JP6730125B2 - 計測装置 - Google Patents

計測装置 Download PDF

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Publication number
JP6730125B2
JP6730125B2 JP2016151159A JP2016151159A JP6730125B2 JP 6730125 B2 JP6730125 B2 JP 6730125B2 JP 2016151159 A JP2016151159 A JP 2016151159A JP 2016151159 A JP2016151159 A JP 2016151159A JP 6730125 B2 JP6730125 B2 JP 6730125B2
Authority
JP
Japan
Prior art keywords
light
wafer
wavelength
optical fiber
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016151159A
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English (en)
Japanese (ja)
Other versions
JP2018021761A (ja
Inventor
圭司 能丸
圭司 能丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2016151159A priority Critical patent/JP6730125B2/ja
Priority to TW106121252A priority patent/TWI731993B/zh
Priority to CN201710623218.6A priority patent/CN107677210B/zh
Priority to KR1020170096006A priority patent/KR102309389B1/ko
Publication of JP2018021761A publication Critical patent/JP2018021761A/ja
Application granted granted Critical
Publication of JP6730125B2 publication Critical patent/JP6730125B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2016151159A 2016-08-01 2016-08-01 計測装置 Active JP6730125B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016151159A JP6730125B2 (ja) 2016-08-01 2016-08-01 計測装置
TW106121252A TWI731993B (zh) 2016-08-01 2017-06-26 測量裝置
CN201710623218.6A CN107677210B (zh) 2016-08-01 2017-07-27 测量装置
KR1020170096006A KR102309389B1 (ko) 2016-08-01 2017-07-28 계측 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016151159A JP6730125B2 (ja) 2016-08-01 2016-08-01 計測装置

Publications (2)

Publication Number Publication Date
JP2018021761A JP2018021761A (ja) 2018-02-08
JP6730125B2 true JP6730125B2 (ja) 2020-07-29

Family

ID=61134141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016151159A Active JP6730125B2 (ja) 2016-08-01 2016-08-01 計測装置

Country Status (4)

Country Link
JP (1) JP6730125B2 (zh)
KR (1) KR102309389B1 (zh)
CN (1) CN107677210B (zh)
TW (1) TWI731993B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102421732B1 (ko) * 2018-04-20 2022-07-18 삼성전자주식회사 반도체 기판 측정 장치 및 이를 이용한 플라즈마 처리 장치
JP2022514180A (ja) * 2018-11-07 2022-02-10 アプライド マテリアルズ インコーポレイテッド 導波計測のための方法及び装置
JP7481090B2 (ja) * 2019-01-09 2024-05-10 株式会社ディスコ 厚み計測装置、及び厚み計測装置を備えた加工装置

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61165608A (ja) * 1985-01-18 1986-07-26 Hitachi Ltd 膜厚測定装置
JPH1076464A (ja) * 1996-08-30 1998-03-24 Canon Inc 研磨方法及びそれを用いた研磨装置
JP3774094B2 (ja) * 1999-12-02 2006-05-10 株式会社日立製作所 膜厚、加工深さ測定装置及び成膜加工方法
JP2002005823A (ja) * 2000-06-19 2002-01-09 Dainippon Screen Mfg Co Ltd 薄膜測定装置
US6891627B1 (en) * 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
JP2003075120A (ja) * 2001-09-07 2003-03-12 Fuji Photo Film Co Ltd 寸法測定装置およびロール巻取り装置
US7113624B2 (en) * 2002-10-15 2006-09-26 Palo Alto Research Center Incorporated Imaging apparatus and method employing a large linear aperture
CN2648401Y (zh) * 2003-10-15 2004-10-13 浙江工程学院 磁悬浮微运动平台高度测量与校正装置
EP2270447A1 (en) * 2003-10-27 2011-01-05 The General Hospital Corporation Method and apparatus for performing optical imaging using frequency-domain interferometry
JP2005221401A (ja) * 2004-02-06 2005-08-18 Dainippon Printing Co Ltd 膜厚測定方法および装置
CN1252445C (zh) * 2004-04-12 2006-04-19 浙江大学 一种金属薄带厚度的测量方法及测量装置
EP1853874B1 (en) * 2005-01-20 2009-09-02 Zygo Corporation Interferometer for determining characteristics of an object surface
US7379189B2 (en) * 2005-02-08 2008-05-27 Tokyo Electron Limited Temperature/thickness measuring apparatus, temperature/thickness measuring method, temperature/thickness measuring system, control system and control method
CN101017083A (zh) * 2006-02-08 2007-08-15 财团法人工业技术研究院 高密度多通道检测装置
KR100947464B1 (ko) * 2008-02-13 2010-03-17 에스엔유 프리시젼 주식회사 두께 측정장치
JP5649286B2 (ja) * 2008-12-26 2015-01-07 キヤノン株式会社 光断層撮像装置、被検査物の画像を撮る撮像装置、光断層撮像装置の制御方法及びそのコンピュータプログラム
JP2011102751A (ja) * 2009-11-11 2011-05-26 Seiko Epson Corp 複屈折基板の板厚測定法及び板厚測定装置
JP5443180B2 (ja) * 2010-01-13 2014-03-19 株式会社ディスコ 厚み検出装置および研削機
CN101825434B (zh) * 2010-04-28 2011-09-14 东北大学 一种基于闪耀光纤光栅解调的微位移传感器及检测方法
WO2011144624A1 (en) * 2010-05-18 2011-11-24 Marposs Societa' Per Azioni Method and apparatus for optically measuring by interferometry the thickness of an object
US20110304854A1 (en) * 2010-06-14 2011-12-15 Si Li Instantaneous, phase measuring interferometer apparatus and method
JP2012021856A (ja) * 2010-07-14 2012-02-02 Keyence Corp 干渉膜厚計
CN101922919B (zh) * 2010-09-07 2013-06-19 西安工业大学 一种光学零件几何参数非接触测量方法及其测量装置
JP5980476B2 (ja) * 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
JP5752961B2 (ja) * 2011-03-11 2015-07-22 株式会社ディスコ 計測装置
TWI458960B (zh) * 2012-03-20 2014-11-01 Univ Minghsin Sci & Tech 白光干涉量測裝置及其干涉量測方法
CN103134436B (zh) * 2013-02-04 2015-06-03 博奥生物集团有限公司 全光谱超分辨率测量方法及非标记生物分子测量系统
TWI499756B (zh) * 2013-05-10 2015-09-11 Ind Tech Res Inst 接合層的厚度量測系統與方法
JP6299500B2 (ja) * 2014-01-29 2018-03-28 株式会社東京精密 多点距離測定装置及び方法並びに形状測定装置
CN103940352B (zh) * 2014-04-25 2017-01-04 广州飞拓优视光电科技有限公司 一种超高精度结冰探测装置及其实时探测结冰厚度方法
CN204043623U (zh) * 2014-08-25 2014-12-24 光库通讯(珠海)有限公司 薄膜厚度测量装置
JP2016080668A (ja) * 2014-10-22 2016-05-16 株式会社島津製作所 表面処理状況モニタリング装置及び表面処理状況モニタリング方法
CN205003080U (zh) * 2015-07-03 2016-01-27 南京航空航天大学 基于谱域干涉仪的折射率和厚度同步测量系统

Also Published As

Publication number Publication date
CN107677210A (zh) 2018-02-09
CN107677210B (zh) 2020-12-22
TWI731993B (zh) 2021-07-01
TW201805590A (zh) 2018-02-16
KR20180014668A (ko) 2018-02-09
JP2018021761A (ja) 2018-02-08
KR102309389B1 (ko) 2021-10-05

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