JP6789859B2 - Electronic component mounting system - Google Patents

Description

The present invention relates to an electronic component mounting system for manufacturing a mounting board by mounting electronic components on a substrate by solder bonding.

Such an electronic component mounting system includes a printing device that prints solder on an electrode for joining electronic components formed on a substrate, and an electronic component mounting device that mounts electronic components on a substrate on which solder is printed. In the device and the device for mounting electronic components, solder is printed or electronic components are mounted based on the electrode position of the substrate. However, conventionally, in the electronic component mounting system, the electrode position is not measured before solder printing, and the design electrode position common to the substrate type is used as a reference.

However, this design electrode position is not accurate with respect to the actual substrate because it was not obtained by actually measuring the actual substrate. That is, in reality, there are variations due to slight manufacturing errors for each substrate, and the exact positions of the electrodes are slightly different for each substrate. Further, the substrate may expand and contract significantly depending on the storage conditions of the substrate, which also causes an error between the electrode position on the actual substrate and the design electrode position. As a result, especially when mounting fine parts with high precision, the error between the electrode position on the actual substrate and the design electrode position becomes a size that cannot be ignored, and as a result, the mounting quality deteriorates and mounting defects occur. I was inviting.

An object to be solved by the present invention is to provide an electronic component mounting system capable of suppressing deterioration of mounting quality and occurrence of mounting defects.

According to one aspect of the present invention, the following electronic component mounting system is provided.
"It is an electronic component mounting system that manufactures a mounting board by mounting electronic components on a board by solder bonding.
A printing device for printing solder on an electrode for joining electronic components formed on the substrate and an electronic component mounting device for mounting electronic components on the substrate on which the solder is printed are provided.
The printing device and / or the electronic component mounting device prints solder and / or prints solder based on the position correction data of the electrode obtained from the expansion / contraction state of the substrate predicted from the measured position data of the electrode and the management information of the board. Alternatively, an electronic component mounting system characterized by mounting electronic components. "

According to the present invention, the electrode position correction data obtained from the expansion / contraction state of the substrate predicted from the measured electrode position data and the substrate management information is used as a reference for printing the solder or mounting the electronic component. Solder printing and mounting of electronic components can be performed accurately, and deterioration of mounting quality and occurrence of mounting defects can be suppressed.

It is a system block diagram which shows the electronic component mounting system of one Embodiment of this invention.

FIG. 1 is a system configuration diagram showing an electronic component mounting system according to an embodiment of the present invention. In FIG. 1, the electronic component mounting system is composed of a printing device 1, a printing inspection device 2, an electronic component mounting device 3, a mounting state inspection device 4, a reflow device 5, and a mounting state inspection device 6 connected to each other. Is connected by the communication network 7, and the whole is controlled by the management computer 8.

Hereinafter, an electronic component mounting method using the electronic component mounting system of this embodiment will be described.

In the present embodiment, the positions of the electrodes on the substrate are measured in advance outside the electronic component mounting system, and the electrode position data is acquired. The position data of the electrodes can be acquired as xy coordinate values of each electrode based on, for example, a reference mark formed on the substrate, and the position data of the electrodes can be obtained for the printing device 1 and the electronic component mounting device 3. It is provided directly or via the management computer 8.

