JP6717934B2 - 透明導電性フィルム及びその製造方法 - Google Patents
透明導電性フィルム及びその製造方法 Download PDFInfo
- Publication number
- JP6717934B2 JP6717934B2 JP2018516348A JP2018516348A JP6717934B2 JP 6717934 B2 JP6717934 B2 JP 6717934B2 JP 2018516348 A JP2018516348 A JP 2018516348A JP 2018516348 A JP2018516348 A JP 2018516348A JP 6717934 B2 JP6717934 B2 JP 6717934B2
- Authority
- JP
- Japan
- Prior art keywords
- transparent conductive
- indium tin
- resin film
- dielectric layer
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 76
- 229920005989 resin Polymers 0.000 claims description 65
- 239000011347 resin Substances 0.000 claims description 65
- 239000002131 composite material Substances 0.000 claims description 54
- 238000000605 extraction Methods 0.000 claims description 41
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical group FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 claims description 34
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 27
- 125000004429 atom Chemical group 0.000 claims description 18
- 229920001225 polyester resin Polymers 0.000 claims description 14
- 238000004544 sputter deposition Methods 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 13
- 239000004645 polyester resin Substances 0.000 claims description 12
- 239000011368 organic material Substances 0.000 claims description 11
- 150000003949 imides Chemical class 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 239000012461 cellulose resin Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 229910010272 inorganic material Inorganic materials 0.000 claims description 5
- 239000011147 inorganic material Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000010408 film Substances 0.000 description 151
- -1 Aliphatic dicarboxylic acids Chemical class 0.000 description 30
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 29
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 18
- 230000003287 optical effect Effects 0.000 description 16
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 15
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 238000002834 transmittance Methods 0.000 description 14
- 229920002678 cellulose Polymers 0.000 description 13
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 239000002245 particle Substances 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 11
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 description 11
- 239000005020 polyethylene terephthalate Substances 0.000 description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000001913 cellulose Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 125000002252 acyl group Chemical group 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 8
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 8
- 229910001887 tin oxide Inorganic materials 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 150000002009 diols Chemical class 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 229920002799 BoPET Polymers 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 229910003437 indium oxide Inorganic materials 0.000 description 6
