JP6746130B2 - Substrate cutting device and substrate cutting method - Google Patents

Substrate cutting device and substrate cutting method Download PDF

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JP6746130B2
JP6746130B2 JP2016146478A JP2016146478A JP6746130B2 JP 6746130 B2 JP6746130 B2 JP 6746130B2 JP 2016146478 A JP2016146478 A JP 2016146478A JP 2016146478 A JP2016146478 A JP 2016146478A JP 6746130 B2 JP6746130 B2 JP 6746130B2
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substrate
bonded
end portion
main body
scribe line
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JP2018015940A (en
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佑磨 岩坪
佑磨 岩坪
善孝 三浦
善孝 三浦
田端　淳
淳 田端
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to CN201710560358.3A priority patent/CN107651829A/en
Priority to KR1020170090254A priority patent/KR20180012205A/en
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)

Description

本発明は、基板分断装置、特に、端部を切り離すためのスクライブラインが表面に形成された第１基板と、第１基板の裏面に貼り合わされた第２基板とを有する、貼り合わせ基板の分断装置に関する。また、本発明は、基板分断方法に関する。 The present invention relates to a substrate cutting device, and more particularly, a bonded substrate cutting device that has a first substrate having a scribe line for cutting off an end formed on the front surface and a second substrate bonded to the back surface of the first substrate. Regarding the device. The present invention also relates to a substrate cutting method.

液晶装置は、液晶層を間に介在するように第１基板と第２基板とがシール材によって貼り合わされる、貼り合わせ基板によって構成される。このような貼り合わせ基板において、上記の基板のうちの一方（例えば、第１基板）にカラーフィルタがパターン形成され、他方の基板（例えば、第２基板）にＴＦＴ（Ｔｈｉｎ Ｆｉｌｍ Ｔｒａｎｓｉｓｔｏｒ）及び接続端子が形成されている。 The liquid crystal device is composed of a bonded substrate in which a first substrate and a second substrate are bonded together with a sealing material so that a liquid crystal layer is interposed therebetween. In such a bonded substrate, a color filter is pattern-formed on one of the above substrates (for example, a first substrate), and a TFT (Thin Film Transistor) and a connection terminal are provided on the other substrate (for example, a second substrate). Are formed.

上記の貼り合わせ基板において、外部の電子機器と接続するためには、第２基板に形成された接続端子を露出させる必要がある。液晶装置である貼り合わせ基板において、接続端子が形成された面を露出させる（貼り合わせ基板のうちの一方の基板の内側面を露出させる）ための基板の分離方法が、特許文献１に示されている。 In the above-mentioned bonded substrate, it is necessary to expose the connection terminal formed on the second substrate in order to connect to an external electronic device. Patent Document 1 discloses a substrate separating method for exposing a surface on which a connection terminal is formed (exposing an inner surface of one of the bonded substrates) in the bonded substrate which is a liquid crystal device. ing.

特許文献１では、まず、スクライブライン形成時に、第１基板にスクライブラインを形成するカッターの配置位置と、第２基板にスクライブラインを形成するカッターの配置位置と、をずらしてスクライブラインを形成する。その後、切れ端となる方の貼り合わせ基板（端材）と、装置となる方の貼り合わせ基板とを分離して接続端子を露出させる際に、端材をチャック部材により保持した状態にてチャック部材を、装置となる方の貼り合わせ基板から遠ざける。 In Patent Document 1, first, when forming a scribe line, the scribe line is formed by shifting the arrangement position of the cutter that forms the scribe line on the first substrate and the arrangement position of the cutter that forms the scribe line on the second substrate. .. After that, when the bonded substrate (mill end material) that is to be a scrap and the bonded substrate that is to be the device are separated and the connection terminals are exposed, the chuck member holds the mill end material by the chuck member. Away from the bonded substrate that will be the device.

