CN107429121B - 含有铈土颗粒的抛光组合物及使用方法 - Google Patents

含有铈土颗粒的抛光组合物及使用方法 Download PDF

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Publication number
CN107429121B
CN107429121B CN201680013859.3A CN201680013859A CN107429121B CN 107429121 B CN107429121 B CN 107429121B CN 201680013859 A CN201680013859 A CN 201680013859A CN 107429121 B CN107429121 B CN 107429121B
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China
Prior art keywords
polishing composition
ceria particles
wet
chemical mechanical
substrate
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CN201680013859.3A
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English (en)
Chinese (zh)
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CN107429121A (zh
Inventor
B.赖斯
林越
贾仁合
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CMC Materials LLC
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Cabot Microelectronics Corp
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/82—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by IR- or Raman-data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201680013859.3A 2015-03-05 2016-03-04 含有铈土颗粒的抛光组合物及使用方法 Active CN107429121B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562128802P 2015-03-05 2015-03-05
US62/128,802 2015-03-05
US15/056,198 US10414947B2 (en) 2015-03-05 2016-02-29 Polishing composition containing ceria particles and method of use
US15/056,198 2016-02-29
PCT/US2016/020809 WO2016141260A1 (en) 2015-03-05 2016-03-04 Polishing composition containing ceria particles and method of use

Publications (2)

Publication Number Publication Date
CN107429121A CN107429121A (zh) 2017-12-01
CN107429121B true CN107429121B (zh) 2019-09-03

Family

ID=56848800

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680013859.3A Active CN107429121B (zh) 2015-03-05 2016-03-04 含有铈土颗粒的抛光组合物及使用方法

Country Status (7)

Country Link
US (1) US10414947B2 (enExample)
EP (1) EP3265526B1 (enExample)
JP (1) JP6760955B2 (enExample)
KR (1) KR102605260B1 (enExample)
CN (1) CN107429121B (enExample)
TW (1) TWI580768B (enExample)
WO (1) WO2016141260A1 (enExample)

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KR102463863B1 (ko) * 2015-07-20 2022-11-04 삼성전자주식회사 연마용 조성물 및 이를 이용한 반도체 장치의 제조 방법
KR101823083B1 (ko) * 2016-09-07 2018-01-30 주식회사 케이씨텍 표면개질된 콜로이달 세리아 연마입자, 그의 제조방법 및 그를 포함하는 연마 슬러리 조성물
KR102539028B1 (ko) 2017-06-15 2023-06-02 로디아 오퍼레이션스 세륨 기반 입자
CN109986458B (zh) * 2017-12-29 2021-02-05 长鑫存储技术有限公司 缓研磨去除多晶硅表面凸块缺陷的方法及半导体工艺方法
JP7611246B2 (ja) * 2019-10-22 2025-01-09 シーエムシー マテリアルズ リミティド ライアビリティ カンパニー 自動停止研磨組成物及び方法
KR20220087495A (ko) 2019-10-22 2022-06-24 씨엠씨 머티리얼즈, 인코포레이티드 실리콘 산화물 및 탄소 도핑된 실리콘 산화물 cmp를 위한 조성물 및 방법
EP4048748B1 (en) 2019-10-22 2026-05-06 CMC Materials LLC Composition and method for selective oxide cmp
WO2021105169A1 (en) 2019-11-26 2021-06-03 Rhodia Operations Liquid dispersion and powder of cerium based core-shell particles, process for producing the same and uses thereof in polishing
KR102373924B1 (ko) * 2020-10-26 2022-03-15 솔브레인 주식회사 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
CN112680115A (zh) * 2021-01-04 2021-04-20 上海晖研材料科技有限公司 一种氧化铈颗粒在抛光工艺中的应用
CN112758974A (zh) * 2021-01-04 2021-05-07 上海晖研材料科技有限公司 一种氧化铈颗粒的制备方法
CN112723405A (zh) * 2021-01-04 2021-04-30 上海晖研材料科技有限公司 一种氧化铈颗粒及含其的抛光浆料
TWI920315B (zh) 2021-05-17 2026-04-01 法商羅地亞經營管理公司 基於鈰的核－殼顆粒的液體分散體和粉末、其生產方法及其在拋光中之用途
KR102765948B1 (ko) * 2021-05-20 2025-02-11 주식회사 한국나노오트 연마용 세리아 입자 및 이를 포함하는 슬러리
WO2023242394A1 (en) * 2022-06-17 2023-12-21 Rhodia Operations Suspension of cerium oxide particles
CN115960540A (zh) * 2022-12-23 2023-04-14 昂士特科技(深圳)有限公司 具有改进颗粒的化学机械抛光组合物
CN122422452A (zh) 2023-12-21 2026-07-17 罗地亚经营管理公司 包含其上吸附有多金属氧酸盐物质的氧化铈颗粒的水性分散体，其生产方法及其在抛光中的用途
WO2025190482A1 (en) 2024-03-13 2025-09-18 Rhodia Operations Cerium oxide particles with cotrolled microstructure
CN119736068B (zh) * 2025-02-05 2025-08-08 珠海基石科技有限公司 一种粒子及其分散液、平整化组合物及其应用、半导体器件及其用基底的平整化方法

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CN1384170A (zh) * 2001-04-27 2002-12-11 花王株式会社 研磨液组合物
CN1575325A (zh) * 2001-10-24 2005-02-02 卡伯特微电子公司 含硼抛光系统及方法
CN1626599A (zh) * 2003-11-04 2005-06-15 福吉米株式会社 抛光组合物和抛光方法
CN1849379A (zh) * 2003-07-11 2006-10-18 格雷斯公司 用于化学机械抛光的磨料颗粒

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CN1077974A (zh) * 1992-04-27 1993-11-03 罗德尔公司 抛光和刨平表面用的组合物和方法
CN1329118A (zh) * 2000-06-21 2002-01-02 普莱克斯S.T.技术有限公司 抛光组合物和抛光方法
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CN1575325A (zh) * 2001-10-24 2005-02-02 卡伯特微电子公司 含硼抛光系统及方法
CN1849379A (zh) * 2003-07-11 2006-10-18 格雷斯公司 用于化学机械抛光的磨料颗粒
CN1626599A (zh) * 2003-11-04 2005-06-15 福吉米株式会社 抛光组合物和抛光方法

Also Published As

Publication number Publication date
KR102605260B1 (ko) 2023-11-24
JP6760955B2 (ja) 2020-09-23
EP3265526B1 (en) 2021-04-14
TW201704440A (zh) 2017-02-01
JP2018513552A (ja) 2018-05-24
WO2016141260A1 (en) 2016-09-09
EP3265526A1 (en) 2018-01-10
TWI580768B (zh) 2017-05-01
US10414947B2 (en) 2019-09-17
CN107429121A (zh) 2017-12-01
US20160257855A1 (en) 2016-09-08
KR20170125379A (ko) 2017-11-14
EP3265526A4 (en) 2018-12-05

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