Further, in the present embodiment, the expansion / contraction state of the substrate is predicted from the management information of the substrate, and the electrode position correction data for correcting the actually measured electrode position is obtained based on the expansion / contraction state of the substrate. That is, for example, the substrate may expand and contract depending on the storage state and transportation state of the substrate after the substrate is produced by the substrate manufacturer and the positions of the electrodes of the substrate are measured. Is predicted, and based on the expansion and contraction state of the substrate, the electrode position correction data for correcting the actually measured electrode position is obtained. The board management information used to predict the expansion and contraction state of the board includes the board production information such as the production date and time, and the board storage / transportation information such as temperature and humidity. For example, it is provided by the board manufacturer. The expansion and contraction state of the substrate can be predicted by calculation based on the production information of the substrate and the storage / transportation information of the substrate. It is also possible to predict the expansion / contraction state of the substrate by associating the expansion / contraction state of the substrate obtained by experimentally changing various storage / transportation states with the actual storage / transportation state. Further, the expansion / contraction state of the board is predicted by associating the management information of the board provided in the past with the measured value of the actual board obtained by the print inspection device 2 and the mounting state inspection device 6 in the electronic component mounting system. You can also do it. In any case, in the present embodiment, the expansion / contraction state of the substrate is predicted from the management information of the substrate, and the electrode position correction data for correcting the actually measured electrode position is obtained based on the expansion / contraction state of the substrate. The position correction data of the electrodes is provided to the printing device 1 and the electronic component mounting device 3 directly or via the management computer 8.

In the present embodiment, the printing apparatus 1 prints solder on the electrodes for joining electronic components formed on the substrate by screen printing using a screen mask. Specifically, the printing apparatus 1 executes screen printing using a screen corresponding to the group to which the substrate to be actually printed with solder (hereinafter referred to as “real substrate”) belongs.

More specifically, the substrates are grouped in advance based on the above-mentioned electrode position data and electrode position correction data, for example, according to the similarity of the electrode position distribution. At the same time, prepare an appropriate screen mask for each group. That is, as conceptually shown in FIG. 1, the substrates are grouped into a plurality of groups A, B, C ..., and screen masks A, B, C ... optimized for each group are prepared. Keep it.

Then, the printing device 1 executes screen printing using the screen mask corresponding to the group to which the actual substrate belongs. That is, in the printing apparatus 1, screen printing is executed by selecting an appropriate screen mask for each actual substrate based on the group information to which the substrate belongs (hereinafter referred to as “board belonging group information”).

This board affiliation group information is transmitted to the printing device 1 directly or via the management computer 8, and is referred to as the actual board from the identification number, the barcode, the processing order on the electronic component mounting system, etc. printed on the board. One-on-one correspondence is possible. In addition, the above-mentioned electrode position data and electrode position correction data can also be dealt with one-to-one with the actual board from the identification number, barcode, processing order on the electronic component mounting system, etc. printed on the board. is there.

The printing device 1 or the management computer 8 may additionally have a function of automatically selecting a screen mask corresponding to the group to which the actual board belongs based on the board belonging group information. As shown conceptually in FIG. 1, this function can be realized if there is data on the correspondence between the substrate group and the screen mask and the substrate affiliation group information. The data of the correspondence between the board group and the screen mask can be included in the board affiliation group information.

Further, the printing device 1 or the management computer 8 has a function of confirming whether or not an appropriate screen mask corresponding to the group to which the actual board belongs is attached to the printing device 1, and a function of issuing a warning when it is not appropriate. Can be prepared. These functions can be realized if there is a means for identifying the screen mask actually attached to the printing device 1.

Returning to FIG. 1, the print inspection device 2 inspects the printed state on the substrate after solder printing. Then, the electronic component mounting device 3 acquires the above-mentioned electrode position data and electrode position correction data directly or via the management computer 8, and solders based on the electrode position data and the electrode position correction data. The electronic components are mounted on the board on which is printed.

In the present embodiment, the electronic component mounting device 3 includes a mounting head, and the mounting head picks up the electronic component from the supply unit of the electronic component and mounts it on the board on which the solder is printed. At this time, the electronic component mounting device 3 corrects the positional deviation between each electrode position on the actual substrate and each design electrode position obtained from the actually measured position data of each electrode and the position correction data of each electrode. , Adjust the relative position of the mounting head with respect to the board. That is, the electronic component mounting device 3 performs feedforward processing for correcting the numerical data representing the positional deviation. In the electronic component mounting device 3 of the present embodiment, one electronic component can be mounted by the mounting head. Therefore, the numerical data representing the positional deviation is obtained for each electronic component to be mounted, and the positional deviation is represented for each electronic component. Feedforward processing can be performed to correct the numerical data.