特開２０１２−２５０８７１号公報JP2012-250871A

上記のように、チャック部材にて端材を保持し移動させる方法により端材を除去する場合、端材が、装置となる方の貼り合わせ基板の接続端子が形成された面を強く押さえつけないように、チャック部材の位置を精度よく調整する必要がある。なぜなら、接続端子が形成された面が端材により強い力にて押さえつけられた状態で端材を移動させると、接続端子が損傷する（例えば、接続端子に傷が形成される）からである。 As described above, when the scrap material is removed by the method of holding and moving the scrap material with the chuck member, the scrap material does not strongly press the surface of the bonded substrate serving as the device on which the connection terminals are formed. First, it is necessary to accurately adjust the position of the chuck member. This is because if the end material is moved while the surface on which the connection terminal is formed is pressed by the end material with a strong force, the connection terminal is damaged (for example, the connection terminal is scratched).

すなわち、従来の端材の分離方法では、チャック部材の位置の高精度な調整が必要となる。さらに、端材が貼り合わせ基板のうちの一方の基板にのみ形成される場合には、端材をチャック部材により保持することができないという問題点がある。 That is, the conventional method of separating offcuts requires highly accurate adjustment of the position of the chuck member. Further, when the scrap material is formed only on one of the bonded substrates, there is a problem that the scrap material cannot be held by the chuck member.

本発明の目的は、スクライブラインを形成後に端材を除去して貼り合わせ基板のいずれかの基板の内側面を露出させる場合において、より単純な方法にて、端材を、露出しようとしている面を損傷させることなく除去することにある。 An object of the present invention is to remove the end material after forming the scribe line to expose the inner surface of any one of the bonded substrates by a simpler method. Is to remove without damaging.

本発明の一側面に係る基板分断装置は、端部を切り離すためのスクライブラインが表面に形成された第１基板と、第１基板の裏面に貼り合わされた第２基板とを有する、貼り合わせ基板の分断装置である。
基板分断装置は、テーブルと、押圧装置と、ブロー装置と、を備えている。
テーブルは、貼り合わせ基板を支持する。
押圧装置は、第１基板側から端部を押圧することで、端部をスクライブラインに沿って分断する。
ブロー装置は、ガスの流れを発生することで、端部を第１基板の本体部から剥がして移動させる。 A substrate cutting device according to one aspect of the present invention is a bonded substrate having a first substrate having a scribe line for cutting off an end formed on the front surface and a second substrate bonded to the back surface of the first substrate. It is a cutting device.
The substrate cutting device includes a table, a pressing device, and a blowing device.
The table supports the bonded substrate stack.
The pressing device presses the end portion from the first substrate side to divide the end portion along the scribe line.
The blower generates a gas flow to peel the end portion of the main body of the first substrate and move the end portion.

この装置では、従来のように端部を保持して第１基板の本体部から移動させるのではなく、ブロー装置により発生させたガスの流れにより、端部を第１基板の本体部から剥がして移動させる。 In this device, the end portion is peeled off from the main body portion of the first substrate by the flow of gas generated by the blower, instead of holding the end portion and moving it from the main body portion of the first substrate as in the conventional case. To move.

このような分断によって、端部を第１基板の本体部から移動させる際に、端部の移動中の位置を精度よく調整しなくとも、端部が第２基板の表面を押圧することがなくなる。その結果、端部を貼り合わせ基板から分離する際に、端部が第２基板の露出面を損傷しなくなる。 Due to such division, when the end portion is moved from the main body portion of the first substrate, the end portion does not press the surface of the second substrate without adjusting the moving position of the end portion with high accuracy. .. As a result, the edge does not damage the exposed surface of the second substrate when the edge is separated from the bonded substrate.

ブロー装置は、本体部において端部の上方に配置され、本体部の端部近傍に対して斜めに向いたノズルを有していてもよい。ここでは、ブロー装置が上記のノズルを有することにより、端部及び／又は本体部に対して、端部を本体部から移動できる最適なガスの流れを与えることができる。 The blower may have a nozzle that is disposed above the end of the main body and that is obliquely oriented with respect to the vicinity of the end of the main body. Here, since the blower device has the above-mentioned nozzle, it is possible to provide the end portion and/or the main body portion with an optimum gas flow capable of moving the end portion from the main body portion.

