JP6781047B2 - 高いアライメント精度でレンズをledモジュールに取り付ける方法 - Google Patents
高いアライメント精度でレンズをledモジュールに取り付ける方法 Download PDFInfo
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- JP6781047B2 JP6781047B2 JP2016567974A JP2016567974A JP6781047B2 JP 6781047 B2 JP6781047 B2 JP 6781047B2 JP 2016567974 A JP2016567974 A JP 2016567974A JP 2016567974 A JP2016567974 A JP 2016567974A JP 6781047 B2 JP6781047 B2 JP 6781047B2
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- light emitting
- lens
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- emitting element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Description
Claims (12)
- サブストレート上に発光素子を提供するステップと、
前記サブストレート上で接着剤を使用して前記発光素子の周囲を部分的に取り囲むステップであり、前記周囲においてギャップを残している、ステップと、
レンズを前記サブストレートに対して前記接着剤を使用して取り付けるステップであり、前記レンズは、前記発光素子を包含する空洞を有しており、前記接着剤における前記ギャップにより、前記空洞から空気を逃がすことができる、ステップと、
前記発光素子に関して前記レンズのその後の移動を防ぐように、前記接着剤を半キュアするステップと、
を含み、さらに、
前記接着剤を半キュアするステップの後で、前記接着剤が半キュアの状態の間に、シール材料を使用して前記ギャップをシールするステップ、
を含む、方法。 - 前記方法は、
前記ギャップをシールするステップの後で、前記接着剤を完全にキュアリングするステップ、を含む、
請求項1に記載の方法。 - 前記レンズは、前記レンズを前記サブストレート上で前記発光素子に関して整列させる少なくとも一つの機構を含む、
請求項1に記載の方法。 - 前記サブストレートは、前記レンズを前記サブストレートに関して整列させる少なくとも一つの機構を含む、
請求項1に記載の方法。 - 前記サブストレートは、前記サブストレートを別のサブストレートに関して整列させる少なくとも一つの機構を含む、
請求項1に記載の方法。 - 前記レンズは、前記発光素子からの発光の方向を変更するようにパターン化されている、
請求項1に記載の方法。 - 前記レンズの外表面は、前記発光素子からの発光の方向を変更するようにパターン化されている、
請求項6に記載の方法。 - 前記レンズの前記空洞を画定している1つまたはそれ以上の内表面は、前記発光素子からの発光の方向を変更するようにパターン化されている、
請求項6に記載の方法。 - 前記レンズは、波長変換材料を含んでいる、
請求項1に記載の方法。 - 波長変換材料が、前記レンズの前記空洞の中に置かれている、
請求項1に記載の方法。 - 前記接着剤は、紫外線硬化型接着剤である、
請求項1に記載の方法。 - 前記接着剤と前記シール材料は、同一の材料を含んでいる、
請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462001091P | 2014-05-21 | 2014-05-21 | |
US62/001,091 | 2014-05-21 | ||
PCT/IB2015/053475 WO2015177679A1 (en) | 2014-05-21 | 2015-05-12 | Method of attaching a lens to an led module with high alignment accuracy |
Publications (3)
Publication Number | Publication Date |
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JP2017516314A JP2017516314A (ja) | 2017-06-15 |
JP2017516314A5 JP2017516314A5 (ja) | 2018-06-14 |
JP6781047B2 true JP6781047B2 (ja) | 2020-11-04 |
Family
ID=53398155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016567974A Active JP6781047B2 (ja) | 2014-05-21 | 2015-05-12 | 高いアライメント精度でレンズをledモジュールに取り付ける方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10103300B2 (ja) |
EP (1) | EP3146263B1 (ja) |
JP (1) | JP6781047B2 (ja) |
KR (1) | KR102400442B1 (ja) |
CN (2) | CN106463592A (ja) |
WO (1) | WO2015177679A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6863202B2 (ja) * | 2017-09-27 | 2021-04-21 | 日亜化学工業株式会社 | 発光モジュールの製造方法。 |
JP7177328B2 (ja) * | 2017-09-29 | 2022-11-24 | 日亜化学工業株式会社 | 発光装置 |
EP3599414A1 (en) * | 2018-07-23 | 2020-01-29 | Shin-Etsu Chemical Co., Ltd. | Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods |
CN110873936A (zh) * | 2018-08-31 | 2020-03-10 | 宁波舜宇光电信息有限公司 | 多群组镜头、摄像模组及其制造方法 |
JP7348533B2 (ja) * | 2021-03-31 | 2023-09-21 | 日亜化学工業株式会社 | 発光装置 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004207660A (ja) * | 2002-12-26 | 2004-07-22 | Toyoda Gosei Co Ltd | 発光ダイオード |
JP4504662B2 (ja) * | 2003-04-09 | 2010-07-14 | シチズン電子株式会社 | Ledランプ |
JP4398781B2 (ja) * | 2004-05-06 | 2010-01-13 | ローム株式会社 | 発光装置 |
CN2720646Y (zh) | 2004-07-29 | 2005-08-24 | 亿光电子工业股份有限公司 | 高功率发光二极管封装结构 |
US7858408B2 (en) * | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
