JP6732131B2 - 半導体デバイス及び半導体デバイスを設計する方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 90
- 238000000034 method Methods 0.000 title claims description 20
- 230000004888 barrier function Effects 0.000 claims description 150
- 239000000463 material Substances 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 15
- 229910002601 GaN Inorganic materials 0.000 claims 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 3
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 claims 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical group [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 264
- 230000000694 effects Effects 0.000 description 19
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 229910002704 AlGaN Inorganic materials 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
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- 239000013078 crystal Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000000927 vapour-phase epitaxy Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
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- 238000005468 ion implantation Methods 0.000 description 1
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- 230000007246 mechanism Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- 239000002356 single layer Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
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Description
基板層10:SiC
バックバリア層11:1×1017cm−3のドーピング密度を有する1.8μm p−GaN
意図的にドープされていない(UID)バッファー層12:0.2μm UID−GaN層
n型デルタドープ半導体層13:6×1019cm−3のドーピング密度を有する1nm n−GaN
意図的にドープされていない(UID)チャネル層14:25nm UID−GaN層
意図的にドープされていないバリア層15:3nm UID−Al0.3Ga0.7N層
nドープバリア層16:2×1018cm−3のドーピング密度を有する13nm又は20nm n−Al0.3Ga0.7N層
意図的にドープされていないバリア層17:2nm UID−Al0.3Ga0.7N層
誘電体層18:0.5μm Si3N4
層17とゲート電極の下側との間の距離H1:0.1μm
ソース電極S1/ドレイン電極D1高さH2:0.2μm
ゲート電極G1高さH3:0.3μm
T字型ゲート電極の左部分Lg1の厚さ:0.05μm
T字型ゲート電極の中心部分Lg2の厚さ:0.2μm
T字型ゲート電極の右部分Lg3の厚さ:0.1μm
Claims (19)
- キャリア電荷を有するキャリアチャネルを形成する、第1のドープ層を含む半導体構造と、
前記第1のドープ層の導電型に等しい導電型を有する第2のドープ層であって、前記第2のドープ層は、4×1019cm−3から6×1019cm−3までの範囲のn型ドーピング密度を有するデルタドーピング(δ−ドーピング)層である、前記第2のドープ層と、
前記第2のドープ層を介して前記半導体構造に近接して配置されたバリア層であって、前記第2のドープ層の前記導電型とは反対の導電型を有する部分的にドープされた層を含む、バリア層と、
前記キャリアチャネルにおける前記キャリア電荷を提供しかつ制御する一組の電極と
を備えた、半導体デバイス。 - 前記第2のドープ層は、前記バリア層の前記部分的にドープされた層のドーピング密度より大きいn型ドーピング密度を有するデルタドーピング(δ−ドーピング)層である、
請求項1に記載の半導体デバイス。 - 前記第2のドープ層は、前記第1のドープ層のドーピング密度より大きいn型ドーピング密度を有するデルタドーピング(δ−ドーピング)層である、