本発明の他の見地に係る基板分断方法は、端部を切り離すためのスクライブラインが表面に形成された第１基板と、第１基板の裏面に貼り合わされた第２基板とを有する、貼り合わせ基板の分断方法である。そして、以下のステップを有している。 A substrate cutting method according to another aspect of the present invention includes a first substrate having a front surface on which a scribe line for separating an end portion is formed, and a second substrate bonded to the back surface of the first substrate. This is a method of cutting the substrate. And it has the following steps.

ａ：貼り合わせ基板をテーブルに載置する載置ステップ。 a: a placing step of placing the bonded substrate on the table.

ｂ：第１基板側から端部を押圧することで、端部を前記スクライブラインに沿って分断する分断ステップ。 b: A dividing step of dividing the end portion along the scribe line by pressing the end portion from the first substrate side.

ｃ：ガスの流れを発生させることで、端部を第１基板の本体部から剥がして移動させるブローステップ。 c: A blow step in which the end portion is peeled from the main body portion of the first substrate and moved by generating a gas flow.

ブローステップは、本体部において端部から離れた位置の上方から、本体部の端部近傍に対して斜めにガスの流れを当ててもよい。 In the blowing step, the gas flow may be obliquely applied to the vicinity of the end of the main body from above the position apart from the end of the main body.

本発明では、スクライブラインを形成後に端部を除去して貼り合わせ基板の第２基板の内側面を露出させる場合において、より単純な方法にて、第２基板の露出しようとしている面に過剰な力をかけることなく端材を除去できる。 According to the present invention, when the end portion is removed after the scribe line is formed to expose the inner surface of the second substrate of the bonded substrate, a simpler method is used to remove an excess of the surface of the second substrate that is to be exposed. You can remove scraps without applying force.

本発明の一実施形態による基板分断装置の模式図。The schematic diagram of the substrate cutting device by one embodiment of the present invention. 基板分断方法の押圧ステップを説明するための模式図。The schematic diagram for demonstrating the press step of a board|substrate cutting method. 基板分断方法のブローステップを説明するための模式図。The schematic diagram for demonstrating the blow step of a board|substrate cutting method. ブローステップにおいて端材が分離される様子を示す模式図。The schematic diagram which shows a mode that a scrap material is isolate|separated in a blow step.

図１は本発明の一実施形態による基板分断装置の模式図である。この装置は、貼り合わせ基板Ｇの一方の表面の端部に位置する端材ＧＬを除去するための装置である。貼り合わせ基板Ｇは、図１に示すように、第１基板Ｇ１と、第１基板Ｇ１の裏面に貼り合わされた第２基板Ｇ２と、から構成されている。ここでは、第１基板Ｇ１の表面にスクライブラインＳが形成され、このスクライブラインＳに沿って端材ＧＬが除去される。 FIG. 1 is a schematic view of a substrate cutting device according to an embodiment of the present invention. This device is a device for removing the scrap material GL located at the end portion of one surface of the bonded substrate G. As shown in FIG. 1, the bonded substrate G includes a first substrate G1 and a second substrate G2 bonded to the back surface of the first substrate G1. Here, the scribe line S is formed on the surface of the first substrate G1, and the end material GL is removed along the scribe line S.

分断装置は、押圧装置１と、テーブル２と、ブロー装置３と、を有している。押圧装置１は、図示しないガントリー等の支持機構に、図１の紙面垂直方向に支持されている。押圧装置１は、駆動機構Ｍ１によって昇降自在であり、押圧部１１を有している。テーブル２は、第１基板Ｇ１が上方に位置するようにして、貼り合わせ基板Ｇが載置される。また、貼り合わせ基板Ｇは、端材ＧＬがテーブル２の端面からさらに外側に位置するように、すなわち端材ＧＬの下方にテーブル２の載置面が存在しないように配置される。テーブル２は、駆動モータやガイド機構等を含む駆動機構Ｍ２によって、図１の左右方向に移動可能である。 The cutting device has a pressing device 1, a table 2, and a blowing device 3. The pressing device 1 is supported by a support mechanism such as a gantry (not shown) in the direction perpendicular to the paper surface of FIG. The pressing device 1 can be moved up and down by a drive mechanism M1 and has a pressing portion 11. The bonded substrate G is placed on the table 2 such that the first substrate G1 is located above. Further, the bonded substrate G is arranged so that the end material GL is located further outside from the end surface of the table 2, that is, the mounting surface of the table 2 does not exist below the end material GL. The table 2 can be moved in the left-right direction in FIG. 1 by a drive mechanism M2 including a drive motor and a guide mechanism.

