JP6719514B2 - 構造的に硬質の耐摩耗金属コーティングの基板上への堆積 - Google Patents
構造的に硬質の耐摩耗金属コーティングの基板上への堆積 Download PDFInfo
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- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/1601—Process or apparatus
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- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
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- C23C18/22—Roughening, e.g. by etching
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
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- C25D3/00—Electroplating: Baths therefor
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- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Description
1.基板を洗浄すること;基板を洗浄した後で、塩化スズ及び塩酸を含む感光液を用いて基板を感光性にすること;基板を感光性にした後で、塩化パラジウム及び塩酸を含む活性化溶液中で基板を活性化すること;その後水酸化アンモニウムを含む中和溶液を用いて基板を中和すること;並びに基板を中和した後で、基板上に無電解ニッケル層を堆積させることを含む、基板のコーティング方法。
2.基板が非導電性である、条項1の方法。
3.基板が繊維強化プラスチックを含む、条項2の方法。
4.基板がエンジニアリングプラスチックを含む、条項2の方法。
5.感光液が、5g/1から15g/lの塩化スズと20ml/lから60ml/lの塩酸とを含む、条項1から4のいずれか一つの方法。
6.活性化溶液が、0.25g/lから1.5g/lの塩化パラジウムと5ml/lから15ml/lの塩酸とを含む、条項1から5のいずれか一つの方法。
7.基板を洗浄することが:研磨紙を用いて基板を研磨すること;アセトン、ハイドロキノン、及びカテコール(cathecol)を含む第1の酸性溶液に基板を浸漬すること;水中で基板をすすぐこと;並びにリン酸及び重クロム酸カリウムを含む第2の酸性溶液に基板を浸漬することを含む、条項1から6のいずれか一つの方法。
8.金属材料、セラミック材料、ポリマー材料、又はこれらのいずれかの組み合わせの外層を基板上に堆積させることを更に含む、条項1から7のいずれか一つの方法。
9.外層が鉄−リン合金を含む、条項8の方法。
10.外層がニッケル−コバルト−リン合金を含む、条項8の方法。
11.外層がコバルト−リン合金を含む、条項8の方法。
12.外層がクロムを含む、条項8の方法。
13.基板を洗浄すること;基板を洗浄した後で、塩化スズ及び塩酸を含む感光液を用いて基板を感光性にすること;基板を感光性にした後で、塩化パラジウム及び塩酸を含む活性化溶液中で基板を活性化すること;その後水酸化アンモニウムを含む中和溶液を用いて基板を中和すること;基板を中和した後で、基板上に無電解ニッケル層を堆積させること;無電解ニッケル層の上に電解ニッケル層を堆積させること;並びに金属材料、セラミック材料、ポリマー材料、又はこれらのいずれかの組み合わせの外層を、電解ニッケル層の上に堆積させることを含む、基板のコーティング方法。
14.基板が非導電性である、条項13の方法。
15.基板が繊維強化プラスチックを含む、条項14の方法。
16.基板がエンジニアリングプラスチックを含む、条項14の方法。
17.感光液が、5g/1から15g/lの塩化スズと20ml/lから60ml/lの塩酸とを含む、条項13から16のいずれか一つの方法。
18.活性化溶液が、0.25g/lから1.5g/lの塩化パラジウムと5ml/lから30ml/lの塩酸とを含む、条項13から17のいずれか一つの方法。
19.基板を洗浄すること;基板を洗浄した後で、塩化スズ及び塩酸を含む感光液を用いて基板を感光性にすること;基板を感光性にした後で、塩化パラジウム及び塩酸を含む活性化溶液中で基板を活性化すること;並びに、その後水酸化アンモニウムを含む中和溶液を用いて基板を中和することを含む、コーティングのために基板を準備する方法。
20.感光液が、5g/1から15g/lの塩化スズと20ml/lから60ml/lの塩酸とを含み、活性化溶液が、0.25g/lから1.5g/lの塩化パラジウムと5ml/lから30ml/lの塩酸とを含む、条項19の方法。
Claims (13)
- 基板を洗浄すること(102);
基板を洗浄した後で、塩化スズ及び塩酸を含む感光液を用いて基板を感光性にすること(104);
基板を感光性にした後で、塩化パラジウム及び塩酸を含む活性化溶液中で基板を活性化すること(106);並びに
その後水酸化アンモニウムを含む中和溶液を用いて基板を中和すること(108)
を含む基板のコーティング方法であって、
基板を洗浄すること(102)が:
研磨紙を用いて基板を研磨すること(111);
アセトン、ハイドロキノン、及びカテコール(cathecol)を含む第1の酸性溶液に基板を浸漬すること(112);
水中で基板をすすぐこと(114);並びに
リン酸及び重クロム酸カリウムを含む第2の酸性溶液に基板を浸漬すること(116)
を含む、方法。 - 基板が非導電性である、請求項1に記載の方法。
- 基板が繊維強化プラスチックを含む、請求項2に記載の方法。
- 基板がエンジニアリングプラスチックを含む、請求項2に記載の方法。
- 感光液が、5g/lから15g/lの塩化スズと20ml/lから60ml/lの塩酸とを含む、請求項1に記載の方法。
- 活性化溶液が、0.25g/lから1.5g/lの塩化パラジウムと5ml/lから15ml/lの塩酸とを含む、請求項1に記載の方法。
- 基板を中和した後で、基板上に無電解ニッケル層を堆積させること(110)を更に含む、請求項1から6のいずれか一項に記載の方法。
- 無電解ニッケル層の上に電解ニッケル層を堆積させることを更に含む、請求項1から7のいずれか一項に記載の方法。
- 金属材料、セラミック材料、ポリマー材料、又はこれらのいずれかの組み合わせの外層を基板上に堆積させること(118)を更に含む、請求項1から8のいずれか一項に記載の方法。
- 外層が鉄−リン合金を含む、請求項9に記載の方法。
- 外層がニッケル−コバルト−リン合金を含む、請求項9に記載の方法。
- 外層がコバルト−リン合金を含む、請求項9に記載の方法。
- 外層がクロムを含む、請求項9に記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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US15/688,337 US10787743B2 (en) | 2017-08-28 | 2017-08-28 | Depositing a structurally hard, wear resistant metal coating onto a substrate |
US15/688,337 | 2017-08-28 |
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JP2019090102A JP2019090102A (ja) | 2019-06-13 |
JP6719514B2 true JP6719514B2 (ja) | 2020-07-08 |
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JP2018152210A Active JP6719514B2 (ja) | 2017-08-28 | 2018-08-13 | 構造的に硬質の耐摩耗金属コーティングの基板上への堆積 |
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US (2) | US10787743B2 (ja) |
EP (1) | EP3450589B1 (ja) |
JP (1) | JP6719514B2 (ja) |
CN (1) | CN109423632B (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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DE1769258A1 (de) | 1967-05-03 | 1971-10-21 | Avisun Corp | Behandlungsbad fuer Kunststoffoberflaechen |
US3837733A (en) * | 1968-12-11 | 1974-09-24 | Martin Marietta Corp | Shiftable scanner aperture |
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CN109423632B (zh) | 2022-02-18 |
US20200255950A1 (en) | 2020-08-13 |
US11346001B2 (en) | 2022-05-31 |
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