請求項1に記載の半導体デバイス。 - 前記第1のドープ層の厚さは、前記第2のドープ層の厚さより大きい、
請求項1に記載の半導体デバイス。 - 前記部分的にドープされた層の厚さは、前記第2のドープ層の厚さより大きい、
請求項1に記載の半導体デバイス。 - 前記第2のドープ層は、10nmから30nmまでの範囲で前記キャリアチャネルの前記キャリア電荷から離れて配置されている、
請求項1に記載の半導体デバイス。 - 前記キャリアチャネルは、20nmから30nmまでの範囲の厚さを有するアンドープチャネル層から形成されている、
請求項1に記載の半導体デバイス。 - 前記バリア層における前記部分的にドープされた層のドーピング密度は、5×1016cm−3から5×1017cm−3までの範囲である、
請求項1に記載の半導体デバイス。 - 前記バリア層は、100nmから200nmまでの範囲の厚さを有する意図的にドープされていない層を含み、該意図的にドープされていない層は、前記第2のドープ層と前記部分的にドープされた層との間に配置されている、
請求項1に記載の半導体デバイス。 - 前記半導体構造は、
前記キャリアチャネルを形成するアンドープチャネル層と、
アンドープ最上部バリア層であって、前記第1のドープ層から前記キャリアチャネルに前記キャリア電荷を提供するために、該第1のドープ層が該アンドープ最上部バリア層間に配置されている、アンドープ最上部バリア層と
を備えた、請求項1に記載の半導体デバイス。 - 前記アンドープチャネル層の材料及び前記第2のドープ層の材料は、同一の材料から形成されている、
請求項10に記載の半導体デバイス。 - 前記半導体構造は、III−V族チャネル層と前記第1のドープ層を有するIII−V族バリア層とを含む半導体ヘテロ構造であり、前記III−V族バリア層のバンドキャップは、前記III−V族チャネル層のバンドギャップより大きく、それにより、前記キャリア電荷は、前記III−V族バリア層の前記第1のドープ層から前記III−V族チャネル層に提供される、
請求項1に記載の半導体デバイス。 - 前記III−V族チャネル層の材料は、窒化ガリウム(GaN)及び窒化インジウムガリウム(InGaN)のうちの一方又はそれらの組合せを含み、III−V族バリア層の材料は、窒化アルミニウムガリウム(AlGaN)、窒化インジウムアルミニウム(InAlN)、窒化アルミニウム(AlN)及び窒化インジウムアルミニウムガリウム(InAlGaN)のうちの1つ又はそれらの組合せを備えた、
請求項12に記載の半導体デバイス。 - チャネル層とキャリア電荷を提供する第1のバリア層とを含む半導体構造であって、前記チャネル層はアンドープ層であり、前記第1のバリア層は、アンドープバリア、第1のn型ドープバリア及び別のアンドープバリアからなる、半導体構造と、
前記チャネルに隣接する第2のn型ドープ層であって、前記第2のn型ドープ層は、4×1019cm−3から6×1019cm−3までの範囲のn型ドーピング密度を有するデルタドーピング(δ−ドーピング)層である、前記第2のn型ドープ層と、
前記第2のn型ドープ層を介して前記半導体構造に近接して配置された第2のバリア層であって、少なくとも部分的にp型ドープされた層を含む、第2のバリア層と、
キャリアチャネルにおける前記キャリア電荷を制御する一組の電極と
を備えた、半導体デバイス。 - チャネル層とキャリア電荷を提供する第1のバリア層とを含むIII−V族半導体ヘテロ構造を選択することであって、前記チャネル層はアンドープ層であり、前記第1のバリア層は、アンドープバリア、第1のn型ドープバリア及び別のアンドープバリアからなり、前記第1のバリア層の材料のバンドギャップは、前記チャネル層の材料のバンドギャップより大きいように選択される、選択することと、
前記チャネル層に隣接して第2のn型ドープ層を配置することであって、前記第2のn型ドープ層は、4×1019cm−3から6×1019cm−3までの範囲のn型ドーピング密度を有するデルタドーピング(δ−ドーピング)層である、前記第2のn型ドープ層を配置することと、
前記第2のn型ドープ層を介して前記チャネル層に近接してIII−V族半導体の第2のバリア層を選択することであって、該第2のバリア層は部分的にp型ドープされた層を含む、選択することと、
キャリアチャネルにおける前記キャリア電荷を制御する一組の電極を提供することと
を備えた、半導体デバイスを設計する方法。 - 前記第1のバリア層及び前記第2のバリア層の材料は、該第1のバリア層及び該第2のバリア層の格子定数と前記チャネル層の格子定数との間の格子不整合が、該チャネル層の前記格子定数のおよそ±1パーセントの範囲にあるように選択される、請求項15に記載の方法。
- 前記第2のバリア層を支持する基板を、該基板の熱伝導率が前記チャネル層並びに前記第1のバリア層及び前記第2のバリア層の材料のうちの少なくとも1つより大きいように選択すること、
を更に含む、請求項15に記載の方法。 - 前記チャネル層は、第1の伝導帯端及び第2の伝導帯端を有し、平衡状態で、フェルミ準位からの前記第1の伝導帯端の距離は、該フェルミ準位からの前記第2の伝導帯端の距離より大きいように選択される、請求項15に記載の方法。
- 前記第1の伝導帯端は、前記バリア層のうちの1つの伝導帯に接続され、前記第2の伝導帯端は、前記第2のn型ドープ層の伝導帯と接続される、請求項18に記載の方法。
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