JP6746185B2 - 半導体ウェハめっき用治具 - Google Patents

半導体ウェハめっき用治具 Download PDF

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JP6746185B2
JP6746185B2 JP2016017434A JP2016017434A JP6746185B2 JP 6746185 B2 JP6746185 B2 JP 6746185B2 JP 2016017434 A JP2016017434 A JP 2016017434A JP 2016017434 A JP2016017434 A JP 2016017434A JP 6746185 B2 JP6746185 B2 JP 6746185B2
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wafer
plating
semiconductor wafer
plate
semiconductor
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JP2017137523A (ja
JP2017137523A5 (https=
Inventor
弘 佐久間
弘 佐久間
伸也 矢野
伸也 矢野
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Aska Corp
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Aska Corp
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  • Electrodes Of Semiconductors (AREA)
JP2016017434A 2016-02-01 2016-02-01 半導体ウェハめっき用治具 Active JP6746185B2 (ja)

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JP2016017434A JP6746185B2 (ja) 2016-02-01 2016-02-01 半導体ウェハめっき用治具

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JP2016017434A JP6746185B2 (ja) 2016-02-01 2016-02-01 半導体ウェハめっき用治具

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JP2017137523A JP2017137523A (ja) 2017-08-10
JP2017137523A5 JP2017137523A5 (https=) 2019-03-14
JP6746185B2 true JP6746185B2 (ja) 2020-08-26

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110359079A (zh) * 2018-04-10 2019-10-22 中国科学院半导体研究所 电镀夹具
CN112259493A (zh) * 2020-10-19 2021-01-22 绍兴同芯成集成电路有限公司 一种超薄晶圆电镀、化镀整合工艺
KR102526481B1 (ko) * 2023-01-31 2023-04-27 하이쎄미코(주) 웨이퍼 도금용 컵셀

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0324599Y2 (https=) * 1987-06-26 1991-05-29
JP3286063B2 (ja) * 1994-03-07 2002-05-27 日本エレクトロプレイテイング・エンジニヤース株式会社 ウエーハのめっき用ラック及びそれを用いためっき方法
JP3724110B2 (ja) * 1997-04-24 2005-12-07 三菱電機株式会社 半導体装置の製造方法
JP3629396B2 (ja) * 2000-03-07 2005-03-16 株式会社荏原製作所 基板めっき治具
JP4424486B2 (ja) * 2004-06-29 2010-03-03 Ｔｄｋ株式会社 カソード電極組立体、カソード電極装置、及び、メッキ装置
JP2007308783A (ja) * 2006-05-22 2007-11-29 Matsushita Electric Ind Co Ltd 電気めっき装置およびその方法
JP5184308B2 (ja) * 2007-12-04 2013-04-17 株式会社荏原製作所 めっき装置及びめっき方法
JP5483906B2 (ja) * 2009-03-04 2014-05-07 三菱電機株式会社 半導体装置およびその製造方法
JP6018961B2 (ja) * 2013-03-26 2016-11-02 株式会社荏原製作所 めっき装置およびめっき方法

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