Next, the mounting state inspection device 4 inspects the presence or absence of electronic components and the positional deviation on the substrate after mounting the electronic components. The reflow device 5 heats the substrate after mounting the electronic components and solder-bonds the electronic components to the substrate. Then, the mounting state inspection device 6 inspects the mounting state of the electronic components on the substrate after the solder bonding. The mounting board is manufactured as described above.

As described above, in the present embodiment, the electrode position data actually measured and the electrode position correction data obtained from the expansion / contraction state of the substrate predicted from the substrate management information are used as the reference for printing the solder and mounting the electronic components. Therefore, solder printing and mounting of electronic components can be performed accurately, and deterioration of mounting quality and occurrence of mounting defects can be suppressed.

Further, in the present embodiment, the substrates can be grouped based on the electrode position data and the electrode position correction data described above, and an appropriate (highly compatible) screen mask can be selected for each group of the substrates. , The printing quality of solder by screen printing can be improved as compared with the prior art. In addition, by increasing the number of grouping groups and increasing the variation (type) of screen masks, it becomes possible to select screen masks with higher compatibility, improving print quality and increasing the number of boards that can be supported. Yield also increases.

In the present embodiment, the above-mentioned electrode position data and electrode position correction data are provided to both the printing device and the electronic component mounting device, but may be provided to only one of them. However, from the viewpoint of more reliably suppressing the deterioration of mounting quality and the occurrence of mounting defects, it is preferable to provide the electrode position data and the electrode position correction data to both the printing device and the electronic component mounting device.

Further, in the present embodiment, the position data of the electrodes is acquired in advance outside the electronic component mounting system (the substrate manufacturing process which is the pre-process of the electronic component mounting system), and this is transmitted to the electronic component mounting system. The position data of can also be acquired in the electronic component mounting system. That is, a device (electrode position measuring device) for measuring the electrode position of the substrate can be installed upstream of the printing device 1 in the electronic component mounting system. In this case, the management information of the substrate used for predicting the expansion / contraction state of the substrate includes storage / transportation (transfer) information of the substrate from the electrode position measuring device to the printing device 1 or the electronic component mounting device 3. Can be mentioned.

Further, in the present embodiment, a screen printing device that performs screen printing using a screen mask is used as the printing device 1, but the present invention is not limited to the screen printing device, and for example, a coating printing device including a coating head can also be used. In this case, as in the case of the electronic component mounting device 3 provided with the mounting head described above, each electrode position on the actual substrate and each electrode in design obtained from the actually measured position data of each electrode and the position correction data of each electrode. The relative position of the coating head with respect to the substrate is adjusted so as to correct the positional deviation from the position. That is, the coating printing apparatus performs feedforward processing for correcting the numerical data representing the positional deviation.

1 Printing device 2 Printing inspection device 3 Electronic component mounting device 4 Mounting status inspection device 5 Reflow device 6 Mounting status inspection device 7 Communication network 8 Management computer

Claims (3)

An electronic component mounting system that manufactures a mounting board by mounting electronic components on a board by solder bonding.
A printing device for printing solder on an electrode for joining electronic components formed on the substrate and an electronic component mounting device for mounting electronic components on the substrate on which the solder is printed are provided.
The printing device and / or the electronic component mounting device prints solder and / or prints solder based on the position correction data of the electrode obtained from the expansion / contraction state of the substrate predicted from the measured position data of the electrode and the management information of the board. Alternatively, an electronic component mounting system characterized by mounting electronic components. The printing device is a screen printing device that performs screen printing using a screen mask.
It has a function of grouping substrates based on the actually measured position data of the electrodes and the position correction data of the electrodes, and also has a screen mask corresponding to the group of the substrates.
The electronic component mounting system according to claim 1, wherein the screen printing device performs screen printing using a screen mask corresponding to the group to which the substrate belongs. The electronic component mounting system according to claim 1 or 2, wherein the position data of the electrodes is acquired in advance outside the electronic component mounting system and transmitted to the printing device and / or the electronic component mounting device.

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