JP6728760B2 - 支持体付き樹脂シート - Google Patents

支持体付き樹脂シート Download PDF

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Publication number
JP6728760B2
JP6728760B2 JP2016034435A JP2016034435A JP6728760B2 JP 6728760 B2 JP6728760 B2 JP 6728760B2 JP 2016034435 A JP2016034435 A JP 2016034435A JP 2016034435 A JP2016034435 A JP 2016034435A JP 6728760 B2 JP6728760 B2 JP 6728760B2
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JP
Japan
Prior art keywords
resin
resin composition
support
mass
layer
Prior art date
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Active
Application number
JP2016034435A
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English (en)
Japanese (ja)
Other versions
JP2017149861A (ja
Inventor
弘久 奈良橋
弘久 奈良橋
中村　茂雄
茂雄 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2016034435A priority Critical patent/JP6728760B2/ja
Priority to TW106103497A priority patent/TWI726988B/zh
Priority to CN201710092385.2A priority patent/CN107118515B/zh
Priority to KR1020170023675A priority patent/KR102656740B1/ko
Publication of JP2017149861A publication Critical patent/JP2017149861A/ja
Application granted granted Critical
Publication of JP6728760B2 publication Critical patent/JP6728760B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
JP2016034435A 2016-02-25 2016-02-25 支持体付き樹脂シート Active JP6728760B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016034435A JP6728760B2 (ja) 2016-02-25 2016-02-25 支持体付き樹脂シート
TW106103497A TWI726988B (zh) 2016-02-25 2017-02-02 附支撐體之樹脂薄片
CN201710092385.2A CN107118515B (zh) 2016-02-25 2017-02-21 带支撑体的树脂片
KR1020170023675A KR102656740B1 (ko) 2016-02-25 2017-02-22 지지체 부착 수지 시트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016034435A JP6728760B2 (ja) 2016-02-25 2016-02-25 支持体付き樹脂シート

Publications (2)

Publication Number Publication Date
JP2017149861A JP2017149861A (ja) 2017-08-31
JP6728760B2 true JP6728760B2 (ja) 2020-07-22

Family

ID=59717178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016034435A Active JP6728760B2 (ja) 2016-02-25 2016-02-25 支持体付き樹脂シート

Country Status (4)

Country Link
JP (1) JP6728760B2 (zh)
KR (1) KR102656740B1 (zh)
CN (1) CN107118515B (zh)
TW (1) TWI726988B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018164259A1 (ja) * 2017-03-10 2018-09-13 積水化学工業株式会社 樹脂材料、積層フィルム及び多層プリント配線板
JP2019157027A (ja) * 2018-03-15 2019-09-19 日立化成株式会社 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法
JP6992635B2 (ja) * 2018-03-22 2022-01-13 味の素株式会社 樹脂組成物
JP7196551B2 (ja) * 2018-11-14 2022-12-27 味の素株式会社 支持体付き樹脂シート及び樹脂組成物層
JP2020094089A (ja) * 2018-12-10 2020-06-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7363182B2 (ja) * 2019-08-09 2023-10-18 味の素株式会社 感光性樹脂組成物、感光性樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
WO2021108955A1 (zh) * 2019-12-02 2021-06-10 中国科学院深圳先进技术研究院 一种高频低损耗绝缘胶膜材料及其制备方法
JP7435165B2 (ja) 2020-03-30 2024-02-21 味の素株式会社 プリント配線板の製造方法
WO2022196617A1 (ja) * 2021-03-17 2022-09-22 Ａｇｃ株式会社 金属張積層板および配線基板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200668A (ja) * 2002-12-03 2004-07-15 Sanyo Electric Co Ltd 半導体装置およびその製造方法ならびに薄板状配線部材
TWI234210B (en) * 2002-12-03 2005-06-11 Sanyo Electric Co Semiconductor module and manufacturing method thereof as well as wiring member of thin sheet
JP4825286B2 (ja) * 2009-08-07 2011-11-30 ナミックス株式会社 多層配線板の製造方法
JP2013077590A (ja) * 2011-09-29 2013-04-25 Tamura Seisakusho Co Ltd 層間絶縁用の樹脂フィルムおよびビルドアップ配線基板
JP6011079B2 (ja) * 2012-07-05 2016-10-19 味の素株式会社 支持体付き樹脂シート
JP6044139B2 (ja) 2012-07-06 2016-12-14 味の素株式会社 絶縁樹脂シート
JP6098988B2 (ja) * 2012-09-28 2017-03-22 味の素株式会社 支持体含有プレポリマーシート
WO2015050080A1 (ja) * 2013-10-03 2015-04-09 株式会社クラレ 熱可塑性液晶ポリマーフィルム、回路基板、およびそれらの製造方法
JP5828881B2 (ja) * 2013-12-24 2015-12-09 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
JP6164113B2 (ja) * 2014-02-19 2017-07-19 味の素株式会社 支持体付き樹脂シート
JP6761224B2 (ja) * 2014-02-19 2020-09-23 味の素株式会社 プリント配線板、半導体装置及び樹脂シートセット
JP2016035969A (ja) * 2014-08-01 2016-03-17 味の素株式会社 回路基板及びその製造方法

Also Published As

Publication number Publication date
CN107118515B (zh) 2021-01-01
CN107118515A (zh) 2017-09-01
KR20170100434A (ko) 2017-09-04
JP2017149861A (ja) 2017-08-31
TWI726988B (zh) 2021-05-11
TW201801589A (zh) 2018-01-01
KR102656740B1 (ko) 2024-04-15

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