JP6766049B2 - パッケージ化された光電子モジュール - Google Patents

パッケージ化された光電子モジュール Download PDF

Info

Publication number
JP6766049B2
JP6766049B2 JP2017538403A JP2017538403A JP6766049B2 JP 6766049 B2 JP6766049 B2 JP 6766049B2 JP 2017538403 A JP2017538403 A JP 2017538403A JP 2017538403 A JP2017538403 A JP 2017538403A JP 6766049 B2 JP6766049 B2 JP 6766049B2
Authority
JP
Japan
Prior art keywords
integrated circuit
chip package
interposer
optical
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017538403A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018509753A (ja
JP2018509753A5 (https=
Inventor
タッカー，ヒレン・ディ
クリシュナモールシー，アショク・ブイ
チェン，シュエチェ
カニンガム，ジョン・イー
Original Assignee
オラクル・インターナショナル・コーポレイション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オラクル・インターナショナル・コーポレイション filed Critical オラクル・インターナショナル・コーポレイション
Publication of JP2018509753A publication Critical patent/JP2018509753A/ja
Publication of JP2018509753A5 publication Critical patent/JP2018509753A5/ja
Application granted granted Critical
Publication of JP6766049B2 publication Critical patent/JP6766049B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
    • H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
    • H04B10/803—Free space interconnects, e.g. between circuit boards or chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12061—Silicon
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/12142—Modulator
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Geometry (AREA)
  • Combinations Of Printed Boards (AREA)
JP2017538403A 2015-01-26 2016-01-12 パッケージ化された光電子モジュール Active JP6766049B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/605,650 US9678271B2 (en) 2015-01-26 2015-01-26 Packaged opto-electronic module
US14/605,650 2015-01-26
PCT/US2016/013081 WO2016122870A1 (en) 2015-01-26 2016-01-12 Packaged opto-electronic module

Publications (3)

Publication Number Publication Date
JP2018509753A JP2018509753A (ja) 2018-04-05
JP2018509753A5 JP2018509753A5 (https=) 2019-01-31
JP6766049B2 true JP6766049B2 (ja) 2020-10-07

Family

ID=55236935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017538403A Active JP6766049B2 (ja) 2015-01-26 2016-01-12 パッケージ化された光電子モジュール

Country Status (7)