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 150000004985 diamines Chemical class 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 125000001153 fluoro group Chemical group F* 0.000 description 4
- 239000010954 inorganic particle Substances 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 3
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 3
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 125000004063 butyryl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 150000004665 fatty acids Chemical class 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 229920002301 cellulose acetate Polymers 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N dimethylmethane Natural products CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- QEWYKACRFQMRMB-UHFFFAOYSA-N fluoroacetic acid Chemical compound OC(=O)CF QEWYKACRFQMRMB-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 125000005185 naphthylcarbonyl group Chemical group C1(=CC=CC2=CC=CC=C12)C(=O)* 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
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- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
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- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- HFBHOAHFRNLZGN-LURJTMIESA-N (2s)-2-formamido-4-methylpentanoic acid Chemical compound CC(C)C[C@@H](C(O)=O)NC=O HFBHOAHFRNLZGN-LURJTMIESA-N 0.000 description 1
- GGAUUQHSCNMCAU-ZXZARUISSA-N (2s,3r)-butane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C[C@H](C(O)=O)[C@H](C(O)=O)CC(O)=O GGAUUQHSCNMCAU-ZXZARUISSA-N 0.000 description 1
- STIUJDCDGZSXGO-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=C1 STIUJDCDGZSXGO-UHFFFAOYSA-N 0.000 description 1
- YKNMIGJJXKBHJE-UHFFFAOYSA-N (3-aminophenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(N)=C1 YKNMIGJJXKBHJE-UHFFFAOYSA-N 0.000 description 1
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- ODIGIKRIUKFKHP-UHFFFAOYSA-N (n-propan-2-yloxycarbonylanilino) acetate Chemical group CC(C)OC(=O)N(OC(C)=O)C1=CC=CC=C1 ODIGIKRIUKFKHP-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
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- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
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- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical class CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- FVFYRXJKYAVFSB-UHFFFAOYSA-N 2,3,5,6-tetrafluorobenzene-1,4-diamine Chemical compound NC1=C(F)C(F)=C(N)C(F)=C1F FVFYRXJKYAVFSB-UHFFFAOYSA-N 0.000 description 1
- BHPCMPVIMAJIQS-UHFFFAOYSA-N 2,3,5,6-tetrakis(trifluoromethyl)benzene-1,4-diamine Chemical compound NC1=C(C(F)(F)F)C(C(F)(F)F)=C(N)C(C(F)(F)F)=C1C(F)(F)F BHPCMPVIMAJIQS-UHFFFAOYSA-N 0.000 description 1
- DJOVAUMVUZNCRR-UHFFFAOYSA-N 2,3,5-trifluorobenzene-1,4-diamine Chemical compound NC1=CC(F)=C(N)C(F)=C1F DJOVAUMVUZNCRR-UHFFFAOYSA-N 0.000 description 1
