JP6769146B2 - レーザ加工方法およびレーザ加工装置 - Google Patents
レーザ加工方法およびレーザ加工装置 Download PDFInfo
- Publication number
- JP6769146B2 JP6769146B2 JP2016138630A JP2016138630A JP6769146B2 JP 6769146 B2 JP6769146 B2 JP 6769146B2 JP 2016138630 A JP2016138630 A JP 2016138630A JP 2016138630 A JP2016138630 A JP 2016138630A JP 6769146 B2 JP6769146 B2 JP 6769146B2
- Authority
- JP
- Japan
- Prior art keywords
- scanning
- laser
- laser processing
- laser beam
- turning portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016138630A JP6769146B2 (ja) | 2016-07-13 | 2016-07-13 | レーザ加工方法およびレーザ加工装置 |
EP17827326.4A EP3486026A4 (fr) | 2016-07-13 | 2017-06-16 | Procédé de traitement au laser et appareil de traitement au laser |
PCT/JP2017/022337 WO2018012195A1 (fr) | 2016-07-13 | 2017-06-16 | Procédé de traitement au laser et appareil de traitement au laser |
CN201780035844.1A CN109311125A (zh) | 2016-07-13 | 2017-06-16 | 激光加工方法以及激光加工装置 |
US16/221,675 US20190118289A1 (en) | 2016-07-13 | 2018-12-17 | Laser machining method and laser machining apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016138630A JP6769146B2 (ja) | 2016-07-13 | 2016-07-13 | レーザ加工方法およびレーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018008291A JP2018008291A (ja) | 2018-01-18 |
JP6769146B2 true JP6769146B2 (ja) | 2020-10-14 |
Family
ID=60952954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016138630A Active JP6769146B2 (ja) | 2016-07-13 | 2016-07-13 | レーザ加工方法およびレーザ加工装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20190118289A1 (fr) |
EP (1) | EP3486026A4 (fr) |
JP (1) | JP6769146B2 (fr) |
CN (1) | CN109311125A (fr) |
WO (1) | WO2018012195A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201807830D0 (en) * | 2018-05-15 | 2018-06-27 | Renishaw Plc | Laser beam scanner |
KR102310466B1 (ko) * | 2019-06-27 | 2021-10-13 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
EP3995237A1 (fr) * | 2020-11-05 | 2022-05-11 | Siemens Energy Global GmbH & Co. KG | Stratégie de rayonnement destinée à la fabrication additive d'un composant et composant correspondant |
CN116174968B (zh) * | 2023-03-24 | 2023-09-29 | 中国科学院西安光学精密机械研究所 | 一种异形孔激光加工的直线型轨迹规划方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3557512B2 (ja) * | 1997-12-03 | 2004-08-25 | ミヤチテクノス株式会社 | 2次元バーコードのレーザマーキング方法 |
ATE346715T1 (de) * | 2000-10-26 | 2006-12-15 | Xsil Technology Ltd | Steueurung von laserbearbeitung |
JP2002178157A (ja) * | 2000-12-07 | 2002-06-25 | Daido Steel Co Ltd | 肉盛溶接方法および肉盛溶接装置 |
DE10207288B4 (de) * | 2002-02-21 | 2005-05-04 | Newson Engineering Nv | Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat |
JP2007268576A (ja) | 2006-03-31 | 2007-10-18 | Hitachi Via Mechanics Ltd | レーザ加工方法 |
JP5527526B2 (ja) * | 2010-02-24 | 2014-06-18 | マツダ株式会社 | レーザ溶接方法 |
JP5323874B2 (ja) | 2011-02-24 | 2013-10-23 | Hoya株式会社 | マスクブランク用ガラス基板、マスクブランク、マスクおよび反射型マスク並びにこれらの製造方法 |
JP6002392B2 (ja) * | 2012-01-20 | 2016-10-05 | パナソニック デバイスSunx株式会社 | レーザ加工装置 |
US20140273752A1 (en) * | 2013-03-13 | 2014-09-18 | Applied Materials, Inc. | Pad conditioning process control using laser conditioning |
US9358635B2 (en) * | 2013-12-19 | 2016-06-07 | Siemens Energy, Inc. | Rastered laser melting of a curved surface path with uniform power density distribution |
-
2016
- 2016-07-13 JP JP2016138630A patent/JP6769146B2/ja active Active
-
2017
- 2017-06-16 WO PCT/JP2017/022337 patent/WO2018012195A1/fr unknown
- 2017-06-16 CN CN201780035844.1A patent/CN109311125A/zh active Pending
- 2017-06-16 EP EP17827326.4A patent/EP3486026A4/fr active Pending
-
2018
- 2018-12-17 US US16/221,675 patent/US20190118289A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20190118289A1 (en) | 2019-04-25 |
WO2018012195A1 (fr) | 2018-01-18 |
JP2018008291A (ja) | 2018-01-18 |
CN109311125A (zh) | 2019-02-05 |
EP3486026A1 (fr) | 2019-05-22 |
EP3486026A4 (fr) | 2020-01-22 |
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