JP6722298B2 - 成膜装置、マスクフレーム、アライメント方法 - Google Patents

成膜装置、マスクフレーム、アライメント方法 Download PDF

Info

Publication number
JP6722298B2
JP6722298B2 JP2018553171A JP2018553171A JP6722298B2 JP 6722298 B2 JP6722298 B2 JP 6722298B2 JP 2018553171 A JP2018553171 A JP 2018553171A JP 2018553171 A JP2018553171 A JP 2018553171A JP 6722298 B2 JP6722298 B2 JP 6722298B2
Authority
JP
Japan
Prior art keywords
mask frame
alignment
mask
film forming
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018553171A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2019003827A1 (ja
Inventor
高橋 誠
誠 高橋
豪 清水
豪 清水
吉田 大介
大介 吉田
明 湯山
明 湯山
雄亮 佐藤
雄亮 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of JPWO2019003827A1 publication Critical patent/JPWO2019003827A1/ja
Application granted granted Critical
Publication of JP6722298B2 publication Critical patent/JP6722298B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2018553171A 2017-06-30 2018-06-05 成膜装置、マスクフレーム、アライメント方法 Active JP6722298B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017129466 2017-06-30
JP2017129466 2017-06-30
PCT/JP2018/021552 WO2019003827A1 (ja) 2017-06-30 2018-06-05 成膜装置、マスクフレーム、アライメント方法

Publications (2)

Publication Number Publication Date
JPWO2019003827A1 JPWO2019003827A1 (ja) 2019-06-27
JP6722298B2 true JP6722298B2 (ja) 2020-07-15

Family

ID=64741537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018553171A Active JP6722298B2 (ja) 2017-06-30 2018-06-05 成膜装置、マスクフレーム、アライメント方法

Country Status (5)

Country Link
JP (1) JP6722298B2 (zh)
KR (1) KR102153644B1 (zh)
CN (1) CN109429499A (zh)
TW (1) TWI673375B (zh)
WO (1) WO2019003827A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102676831B1 (ko) * 2023-11-14 2024-06-20 파인원 주식회사 블랭크-존 코팅이 가능한 마스크용 트레이 시스템

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS539150B1 (zh) 1970-12-30 1978-04-04
JPS5347683A (en) 1976-10-12 1978-04-28 Nippon Steel Corp Cargo forwarding and receiving system
JP3200265B2 (ja) * 1993-11-30 2001-08-20 キヤノン株式会社 マスク保持方法とマスク、並びにこれを用いたデバイス製造方法
JP4890833B2 (ja) 2005-10-27 2012-03-07 株式会社日立国際電気 基板処理装置
WO2007094407A1 (ja) * 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
JP5074368B2 (ja) 2008-12-15 2012-11-14 株式会社日立ハイテクノロジーズ 成膜装置
JP5337632B2 (ja) * 2009-02-13 2013-11-06 株式会社日立ハイテクノロジーズ 成膜装置及び有機elデバイス製造装置
JP5232112B2 (ja) * 2009-09-17 2013-07-10 株式会社日立ハイテクノロジーズ 成膜装置
JP5639431B2 (ja) * 2010-09-30 2014-12-10 キヤノントッキ株式会社 成膜装置
KR101365078B1 (ko) * 2011-01-28 2014-02-20 주식회사 에스에프에이 진공 증착 시스템
CN103383531B (zh) * 2012-05-02 2016-07-06 上海微电子装备有限公司 掩模对准装置及使用该装置的光刻设备
JP2013237914A (ja) * 2012-05-17 2013-11-28 Hitachi High-Technologies Corp 成膜装置及び成膜方法

Also Published As

Publication number Publication date
CN109429499A (zh) 2019-03-05
TW201907028A (zh) 2019-02-16
JPWO2019003827A1 (ja) 2019-06-27
WO2019003827A1 (ja) 2019-01-03
KR20190013733A (ko) 2019-02-11
KR102153644B1 (ko) 2020-09-09
TWI673375B (zh) 2019-10-01

Similar Documents

Publication Publication Date Title
KR100948205B1 (ko) 스퍼터링 장치
US7229532B2 (en) Sputtering apparatus
WO2016152395A1 (ja) 成膜装置及び成膜ワーク製造方法
US9721771B2 (en) Film forming apparatus
WO2016047486A1 (ja) Xyステージ、アライメント装置、蒸着装置
JP2006330656A (ja) 液晶配向膜用真空蒸着装置およびその成膜方法
JP7450372B2 (ja) 成膜装置、成膜方法、及び電子デバイスの製造方法
JP4679172B2 (ja) 表示用パネル基板の露光装置、表示用パネル基板の露光方法、及び表示用パネル基板の製造方法
JP6722298B2 (ja) 成膜装置、マスクフレーム、アライメント方法
KR102590797B1 (ko) 흡착 시스템, 흡착 방법, 및 이를 이용한 성막 장치, 성막 방법, 전자 디바이스의 제조 방법
JP6742513B2 (ja) スパッタリング装置
JP7048696B2 (ja) 成膜装置
KR20200069817A (ko) 정전척, 정전척 시스템, 성막 장치, 흡착 방법, 성막 방법 및 전자 디바이스의 제조 방법
CN111434797B (zh) 成膜装置以及电子器件的制造装置
TWI684659B (zh) 成膜裝置
JP7051969B2 (ja) 成膜装置
KR20200034455A (ko) 정전척 시스템, 성막 장치, 피흡착체 분리방법, 성막 방법 및 전자 디바이스의 제조방법
KR102717514B1 (ko) 얼라인먼트 장치, 성막 장치 및 조정 방법
JP2008291294A (ja) 真空成膜装置
JP2024024380A (ja) 基板処理装置
KR100773466B1 (ko) 요축 및 피치축 각도 조절이 가능한 박막증착장치
JP2020111823A (ja) 成膜装置及び電子デバイスの製造装置
JPH03160719A (ja) エッチング装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20181009

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190709

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190905

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200128

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200317

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200602

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200619

R150 Certificate of patent or registration of utility model

Ref document number: 6722298

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250