- YMDMDDUYDDFCSX-UHFFFAOYSA-N 2,3-bis(trifluoromethyl)benzene-1,4-diamine Chemical compound NC1=CC=C(N)C(C(F)(F)F)=C1C(F)(F)F YMDMDDUYDDFCSX-UHFFFAOYSA-N 0.000 description 1
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- DYGPKZRYPCCCLU-UHFFFAOYSA-N 2-(aminomethoxy)ethoxymethanamine Chemical compound NCOCCOCN DYGPKZRYPCCCLU-UHFFFAOYSA-N 0.000 description 1
- LJVGYWLSCKCZQK-UHFFFAOYSA-N 2-[2-(2-aminoethyl)cyclohexyl]ethanamine Chemical compound NCCC1CCCCC1CCN LJVGYWLSCKCZQK-UHFFFAOYSA-N 0.000 description 1
- NIQFAJBKEHPUAM-UHFFFAOYSA-N 2-[2-[2-(2-aminoethoxy)ethoxy]ethoxy]ethanamine Chemical compound NCCOCCOCCOCCN NIQFAJBKEHPUAM-UHFFFAOYSA-N 0.000 description 1
- HKJUXXFTANXMGQ-UHFFFAOYSA-N 2-[2-[2-(aminomethoxy)ethoxy]ethoxy]ethoxymethanamine Chemical compound NCOCCOCCOCCOCN HKJUXXFTANXMGQ-UHFFFAOYSA-N 0.000 description 1
- IFZOPNLVYZYSMQ-UHFFFAOYSA-N 2-[2-[2-[2-(2-aminoethoxy)ethoxy]ethoxy]ethoxy]ethanamine Chemical compound NCCOCCOCCOCCOCCN IFZOPNLVYZYSMQ-UHFFFAOYSA-N 0.000 description 1
- STMZGJLCKJFMLQ-UHFFFAOYSA-N 2-[3-(2-aminoethyl)cyclohexyl]ethanamine Chemical compound NCCC1CCCC(CCN)C1 STMZGJLCKJFMLQ-UHFFFAOYSA-N 0.000 description 1
- XUXZELZSNNYLRE-UHFFFAOYSA-N 2-[4-(2-aminoethyl)cyclohexyl]ethanamine Chemical compound NCCC1CCC(CCN)CC1 XUXZELZSNNYLRE-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- FXFTWEVIIHVHDS-UHFFFAOYSA-N 2-fluorobenzene-1,4-diamine Chemical compound NC1=CC=C(N)C(F)=C1 FXFTWEVIIHVHDS-UHFFFAOYSA-N 0.000 description 1
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Description
樹脂フィルム1は、ポリエステル系樹脂フィルム、セルロース系樹脂フィルム及びイミド系樹脂フィルムからなる群から選ばれる一種である。ポリエステル系樹脂、セルロース系樹脂及びイミド系樹脂は、分子骨格中に、極性基を有することで、適度な含水率(水分率とも称される。)を示す。そのため、透明導電性フィルム10において、これらの分子骨格中に極性基を有する樹脂で形成された樹脂フィルム1に含まれる水分が、インジウム錫複合酸化物層が製膜される際に、インジウム錫複合酸化物層3の表面に移動し、インジウム錫複合酸化物層3の表面に無水トリフルオロ酢酸により化学的に修飾されうる活性水素基が、2.1原子%〜4.0原子%存在することになり、透明導電性フィルムと引き出し電極との密着性が向上すると推測される。
透明導電性フィルムでは、インジウム錫複合酸化物層(透明導電層又は透明導電膜とも称される。)のパターン形成後の非視認性を向上させる観点から、樹脂フィルム等の透明基材とインジウム錫複合酸化物層との間に光学調整機能を有する誘電体層を設ける場合がある。これに対し、本発明において、誘電体層2は、光学調整機能を有し、光学調整機能によりインジウム錫複合酸化物層のパターン形成後の非視認性を向上させるのに加えて、後述のとおり、インジウム錫複合酸化物層3の表面に存在する活性水素基の量を調整する機能を有すると思われる。本明細書において、「活性水素基」とは、特に指摘が無い場合、無水トリフルオロ酢酸により化学的に修飾されうる活性水素基を意味する。
インジウム錫複合酸化物層3は、インジウム−スズ複合酸化物(Indium Tin Oxide)で構成される金属酸化物薄膜である。インジウム錫複合酸化物層3は、透明性と低抵抗とを両立する観点から、酸化インジウムと酸化スズの全体重量を100重量%とした場合、酸化インジウムを88重量%〜98重量%含有し、酸化錫を2重量%〜12重量%含有することが好ましく、酸化インジウムを90重量%〜97重量%含有し、酸化錫を3重量%〜10重量%含有することがより好ましく、酸化インジウムを92重量%〜95重量%含有し、酸化錫を5重量%〜8重量%含有することがさらに好ましい。酸化錫の含有量が上記範囲内であると透過率や色差等の光学特性と抵抗値等の電気特性が両立しやすい。
引出電極11は、金属で形成することできる。具体的には、引出電極の材料としては、銀、銅、アルミニウム、ニッケル、パラジウム、クロム、鉄、モリブデン、チタン又はそれらを主成分とする合金等の金属、銀、銅、アルミニウム、ニッケル、パラジウム、クロム、鉄、モリブデン、チタン又はそれらを主成分とする合金等の金属を主成分とする導電性ペースト材料等が挙げられる。中でも、銀、銅等の導電性が高い金属が好ましく、銀、銅等の導電性が高い金属をエポキシ樹脂やアクリル系樹脂等の硬化性樹脂に分散させた導電性金属ペースト材料は印刷により容易に引出電極を形成できるためより好ましい。この中でも銀を主成分とする導電性銀ペースト材料が引出電極の導電性と、引出電極形成の容易性のバランスから特に好ましい。金属は、引出電極の電気抵抗および電極パターンの微細精度の観点から、平均粒子径が0.1〜10μmであることが好ましく、より好ましくは、0.1〜3.0μmである。本発明において、「金属を主成分とする導電性ペースト材料」とは、金属を固形分濃度として50重量%以上含むことを意味する。また、本発明において、金属粒子の平均粒子径は、透過型電子顕微鏡で得られる断面像における粒子直径を加重平均した値を意味する。