押圧装置１の押圧部１１は、押圧面１１ａにより、貼り合わせ基板Ｇに対して、第１基板Ｇ１側から端材ＧＬを押圧する。これにより、端材ＧＬはスクライブラインＳに沿って分断される。押圧部１１は、第１基板Ｇ１よりも剛性の低い樹脂等で形成されている。したがって、押圧部１１は、端材ＧＬを押圧した際に、弾性変形可能である。 The pressing portion 11 of the pressing device 1 presses the end material GL against the bonded substrate G from the first substrate G1 side by the pressing surface 11a. As a result, the scrap GL is divided along the scribe line S. The pressing portion 11 is formed of a resin or the like having a lower rigidity than the first substrate G1. Therefore, the pressing portion 11 is elastically deformable when the end material GL is pressed.

ブロー装置３は、第１基板Ｇ１の本体部の主面に対して斜め方向にガス（例えば、空気、窒素など）の流れＦＬを発生することで、押圧部１１の押圧により分離された端材ＧＬを、第１基板Ｇ１の本体部（端材ＧＬではない方の第１基板Ｇ１）から剥がして移動させる。 The blower 3 generates a flow FL of gas (for example, air, nitrogen, etc.) in an oblique direction with respect to the main surface of the main body of the first substrate G1, so that the end material separated by the pressing of the pressing unit 11 The GL is moved by peeling it from the main body of the first substrate G1 (the first substrate G1 that is not the end material GL).

ブロー装置３は、第１基板Ｇ１の本体部の端部（端材ＧＬに近い方）の上方において、本体部の端部近傍に対して斜めに向いて配置されたノズル３１を有する。ブロー装置３では、ノズル３１に接続されたガス供給装置３３（ガスボンベなどを含むガスを供給する装置）を制御して、ノズル３１から、所定の流速及び圧力を有するガスの流れＦＬを発生する。これにより、ブロー装置３は、端材ＧＬを第１基板Ｇ１から移動できる最適なガスの流れを、端材ＧＬに与えることができる。 The blower 3 has a nozzle 31 that is arranged above the end of the main body of the first substrate G1 (the side closer to the end material GL) and obliquely to the vicinity of the end of the main body. In the blowing device 3, the gas supply device 33 (device that supplies gas including a gas cylinder) connected to the nozzle 31 is controlled to generate a gas flow FL having a predetermined flow velocity and pressure from the nozzle 31. Accordingly, the blowing device 3 can give the optimum flow of gas to the end material GL so that the end material GL can be moved from the first substrate G1.

ガスの流れＦＬのガス流速や圧力は、例えば、端材ＧＬの大きさや重さに基づいて、適宜調整できる。 The gas flow velocity and pressure of the gas flow FL can be appropriately adjusted based on, for example, the size and weight of the end material GL.

なお、ノズル３１の個数は１個に限られず、例えば、第１基板Ｇ１の幅方向に沿って複数のノズルが配置されていてもよい。その他、ノズル３１を第１基板Ｇ１の幅方向に移動可能となっていてもよい。これにより、第１基板Ｇ１（端材ＧＬ）の幅方向全体にガスの流れＦＬを供給して、端材ＧＬを、その姿勢を制御しながら、第１基板Ｇ１の本体部から分離できる。 The number of nozzles 31 is not limited to one, and for example, a plurality of nozzles may be arranged along the width direction of the first substrate G1. In addition, the nozzle 31 may be movable in the width direction of the first substrate G1. Thereby, the gas flow FL is supplied to the entire width direction of the first substrate G1 (mill ends GL), and the mill ends GL can be separated from the main body of the first substrate G1 while controlling the posture thereof.

次に、貼り合わせ基板Ｇから第１基板Ｇ１の端材ＧＬを分断し、分断された端材ＧＬを第１基板Ｇ１から取り除く方法について説明する。 Next, a method of dividing the end material GL of the first substrate G1 from the bonded substrate G and removing the divided end material GL from the first substrate G1 will be described.

