JP6764480B2 - 膜の製造方法、積層体の製造方法および電子デバイスの製造方法 - Google Patents

膜の製造方法、積層体の製造方法および電子デバイスの製造方法 Download PDF

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JP6764480B2
JP6764480B2 JP2018535633A JP2018535633A JP6764480B2 JP 6764480 B2 JP6764480 B2 JP 6764480B2 JP 2018535633 A JP2018535633 A JP 2018535633A JP 2018535633 A JP2018535633 A JP 2018535633A JP 6764480 B2 JP6764480 B2 JP 6764480B2
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JPWO2018038001A1 (ja
Inventor
沢野　充
充 沢野
義貴 加持
義貴 加持
犬島　孝能
孝能 犬島
悠 岩井
悠 岩井
勝志 伊藤
勝志 伊藤
ステファン ヴァンクロースター
ステファン ヴァンクロースター
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Fujifilm Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2018535633A 2016-08-25 2017-08-18 膜の製造方法、積層体の製造方法および電子デバイスの製造方法 Active JP6764480B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016164693 2016-08-25
JP2016164693 2016-08-25
PCT/JP2017/029573 WO2018038001A1 (ja) 2016-08-25 2017-08-18 膜の製造方法、積層体の製造方法および電子デバイスの製造方法

Publications (2)

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JPWO2018038001A1 JPWO2018038001A1 (ja) 2019-04-11
JP6764480B2 true JP6764480B2 (ja) 2020-09-30

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JP2018535633A Active JP6764480B2 (ja) 2016-08-25 2017-08-18 膜の製造方法、積層体の製造方法および電子デバイスの製造方法

Country Status (4)

Country Link
JP (1) JP6764480B2 (ko)
KR (1) KR102197805B1 (ko)
TW (2) TW202348689A (ko)
WO (1) WO2018038001A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020026840A1 (ja) * 2018-07-31 2020-02-06 旭化成株式会社 ネガ型感光性樹脂組成物、並びにこれを用いたポリイミド及び硬化レリーフパターンの製造方法
WO2020066633A1 (ja) * 2018-09-26 2020-04-02 Jsr株式会社 感光性樹脂組成物、レジストパターンの形成方法、およびメッキ造形物の製造方法
JP7488659B2 (ja) * 2020-01-30 2024-05-22 旭化成株式会社 ネガ型感光性樹脂組成物、並びにこれを用いたポリイミド及び硬化レリーフパターンの製造方法
JP7308300B2 (ja) * 2020-01-30 2023-07-13 旭化成株式会社 ネガ型感光性樹脂組成物及び硬化レリーフパターンの製造方法
TW202204475A (zh) * 2020-06-03 2022-02-01 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化膜、積層體、硬化膜之製造方法及半導體器件
WO2022210233A1 (ja) * 2021-03-30 2022-10-06 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60206639A (ja) * 1984-03-31 1985-10-18 日東電工株式会社 ポリイミド−金属箔複合フイルムの製造方法
JPH062828B2 (ja) * 1986-05-15 1994-01-12 宇部興産株式会社 ポリイミドフイルムの製造法
JPH0682894B2 (ja) * 1986-09-27 1994-10-19 住友ベ−クライト株式会社 フレキシブルプリント回路用基板の製造方法
JPH0466170A (ja) * 1990-07-06 1992-03-02 Nippon Steel Corp 耐熱性プレコート金属板の製造方法
KR100548625B1 (ko) * 2003-03-24 2006-01-31 주식회사 엘지화학 고내열성 투명 폴리이미드 전구체 및 이를 이용한 감광성수지 조성물
CN103042764A (zh) * 2006-04-18 2013-04-17 宇部兴产株式会社 敷金属用聚酰亚胺膜以及金属-层压聚酰亚胺膜
JP2008266416A (ja) * 2007-04-18 2008-11-06 Ube Ind Ltd ポリイミドフィルムの製造方法およびポリイミドフィルム
CN104119533B (zh) * 2010-02-10 2018-06-26 宇部兴产株式会社 聚酰亚胺膜、含它的聚酰亚胺层压体和含它的聚酰亚胺金属层压体
JP5830896B2 (ja) 2011-03-30 2015-12-09 宇部興産株式会社 ポリイミドフィルムの製造方法、およびポリイミドフィルム
JP2013160827A (ja) 2012-02-02 2013-08-19 Toray Ind Inc ポリイミド樹脂層のパターン形成方法
US9159547B2 (en) 2013-09-17 2015-10-13 Deca Technologies Inc. Two step method of rapid curing a semiconductor polymer layer
JP6336061B2 (ja) * 2014-05-24 2018-06-06 株式会社カネカ アルコキシシラン変性ポリアミド酸溶液、それを用いた積層体及びフレキシブルデバイス、並びにポリイミドフィルム及び積層体の製造方法

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Publication number Publication date
KR102197805B1 (ko) 2021-01-05
JPWO2018038001A1 (ja) 2019-04-11
WO2018038001A1 (ja) 2018-03-01
TW201840436A (zh) 2018-11-16
TWI825000B (zh) 2023-12-11
TW202348689A (zh) 2023-12-16
KR20190028735A (ko) 2019-03-19

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