Country Link
US (1) US9678271B2 (https=)
EP (1) EP3250954A1 (https=)
JP (1) JP6766049B2 (https=)
KR (1) KR20170117396A (https=)
CN (1) CN107111086A (https=)
TW (1) TWI671560B (https=)
WO (1) WO2016122870A1 (https=)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140119738A1 (en) * 2012-11-01 2014-05-01 Oracle International Corporation Single-layer optical point-to-point network
JP6617530B2 (ja) * 2015-11-20 2019-12-11 富士通株式会社 メインボード
US10290619B2 (en) * 2016-01-04 2019-05-14 Infinera Corporation Photonic integrated circuit package
US9835809B2 (en) * 2016-03-28 2017-12-05 Cisco Technology, Inc. Alignment of optical components using nanomagnets
US10880994B2 (en) * 2016-06-02 2020-12-29 Intel Corporation Top-side connector interface for processor packaging
US10012809B2 (en) * 2016-06-20 2018-07-03 Mellanox Technologies, Ltd. Printed circuit board assembly with a photonic integrated circuit for an electro-optical interface
US10242976B2 (en) * 2016-12-31 2019-03-26 Intel Corporation In-package photonics integration and assembly architecture
US20200049909A1 (en) * 2017-01-30 2020-02-13 Hewlett Packard Enterprise Development Lp Silicon photonic solder reflowable assembly
EP3593185B1 (en) 2017-03-07 2021-11-03 Corning Optical Communications LLC Integrated electrical and optoelectronic package
WO2018190952A1 (en) * 2017-04-14 2018-10-18 Google Llc Integration of silicon photonics ic for high data rate
US10025047B1 (en) 2017-04-14 2018-07-17 Google Llc Integration of silicon photonics IC for high data rate
JP2018200924A (ja) * 2017-05-25 2018-12-20 富士通株式会社 光モジュール
US10267988B2 (en) * 2017-06-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Photonic package and method forming same
US10338329B2 (en) * 2017-08-02 2019-07-02 Nokia Solutions And Networks Oy Arrangement for connecting photonic and electronic components
US10490458B2 (en) 2017-09-29 2019-11-26 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of cutting metal gates and structures formed thereof
TWI819834B (zh) * 2017-11-21 2023-10-21 美商爾雅實驗室公司 機械傳輸套圈及使用機械傳輸套圈形成連接件的方法
US10748844B2 (en) * 2017-12-30 2020-08-18 Intel Corporation Stress isolation for silicon photonic applications
US11043478B2 (en) * 2018-04-24 2021-06-22 Cisco Technology, Inc. Integrated circuit bridge for photonics and electrical chip integration
IT201800005106A1 (it) * 2018-05-07 2019-11-07 Dispositivo, procedimento e sistema elettro-ottico corrispondenti
FR3082354B1 (fr) * 2018-06-08 2020-07-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Puce photonique traversee par un via
US10823921B2 (en) * 2018-08-15 2020-11-03 Taiwan Semiconductor Manufacturing Company, Ltd. Photonics package integration
DE102019117629A1 (de) 2018-08-15 2020-02-20 Taiwan Semiconductor Manufacturing Company, Ltd. Photonikpackageintegration
KR102477355B1 (ko) * 2018-10-23 2022-12-15 삼성전자주식회사 캐리어 기판 및 이를 이용한 기판 처리 장치
US11024617B2 (en) 2018-10-26 2021-06-01 Micron Technology, Inc. Semiconductor packages having photon integrated circuit (PIC) chips
US10928585B2 (en) 2018-10-26 2021-02-23 Micron Technology, Inc. Semiconductor devices having electro-optical substrates
US11031381B2 (en) * 2018-10-30 2021-06-08 Taiwan Semiconductor Manufacturing Company, Ltd. Optical transceiver and manufacturing method thereof
FR3089344B1 (fr) * 2018-11-30 2021-01-22 Commissariat Energie Atomique Test de circuit photonique intégré
CN113169234A (zh) * 2018-12-03 2021-07-23 艾尤纳公司 高密度光学互连组件
TWI672480B (zh) * 2018-12-03 2019-09-21 財團法人工業技術研究院 光學量測裝置與方法
FR3089310A1 (fr) * 2018-12-04 2020-06-05 Stmicroelectronics (Grenoble 2) Sas Dispositif électronique comprenant une puce électronique pourvue d’un câble optique
US10598875B2 (en) * 2018-12-14 2020-03-24 Intel Corporation Photonic package with a bridge between a photonic die and an optical coupling structure
KR102871309B1 (ko) 2019-03-06 2025-10-16 라이트매터, 인크. 포토닉 통신 플랫폼
US10681832B1 (en) 2019-06-06 2020-06-09 Hewlett Packard Enterprise Development Lp High-density universally-configurable system board architecture with dual-use modular mid-board optics (MBOs)
US11107770B1 (en) * 2019-06-27 2021-08-31 Xilinx, Inc. Integrated electrical/optical interface with two-tiered packaging
US11886023B2 (en) * 2019-08-15 2024-01-30 Ii-Vi Delaware, Inc. Photonic optoelectronic module packaging
US11493689B2 (en) 2019-09-19 2022-11-08 Taiwan Semiconductor Manufacturing Co., Ltd. Photonic semiconductor device and method of manufacture
DE102020115377B4 (de) * 2019-11-27 2026-01-15 Taiwan Semiconductor Manufacturing Co., Ltd. Package und verfahren zu dessen herstellung
JP2023516889A (ja) * 2020-02-03 2023-04-21 ライトマター インコーポレイテッド フォトニックウェハ通信システム及び関連するパッケージ
US11217573B2 (en) * 2020-03-04 2022-01-04 Intel Corporation Dual-sided co-packaged optics for high bandwidth networking applications
US11054593B1 (en) * 2020-03-11 2021-07-06 Palo Alto Research Center Incorporated Chip-scale optoelectronic transceiver with microspringed interposer
US12148742B2 (en) * 2020-03-12 2024-11-19 Intel Corporation Active bridge enabled co-packaged photonic transceiver
US12250027B2 (en) 2020-06-01 2025-03-11 Nubis Communications, Inc. Polarization-diversity optical power supply
US11621795B2 (en) 2020-06-01 2023-04-04 Nubis Communications, Inc. Polarization-diversity optical power supply