まず、第１基板Ｇ１及び第２基板Ｇ２が貼り合わされた貼り合わせ基板Ｇを準備し、図示しないスクライブライン形成装置によって、第１基板Ｇ１の表面（第２基板Ｇ２が貼り合わされていない側の表面）に、スクライブラインＳを形成する。 First, a bonded substrate G in which the first substrate G1 and the second substrate G2 are bonded is prepared, and the surface of the first substrate G1 (the surface on the side where the second substrate G2 is not bonded is prepared by a scribe line forming device not shown. ), the scribe line S is formed.

次に、貼り合わせ基板Ｇをテーブル２の載置面に載置する。ここで、貼り合わせ基板Ｇをテーブル２上に載置する際には、以下のようにして載置する。すなわち、図１に示すように、表面にスクライブラインＳが形成された第１基板Ｇ１が上方に位置するように、かつスクライブラインＳ及び端部（端材ＧＬとなる部分）が、テーブル２の載置面からさらに外側に位置するように、貼り合わせ基板Ｇを配置する。さらに、端材ＧＬが、押圧部１１の真下に位置するように配置する。 Next, the bonded substrate G is mounted on the mounting surface of the table 2. Here, when mounting the bonded substrate G on the table 2, it is mounted as follows. That is, as shown in FIG. 1, the scribe line S and the end portion (portion to be the end material GL) of the table 2 are arranged so that the first substrate G1 on which the scribe line S is formed is located above. The bonded substrate G is arranged so as to be located further outside from the mounting surface. Further, the scrap material GL is arranged so as to be located directly below the pressing portion 11.

次に、図２に示すように、押圧部１１を下降させ、押圧面１１ａによって端材ＧＬを下方に押圧する。このとき、端材ＧＬの下方にはテーブル２の載置面が存在しないので、押圧部１１により端材ＧＬ部分を押圧することによって、第１基板Ｇ１において、スクライブラインＳの直下に形成されていたクラックが基板厚さ方向に伸展し、端材ＧＬがフルカットされる。 Next, as shown in FIG. 2, the pressing portion 11 is lowered and the end surface GL is pressed downward by the pressing surface 11a. At this time, since the mounting surface of the table 2 does not exist below the end material GL, the pressing portion 11 presses the end material GL portion so that the first substrate G1 is formed immediately below the scribe line S. The cracks extend in the thickness direction of the substrate, and the mill ends GL are fully cut.

その後、図３に示すように、押圧部１１を上昇させ、ガス供給装置３３からノズル３１にガスを供給して、ガスの流れＦＬを発生させる。ノズル３１が、本体部の端部近傍（又は主面）に対して斜め（すなわち、垂直でない角度）に向いて配置されているので、ガスの流れＦＬは、第１基板Ｇ１の主面と平行な成分を有する。 After that, as shown in FIG. 3, the pressing portion 11 is raised, gas is supplied from the gas supply device 33 to the nozzle 31, and a gas flow FL is generated. Since the nozzle 31 is arranged obliquely (that is, not at a vertical angle) with respect to the vicinity of the end (or the main surface) of the main body, the gas flow FL is parallel to the main surface of the first substrate G1. It has various ingredients.

上記のガスの流れＦＬの第１基板Ｇ１の主面と平行な成分の風圧により、端材ＧＬは、図４に示すように、第１基板Ｇ１の本体部から切り離されて、さらに、第１基板Ｇ１の本体部から遠ざかる方向へ移動する。 Due to the wind pressure of the component of the gas flow FL that is parallel to the main surface of the first substrate G1, the end material GL is separated from the main body portion of the first substrate G1 as shown in FIG. The substrate G1 moves in a direction away from the main body.

このようにして、ガスの流れＦＬにより、端材ＧＬを何らかの部材にて保持して移動させることなく、非接触にて、第１基板Ｇ１の本体部から分離できる。その結果、端材ＧＬの分離中に第２基板Ｇ２の露出させる面が端材ＧＬにより押圧されないので、端材ＧＬが当該露出面を損傷することがなくなる。 In this way, the gas flow FL allows the end material GL to be separated from the main body of the first substrate G1 in a non-contact manner without being held and moved by any member. As a result, the exposed surface of the second substrate G2 is not pressed by the end material GL during the separation of the end material GL, so that the end material GL does not damage the exposed surface.

