JP6769146B2 - レーザ加工方法およびレーザ加工装置 - Google Patents

レーザ加工方法およびレーザ加工装置 Download PDF

Info

Publication number
JP6769146B2
JP6769146B2 JP2016138630A JP2016138630A JP6769146B2 JP 6769146 B2 JP6769146 B2 JP 6769146B2 JP 2016138630 A JP2016138630 A JP 2016138630A JP 2016138630 A JP2016138630 A JP 2016138630A JP 6769146 B2 JP6769146 B2 JP 6769146B2
Authority
JP
Japan
Prior art keywords
scanning
laser
laser processing
laser beam
turning portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016138630A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018008291A (ja
Inventor
弘徳 宇佐美
弘徳 宇佐美
義弘 二神
義弘 二神
文崇 大田
文崇 大田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Priority to JP2016138630A priority Critical patent/JP6769146B2/ja
Priority to CN201780035844.1A priority patent/CN109311125A/zh
Priority to PCT/JP2017/022337 priority patent/WO2018012195A1/fr
Priority to EP17827326.4A priority patent/EP3486026A4/fr
Publication of JP2018008291A publication Critical patent/JP2018008291A/ja
Priority to US16/221,675 priority patent/US20190118289A1/en
Application granted granted Critical
Publication of JP6769146B2 publication Critical patent/JP6769146B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2016138630A 2016-07-13 2016-07-13 レーザ加工方法およびレーザ加工装置 Active JP6769146B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016138630A JP6769146B2 (ja) 2016-07-13 2016-07-13 レーザ加工方法およびレーザ加工装置
CN201780035844.1A CN109311125A (zh) 2016-07-13 2017-06-16 激光加工方法以及激光加工装置
PCT/JP2017/022337 WO2018012195A1 (fr) 2016-07-13 2017-06-16 Procédé de traitement au laser et appareil de traitement au laser
EP17827326.4A EP3486026A4 (fr) 2016-07-13 2017-06-16 Procédé de traitement au laser et appareil de traitement au laser
US16/221,675 US20190118289A1 (en) 2016-07-13 2018-12-17 Laser machining method and laser machining apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016138630A JP6769146B2 (ja) 2016-07-13 2016-07-13 レーザ加工方法およびレーザ加工装置

Publications (2)

Publication Number Publication Date
JP2018008291A JP2018008291A (ja) 2018-01-18
JP6769146B2 true JP6769146B2 (ja) 2020-10-14

Family

ID=60952954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016138630A Active JP6769146B2 (ja) 2016-07-13 2016-07-13 レーザ加工方法およびレーザ加工装置

Country Status (5)

Country Link
US (1) US20190118289A1 (fr)
EP (1) EP3486026A4 (fr)
JP (1) JP6769146B2 (fr)
CN (1) CN109311125A (fr)
WO (1) WO2018012195A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102310466B1 (ko) * 2019-06-27 2021-10-13 세메스 주식회사 기판 처리 장치 및 방법
EP3995237A1 (fr) * 2020-11-05 2022-05-11 Siemens Energy Global GmbH & Co. KG Stratégie de rayonnement destinée à la fabrication additive d'un composant et composant correspondant
CN116174968B (zh) * 2023-03-24 2023-09-29 中国科学院西安光学精密机械研究所 一种异形孔激光加工的直线型轨迹规划方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3557512B2 (ja) * 1997-12-03 2004-08-25 ミヤチテクノス株式会社 2次元バーコードのレーザマーキング方法
EP1328372B1 (fr) * 2000-10-26 2006-11-29 Xsil Technology Limited Commande d'usinage laser
JP2002178157A (ja) * 2000-12-07 2002-06-25 Daido Steel Co Ltd 肉盛溶接方法および肉盛溶接装置
DE10207288B4 (de) * 2002-02-21 2005-05-04 Newson Engineering Nv Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat
JP2007268576A (ja) 2006-03-31 2007-10-18 Hitachi Via Mechanics Ltd レーザ加工方法
JP5527526B2 (ja) * 2010-02-24 2014-06-18 マツダ株式会社 レーザ溶接方法
JP5323874B2 (ja) 2011-02-24 2013-10-23 Hoya株式会社 マスクブランク用ガラス基板、マスクブランク、マスクおよび反射型マスク並びにこれらの製造方法
JP6002392B2 (ja) * 2012-01-20 2016-10-05 パナソニック デバイスSunx株式会社 レーザ加工装置
US20140273752A1 (en) * 2013-03-13 2014-09-18 Applied Materials, Inc. Pad conditioning process control using laser conditioning
US9358635B2 (en) * 2013-12-19 2016-06-07 Siemens Energy, Inc. Rastered laser melting of a curved surface path with uniform power density distribution

Also Published As

Publication number Publication date
US20190118289A1 (en) 2019-04-25
EP3486026A1 (fr) 2019-05-22
CN109311125A (zh) 2019-02-05
EP3486026A4 (fr) 2020-01-22
JP2018008291A (ja) 2018-01-18
WO2018012195A1 (fr) 2018-01-18

Similar Documents

Publication Publication Date Title
CN1182936C (zh) 采用固态紫外高斯激光束成孔的波束成形和投射成像
US6586707B2 (en) Control of laser machining
JP6769146B2 (ja) レーザ加工方法およびレーザ加工装置
KR100462359B1 (ko) 폴리곤 미러를 이용한 레이저 가공장치 및 방법
JP5146948B2 (ja) 金属表面加工方法
US7807944B2 (en) Laser processing device, processing method, and method of producing circuit substrate using the method
CN105163897A (zh) 锥度控制的射束角协调及工件运动
EP2808120A2 (fr) Dispositif de découpe de substrat utilisant un faisceau laser
EP1990124A1 (fr) Système multi-laser
JP6902186B2 (ja) 加工対象材料の切断方法
JP2009082958A (ja) レーザ加工装置及びアキシコンレンズ
JP4711774B2 (ja) 平板状ワークの加工方法
KR20170048969A (ko) 다중 초점을 이용한 레이저 가공방법 및 레이저 가공장치
JP6422182B2 (ja) レーザー加工装置
WO2015136948A1 (fr) Procédé de traitement au laser
CN107662054B (zh) 脆性材料基板的激光加工方法及激光加工装置
JP6920762B2 (ja) 脆性材料基板のレーザー加工装置
TWI517923B (zh) 雷射加工方法
KR20180013678A (ko) 취성재료 기판의 레이저 가공방법 및 레이저 가공장치
KR101952756B1 (ko) 고속 스캐너를 이용한 가공물 절단 방법 및 절단 장치
JP2006315035A (ja) レーザーマーキング方法及びその装置
JP2003290959A (ja) レーザ加工方法
CN107662055B (zh) 脆性材料基板的激光加工方法及激光加工装置
JP6430816B2 (ja) レーザ加工装置の設定装置、これを備えるレーザ加工装置、および、レーザ加工装置の設定プログラム
CN111716025B (zh) 用于为蓝宝石表镜加标记的方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190510

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200512

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200708

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200825

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200907

R150 Certificate of patent or registration of utility model

Ref document number: 6769146

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150