US12266608B2 (en) * 2020-06-25 2025-04-01 Intel Corporation Integrated photonics and processor package with redistribution layer and EMIB connector
CN114077016B (zh) * 2020-08-11 2023-09-01 美国莫列斯有限公司 具有光子集成电路的封装结构
KR20220022242A (ko) 2020-08-18 2022-02-25 삼성전자주식회사 회로 기판 모듈 및 이를 포함하는 전자 장치
CN116195207A (zh) * 2020-08-28 2023-05-30 艾维森纳科技有限公司 微led互连件与ic的混合集成
EP4214081A4 (en) 2020-09-18 2024-10-02 Nubis Communications, Inc. DATA PROCESSING SYSTEM WITH OPTICAL COMMUNICATION MODULES
CA3198375A1 (en) 2020-10-07 2022-04-14 Nubis Communications, Inc. Data processing systems including optical communication modules
US12101129B2 (en) * 2021-02-03 2024-09-24 Nubis Communications, Inc. Communication systems having optical power supplies
US11923269B2 (en) 2021-04-07 2024-03-05 International Business Machines Corporation Co-packaged optical module
CN113179131A (zh) * 2021-04-22 2021-07-27 青岛海信宽带多媒体技术有限公司 一种光模块
US12066653B2 (en) 2021-04-22 2024-08-20 Nubis Communications, Inc. Communication systems having optical power supplies
US11894354B2 (en) * 2021-05-13 2024-02-06 Advanced Semiconductor Engineering, Inc. Optoelectronic device package and method of manufacturing the same
CN113035858B (zh) * 2021-05-31 2021-09-14 杭州光智元科技有限公司 半导体装置及其制造方法
CN113451292A (zh) * 2021-08-09 2021-09-28 华天科技（西安）有限公司 一种高集成2.5d封装结构及其制造方法
US12130484B2 (en) 2021-09-13 2024-10-29 Lightmatter, Inc. Yield enhancement techniques for photonic communications platform
US12250024B2 (en) 2021-09-16 2025-03-11 Nubis Communications, Inc. Data processing systems including optical communication modules
US20230086881A1 (en) * 2021-09-21 2023-03-23 Intel Corporation Double-sided glass substrate with a hybrid bonded photonic integrated circuit
US20230101340A1 (en) * 2021-09-24 2023-03-30 Intel Corporation Multichip package staircase cavities
CN118202286A (zh) 2021-10-13 2024-06-14 光物质公司 多光罩光子通信平台上的多租户隔离
US12436346B2 (en) 2022-03-18 2025-10-07 Celestial Ai Inc. Optically bridged multicomponent package with extended temperature range
KR20240155370A (ko) * 2022-03-18 2024-10-28 셀레스티얼 에이아이 인코포레이티드 광 멀티 다이 상호 연결 브리지(omib)
US12392976B2 (en) * 2022-03-23 2025-08-19 Mellanox Technologies, Ltd. Optoelectronic component and method of manufacturing an optoelectronic component
US20230314711A1 (en) 2022-03-28 2023-10-05 Lightmatter, Inc. Photonic communication platform, packages and related fabrication
US20230314701A1 (en) * 2022-04-04 2023-10-05 International Business Machines Corporation Electrical-optical bridge chip and integrated circuit packaging structure
US12546935B2 (en) * 2022-04-04 2026-02-10 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit package and method of forming same
US11906802B2 (en) * 2022-05-10 2024-02-20 Avago Technologies International Sales Pte. Limited Photonics integration in semiconductor packages
US20230400648A1 (en) * 2022-06-10 2023-12-14 Advanced Semiconductor Engineering, Inc. Electronic package
US20240103236A1 (en) * 2022-09-27 2024-03-28 Taiwan Semiconductor Manufacturing Co., Ltd. Optical Engine Including Fiber Deflection Unit and Method Forming the Same
CN117976634A (zh) * 2022-10-26 2024-05-03 群创光电股份有限公司 半导体装置
US12147078B2 (en) 2022-11-11 2024-11-19 Lightmatter, Inc. Polarization locker for fiber connections and related methods
US12474533B2 (en) * 2023-05-18 2025-11-18 Mellanox Technologies, Ltd. Electronic modules for co-packaged optics and copper packages
CN116646346A (zh) * 2023-06-12 2023-08-25 Nano科技(北京)有限公司 一种光电混合集成的光电封装结构
US12189198B1 (en) 2023-08-29 2025-01-07 Celestial Ai Inc. Manufacturing optically accessible co-packaged optics
US20250087652A1 (en) * 2023-09-07 2025-03-13 Taiwan Semiconductor Manufacturing Co., Ltd. Structure integrated with optical interface engine
US20250323232A1 (en) * 2024-04-12 2025-10-16 Unimicron Technology Corp. Package structure and manufacturing method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3371954B2 (ja) * 1999-06-24 2003-01-27 日本電気株式会社 光・電気混載モジュール
JP2002355826A (ja) * 2001-05-31 2002-12-10 Omron Corp 光通信用レンズ部品の製造方法
US6749345B1 (en) * 2002-05-24 2004-06-15 National Semiconductor Corporation Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards
US7084496B2 (en) 2004-01-14 2006-08-01 International Business Machines Corporation Method and apparatus for providing optoelectronic communication with an electronic device
US7133429B2 (en) * 2004-03-05 2006-11-07 Finisar Corporation Laser driver circuit with signal transition enhancement
JP2006189469A (ja) * 2004-12-28 2006-07-20 Sony Corp 信号伝送用コネクタ及び光トランシーバ
JP5028526B2 (ja) * 2008-08-08 2012-09-19 株式会社日立製作所 熱アシスト磁気ヘッドおよび熱アシスト磁気ヘッドの組み立て方法
US8111730B2 (en) * 2009-08-20 2012-02-07 International Business Machines Corporation 3D optoelectronic packaging
US8041221B2 (en) * 2009-11-11 2011-10-18 Elbex Video Ltd. Method and apparatus for coupling optical signal with packaged circuits via optical cables and lightguide couplers
JP5493744B2 (ja) * 2009-11-12 2014-05-14 富士通株式会社 光電気混載基板、および、光電気混載基板の製造方法
WO2013074103A1 (en) 2011-11-16 2013-05-23 Intel Corporation Optical connection techniques and configurations
US20130230272A1 (en) * 2012-03-01 2013-09-05 Oracle International Corporation Chip assembly configuration with densely packed optical interconnects