140℃、90分の加熱処理後の透明導電性フィルムのインジウムスズ酸化物層の表面に、平均粒子径2μmの銀粒子を約75重量%、エポキシ系樹脂を約2重量%、アクリル系樹脂を約0.5重量%含有する導電性銀ペーストをスクリーン印刷機により焼成後厚さ7μm、3cm角の面積で塗布した。塗布後10分間静置した後に、140℃で60分間加熱して導電性銀ペーストを焼成し、インジウムスズ酸化物層上に導電性銀ペーストからなる引出電極を形成した。引出電極を形成した透明導電性フィルムを温度60℃相対湿度90%の環境試験機に240時間投入し、取り出し後に引出電極側からナイフを用いて、深さ約30μmの100マスの切れ込みを入れて、密着性評価用サンプルとした。評価サンプルの引出電極が形成されている側の表面に25mm幅の透明粘着テープ(3M社製、#610)を貼り付け、約1分後に透明導電性フィルムに対して90度方向に約1秒間でテープを引き剥がし、透明導電性フィルムの引出電極が配置された側の表面の全体面積に対する引出電極が剥離した剥離面積の割合(%)を算出した。剥離面積の割合が小さいほど密着性が良好である。
密着性評価で引出電極が剥離した部分にテスターをあて、導通の有無を確認した。導通が確認できた部分はインジウムスズ酸化物層と引出電極間が剥離したことを意味する。
140℃で90分加熱処理した直後に、透明導電性フィルムを無水トリフルオロ酢酸の蒸気に60分間暴露して化学修飾処理した。修飾処理前後の透明導電性フィルムにおけるインジウムスズ酸化物層の表面のフッ素原子数をX線光電子分光法(XPS)で定量し、修飾処理後に増加したフッ素原子数を3で除した値を無水トリフルオロ酢酸により化学的に修飾されうる活性水素基の量とした。
光学式濁度計(日本電飾工業社製、NDH7000)を用いて測定した。光源はD光源とし、インジウムスズ酸化物層側から光を入射させて全光線透過率を測定した。
色差計(日本電飾工業社製、SE2000)を用いて測定した。光源はD光源とし、インジウムスズ酸化物層側から光を入射させてb*値を測定した。b*値が2.5以下であればパターンの非視認性は良好である。
140℃で90分加熱処理した後の透明導電性フィルムを60mm×60mmに切り出し、三菱化学社製ロレスタGPを用いて四探針法にてのインジウムスズ酸化物層の表面抵抗を測定した。
140℃で90分加熱処理した後の透明導電性フィルムを60mm×60mmにカットし、得られたサンプルの両面について、表面形状測定機(キヤノン社製、Zygo NewView7300)を用いて0.1mm×0.1mmの測定範囲における算術平均粗さRaを算出し、表面粗さRaとした。測定は温度23℃、相対湿度50%の恒温室にて行った。カットオフ値は0.5mmとした。
樹脂フィルムとして、厚さ50μmのポリエチレンテレフタレートフィルムを用いた。該ポリエチレンテレフタレートフィルムは、一方の表面に厚さ1.0μmのハードコート層を有する。ハードコート層は、多官能ウレタンアクリレート、シリカ粒子(平均粒子径200nm以下)及び光重合開始剤を含む樹脂組成物を紫外線で硬化させて形成したものである。該ポリエチレンテレフタレートフィルムの他方の表面に厚さ0.030μmの誘電体層を形成した。誘電体層は、多官能ウレタンアクリレート、シリカ粒子及び光重合開始剤を含む樹脂組成物を紫外線で硬化させて形成しており、屈折率が1.5であった。このポリエチレンテレフタレートフィルムと誘電体層の積層体を、巻取式DCマグネトロンスパッタ製膜装置内に導入し、90℃で30秒加熱した後に、スパッタリング法により誘電体層の表面に厚さ23nmのインジウム錫複合酸化物層を形成した。
誘電体層をアルコキシシラン加水分解物及び有機シリカゾルを縮合させたアルコキシシラン加水分解縮合物(シロキサン系ポリマー)で形成し、且つ厚さが0.025μm、屈折率が1.5になるように以外は、実施例1と同様の手法で透明導電性フィルムを得た。
ポリエチレンテレフタレートフィルムの誘電体層が形成される側の表面をコロナ処理した後に誘電体層を形成した以外は、実施例2と同様の手法で透明導電性フィルムを得た。
誘電体層の厚みが1.600μm、屈折率が1.6になるようにした以外は、実施例1と同様の手法で透明導電性フィルムを得た。
誘電体層の厚みが1.600μm、屈折率が1.6になるようにした以外は、実施例1と同様にして、ポリエチレンテレフタレートフィルムと誘電体層の積層体を得た。このポリエチレンテレフタレートフィルムと誘電体層の積層体を、巻取式RFマグネトロンスパッタ製膜装置内に導入し90℃で75秒加熱した後に、スパッタリング法により誘電体層の表面に厚さ20nmのインジウム錫複合酸化物層を形成した。
2 誘電体層
3 インジウム錫複合酸化物層
10、20 透明導電性フィルム
11 引出電極
Claims (7)
- 樹脂フィルムの一方の表面上に、誘電体層及びインジウム錫複合酸化物層がこの順番に配置された透明導電性フィルムにおいて、
前記樹脂フィルムは、ポリエステル系樹脂フィルム、セルロース系樹脂フィルム及びイミド系樹脂フィルムからなる群から選ばれる一種であり、
前記誘電体層は、有機物又は有機物と無機物の混合物で構成され、且つ厚さが0.005μm以上0.100μm以下であり、
インジウム錫複合酸化物層の誘電体層が配置されている側の反対側の表面には、無水トリフルオロ酢酸により化学的に修飾されうる活性水素基が、2.1原子%以上4.0原子%以下存在することを特徴とする透明導電性フィルム。 - 前記インジウム錫複合酸化物層の誘電体層が配置されている側と反対側の表面の周縁部に引出電極が配置されている請求項1に記載の透明導電性フィルム。
- 前記引出電極は、銀を主成分とする導電性ペーストで構成されている請求項2に記載の透明導電フィルム。
- 前記樹脂フィルムにおいて、前記誘電体層が配置される側の表面がコロナ処理されている請求項1〜3のいずれか1項に記載の透明導電性フィルム。
- ポリエステル系樹脂フィルム、セルロース系樹脂フィルム及びイミド系樹脂フィルムからなる群から選ばれる一種の樹脂フィルムの一方の表面上に有機物又は有機物と無機物の混合物で構成され、かつ厚さが0.005μm以上0.100μm以下の誘電体層を積層し、
前記誘電体層の樹脂フィルムが配置された側の反対側の表面上にインジウム錫複合酸化物層を積層して、
樹脂フィルム、誘電体層及びインジウム錫複合酸化物層を含み、インジウム錫複合酸化物層の誘電体層が配置されている側の反対側の表面には、無水トリフルオロ酢酸により化学的に修飾されうる活性水素基が、2.1原子%以上4.0原子%以下存在する透明導電性フィルムを得ることを特徴とする透明導電性フィルムの製造方法。 - 前記樹脂フィルムは、前記誘電体層が配置される側の表面がコロナ処理されている請求項5に記載の透明導電性フィルムの製造方法。
- 前記インジウム錫複合酸化物層をスパッタリング法で形成する請求項5又は6に記載の透明導電性フィルムの製造方法。
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