JP6760955B2 - セリア粒子を含有する研磨組成物及び使用方法 - Google Patents

セリア粒子を含有する研磨組成物及び使用方法 Download PDF

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Publication number
JP6760955B2
JP6760955B2 JP2017546641A JP2017546641A JP6760955B2 JP 6760955 B2 JP6760955 B2 JP 6760955B2 JP 2017546641 A JP2017546641 A JP 2017546641A JP 2017546641 A JP2017546641 A JP 2017546641A JP 6760955 B2 JP6760955 B2 JP 6760955B2
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Prior art keywords
polishing composition
ceria particles
substrate
mechanical polishing
chemical mechanical
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Japanese (ja)
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JP2018513552A5 (enExample
JP2018513552A (ja
Inventor
ライス ブライアン
ライス ブライアン
ベト ラム
ベト ラム
レンホー ジア
レンホー ジア
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CMC Materials LLC
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Cabot Microelectronics Corp
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/82—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by IR- or Raman-data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2017546641A 2015-03-05 2016-03-04 セリア粒子を含有する研磨組成物及び使用方法 Active JP6760955B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562128802P 2015-03-05 2015-03-05
US62/128,802 2015-03-05
US15/056,198 US10414947B2 (en) 2015-03-05 2016-02-29 Polishing composition containing ceria particles and method of use
US15/056,198 2016-02-29
PCT/US2016/020809 WO2016141260A1 (en) 2015-03-05 2016-03-04 Polishing composition containing ceria particles and method of use

Publications (3)

Publication Number Publication Date
JP2018513552A JP2018513552A (ja) 2018-05-24
JP2018513552A5 JP2018513552A5 (enExample) 2019-03-28
JP6760955B2 true JP6760955B2 (ja) 2020-09-23

Family

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Application Number Title Priority Date Filing Date
JP2017546641A Active JP6760955B2 (ja) 2015-03-05 2016-03-04 セリア粒子を含有する研磨組成物及び使用方法

Country Status (7)

Country Link
US (1) US10414947B2 (enExample)
EP (1) EP3265526B1 (enExample)
JP (1) JP6760955B2 (enExample)
KR (1) KR102605260B1 (enExample)
CN (1) CN107429121B (enExample)
TW (1) TWI580768B (enExample)
WO (1) WO2016141260A1 (enExample)

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CN112758974A (zh) * 2021-01-04 2021-05-07 上海晖研材料科技有限公司 一种氧化铈颗粒的制备方法
CN112723405A (zh) * 2021-01-04 2021-04-30 上海晖研材料科技有限公司 一种氧化铈颗粒及含其的抛光浆料
CN112680115A (zh) * 2021-01-04 2021-04-20 上海晖研材料科技有限公司 一种氧化铈颗粒在抛光工艺中的应用
JP2024519796A (ja) 2021-05-17 2024-05-21 ローディア オペレーションズ セリウム系コア－シェル粒子の液体分散液及び粉末、これを製造するための方法並びに研磨におけるその使用
KR102765948B1 (ko) * 2021-05-20 2025-02-11 주식회사 한국나노오트 연마용 세리아 입자 및 이를 포함하는 슬러리
IL317743A (en) * 2022-06-17 2025-02-01 Rhodia Operations Suspension containing cerium oxide particles and its uses
CN115960540A (zh) * 2022-12-23 2023-04-14 昂士特科技(深圳)有限公司 具有改进颗粒的化学机械抛光组合物
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Also Published As

Publication number Publication date
TWI580768B (zh) 2017-05-01
TW201704440A (zh) 2017-02-01
EP3265526A4 (en) 2018-12-05
EP3265526A1 (en) 2018-01-10
KR102605260B1 (ko) 2023-11-24
EP3265526B1 (en) 2021-04-14
CN107429121B (zh) 2019-09-03
CN107429121A (zh) 2017-12-01
WO2016141260A1 (en) 2016-09-09
US10414947B2 (en) 2019-09-17
US20160257855A1 (en) 2016-09-08
JP2018513552A (ja) 2018-05-24
KR20170125379A (ko) 2017-11-14

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