Also Published As

Publication number Publication date
JP2018509753A (ja) 2018-04-05
WO2016122870A1 (en) 2016-08-04
TW201643488A (zh) 2016-12-16
KR20170117396A (ko) 2017-10-23
CN107111086A (zh) 2017-08-29
TWI671560B (zh) 2019-09-11
EP3250954A1 (en) 2017-12-06
US20160216445A1 (en) 2016-07-28
US9678271B2 (en) 2017-06-13

Similar Documents

Publication Publication Date Title
JP6766049B2 (ja) パッケージ化された光電子モジュール
US8971676B1 (en) Hybrid-integrated photonic chip package
US9297971B2 (en) Hybrid-integrated photonic chip package with an interposer
US9250403B2 (en) Hybrid-integrated photonic chip package with an interposer
US9671572B2 (en) Integrated chip package with optical interface
US12529853B2 (en) Photonic optoelectronic module packaging
US10054737B2 (en) Optical I/O system using planar light-wave integrated circuit
US9435967B2 (en) Optical connection techniques and configurations
US10365447B2 (en) Method and system for a chip-on-wafer-on-substrate assembly
US8998509B2 (en) Stackable photonic interconnect module
KR101831275B1 (ko) 램프-스택 칩 패키지의 광 통신
US20180180808A1 (en) Wafer-level packaged optoelectronic module
US20120207426A1 (en) Flip-chip packaging for dense hybrid integration of electrical and photonic integrated circuits
KR20130136446A (ko) 고정 벤드를 구비한 램프 스택 칩 패키지
TWI721112B (zh) 光電子收發器總成
US20230305244A1 (en) High density optical/electrical interconnection arrangement with high thermal efficiency
Lau et al. Embedded 3D hybrid IC integration system-in-package (SiP) for opto-electronic interconnects in organic substrates
Lau Co-Packaged Optics-Heterogeneous Integration of Chiplets (Switch, Photonic IC, and Electronic IC)
De Dobbelaere Optoelectronic integration for reduced power dissipation in optical interconnect

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181212

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20181212

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20191216

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200107

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20200406

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200413

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200818

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200916

R150 Certificate of patent or registration of utility model

Ref document number: 6766049

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250