실장 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017048775A JP6789859B2 (ja) 2017-03-14 2017-03-14 電子部品実装システム

Publications (2)

Publication Number Publication Date
JP2018152502A JP2018152502A (ja) 2018-09-27
JP6789859B2 true JP6789859B2 (ja) 2020-11-25

Family

ID=63681794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017048775A Active JP6789859B2 (ja) 2017-03-14 2017-03-14 電子部品実装システム

Country Status (2)

Country Link
JP (1) JP6789859B2 (ko)
KR (1) KR101994293B1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020191447A (ja) * 2019-05-20 2020-11-26 シークス株式会社 電子部品実装方法及び電子部品実装システム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163449A (ja) * 2001-11-27 2003-06-06 Alps Electric Co Ltd チップ部品の実装方法
JP3873757B2 (ja) * 2002-02-05 2007-01-24 松下電器産業株式会社 電子部品実装システムおよび電子部品実装方法
JP4289381B2 (ja) * 2006-09-05 2009-07-01 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
JP2009094283A (ja) * 2007-10-09 2009-04-30 Yamaha Motor Co Ltd 実装基板の生産方法、表面実装機及び実装基板生産管理装置
JP2010177253A (ja) * 2009-01-27 2010-08-12 Shinko Electric Ind Co Ltd はんだボール搭載方法
JP5573767B2 (ja) * 2011-05-09 2014-08-20 パナソニック株式会社 電子部品実装システムおよび電子部品実装システムにおける実装基板の製造方法

Also Published As

Publication number Publication date
KR20180105033A (ko) 2018-09-27
JP2018152502A (ja) 2018-09-27
KR101994293B1 (ko) 2019-06-28

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