US7344902B2 (en) * | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
US7646035B2 (en) * | 2006-05-31 | 2010-01-12 | Cree, Inc. | Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices |
JP2007088060A (ja) * | 2005-09-20 | 2007-04-05 | Toshiba Lighting & Technology Corp | 発光装置 |
US7378686B2 (en) * | 2005-10-18 | 2008-05-27 | Goldeneye, Inc. | Light emitting diode and side emitting lens |
JP4013077B2 (ja) * | 2005-11-21 | 2007-11-28 | 松下電工株式会社 | 発光装置およびその製造方法 |
KR100735432B1 (ko) * | 2006-05-18 | 2007-07-04 | 삼성전기주식회사 | 발광소자 패키지 및 발광소자 패키지 어레이 |
JP2007311707A (ja) | 2006-05-22 | 2007-11-29 | Ushio Inc | 紫外線発光素子パッケージ |
CN101075655B (zh) * | 2007-06-05 | 2010-07-07 | 诸建平 | 白光面光源发光装置 |
US20100181594A1 (en) * | 2008-03-25 | 2010-07-22 | Lin Charles W C | Semiconductor chip assembly with post/base heat spreader and cavity over post |
JP5256848B2 (ja) * | 2008-05-29 | 2013-08-07 | 日亜化学工業株式会社 | 半導体装置 |
CN101436638B (zh) * | 2008-12-16 | 2010-06-02 | 王海军 | 大功率led封装结构 |
CN101436637B (zh) * | 2008-12-16 | 2011-02-16 | 王海军 | 一种高效散热发光的大功率led封装结构 |
CN101452986A (zh) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | 白光发光二极管器件的封装结构和方法 |
US7855394B2 (en) * | 2009-06-18 | 2010-12-21 | Bridgelux, Inc. | LED array package covered with a highly thermal conductive plate |
KR100986468B1 (ko) * | 2009-11-19 | 2010-10-08 | 엘지이노텍 주식회사 | 렌즈 및 렌즈를 갖는 발광 장치 |
US8545049B2 (en) * | 2009-11-25 | 2013-10-01 | Cooper Technologies Company | Systems, methods, and devices for sealing LED light sources in a light module |
JP5395761B2 (ja) * | 2010-07-16 | 2014-01-22 | 日東電工株式会社 | 発光装置用部品、発光装置およびその製造方法 |
JP2012038999A (ja) * | 2010-08-10 | 2012-02-23 | Seiko Instruments Inc | 発光デバイス及びその製造方法 |
JP2012043883A (ja) | 2010-08-17 | 2012-03-01 | Toshiba Corp | 半導体装置およびその製造方法 |
KR101812168B1 (ko) * | 2011-04-19 | 2017-12-26 | 엘지전자 주식회사 | 발광 소자 패키지 및 이를 이용한 발광 장치 |
US20130056773A1 (en) * | 2011-09-02 | 2013-03-07 | Wen Kun Yang | Led package and method of the same |
CN103814448B (zh) * | 2011-11-29 | 2015-07-01 | 夏普株式会社 | 发光器件的制造方法 |
JP2013135084A (ja) * | 2011-12-26 | 2013-07-08 | Nitto Denko Corp | 発光ダイオード装置の製造方法 |
CN103515517B (zh) * | 2012-06-20 | 2016-03-23 | 展晶科技(深圳)有限公司 | 发光二极管模组 |
TWM452305U (zh) * | 2012-12-12 | 2013-05-01 | Genesis Photonics Inc | 發光裝置 |
-
2015
- 2015-05-12 WO PCT/IB2015/053475 patent/WO2015177679A1/en active Application Filing
- 2015-05-12 KR KR1020167035630A patent/KR102400442B1/ko active IP Right Grant
- 2015-05-12 US US15/306,444 patent/US10103300B2/en active Active
- 2015-05-12 CN CN201580025837.4A patent/CN106463592A/zh active Pending
- 2015-05-12 EP EP15729231.9A patent/EP3146263B1/en active Active
- 2015-05-12 CN CN201910147399.9A patent/CN110047987B/zh active Active
- 2015-05-12 JP JP2016567974A patent/JP6781047B2/ja active Active
Also Published As
Publication number | Publication date |
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EP3146263A1 (en) | 2017-03-29 |
KR20170010396A (ko) | 2017-01-31 |
KR102400442B1 (ko) | 2022-05-20 |
JP2017516314A (ja) | 2017-06-15 |
WO2015177679A1 (en) | 2015-11-26 |
CN106463592A (zh) | 2017-02-22 |
US20170047490A1 (en) | 2017-02-16 |
CN110047987A (zh) | 2019-07-23 |
CN110047987B (zh) | 2023-10-20 |
US10103300B2 (en) | 2018-10-16 |
EP3146263B1 (en) | 2019-09-25 |
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