［他の実施形態］
本発明は以上のような実施形態に限定されるものではなく、本発明の範囲を逸脱することなく種々の変形又は修正が可能である。 [Other Embodiments]
The present invention is not limited to the above embodiments, and various changes or modifications can be made without departing from the scope of the present invention.

前記実施形態では、端材ＧＬを移動させるためのガスとして、空気又は窒素が用いられていたが、端材ＧＬの分離が行われる環境（雰囲気）に応じて、他のガス（例えば、アルゴンなどの不活性ガス）を用いることもできる。 In the above-described embodiment, air or nitrogen is used as the gas for moving the mill ends GL, but other gas (for example, argon, etc.) is used depending on the environment (atmosphere) in which the mill ends GL are separated. Inert gas) can also be used.

１ 押圧装置
１１ 押圧部
１１ａ 押圧面
２ テーブル
３ ブロー装置
３１ ノズル
３３ ガス供給装置
ＦＬ ガスの流れ
Ｇ 貼り合わせ基板
Ｇ１ 第１基板
Ｇ２ 第２基板
ＧＬ 端材
Ｓ スクライブライン 1 Pressing Device 11 Pressing Part 11a Pressing Surface 2 Table 3 Blowing Device 31 Nozzle 33 Gas Supply Device FL Gas Flow G Bonded Substrate G1 First Substrate G2 Second Substrate GL End Material S Scribe Line

Claims (4)

端部を切り離すためのスクライブラインが表面に形成された第１基板と、前記第１基板の裏面に貼り合わされた第２基板とを有する、貼り合わせ基板の分断装置であって、
前記貼り合わせ基板を支持するテーブルと、
前記第１基板側から前記端部を押圧することで、前記端部を前記スクライブラインに沿って分断する押圧装置と、
ガスの流れを発生することで、前記端部を前記第１基板の本体部から剥がして移動させるブロー装置と、
を備えた基板分断装置。 What is claimed is: 1. A bonded substrate cutting apparatus, comprising: a first substrate having a scribe line for cutting off an end formed on a front surface thereof; and a second substrate bonded to a back surface of the first substrate,
A table for supporting the bonded substrate,
A pressing device that divides the end portion along the scribe line by pressing the end portion from the first substrate side;
A blowing device that peels and moves the end portion from the main body portion of the first substrate by generating a gas flow;
Substrate cutting device equipped with. 前記ブロー装置は、前記本体部において前記端部の上方に配置され、前記本体部の前記端部近傍に対して斜めに向いたノズルを有している、請求項１に記載の基板分断装置。 The substrate cutting device according to claim 1, wherein the blower has a nozzle that is disposed above the end portion of the main body portion and that is obliquely oriented with respect to the vicinity of the end portion of the main body portion. 端部を切り離すためのスクライブラインが表面に形成された第１基板と、前記第１基板の裏面に貼り合わされた第２基板とを有する、貼り合わせ基板の分断方法であって、
前記貼り合わせ基板をテーブルに載置する載置ステップと、
前記第１基板側から前記端部を押圧することで、前記端部を前記スクライブラインに沿って分断する分断ステップと、
ガスの流れを発生することで、前記端部を前記第１基板の本体部から剥がして移動させるブローステップと、
を備えた基板分断方法。 A method for cutting a bonded substrate, comprising: a first substrate having a scribe line formed on a front surface for separating an end portion; and a second substrate bonded to a back surface of the first substrate,
A mounting step of mounting the bonded substrate on a table;
A dividing step of dividing the end portion along the scribe line by pressing the end portion from the first substrate side;
A blow step of peeling and moving the end portion from the main body portion of the first substrate by generating a gas flow;
A substrate cutting method comprising: 前記ブローステップは、前記本体部において前記端部から離れた位置の上方から、前記本体部の端部近傍に対して斜めにガスの流れを当てる、請求項３に記載の基板分断方法。 The substrate cutting method according to claim 3, wherein in the blowing step, a gas flow is obliquely applied to the vicinity of the end of the main body from above a position separated from the end of the main body.
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