JP6716158B2 - チップの選別方法 - Google Patents
チップの選別方法 Download PDFInfo
- Publication number
- JP6716158B2 JP6716158B2 JP2016094301A JP2016094301A JP6716158B2 JP 6716158 B2 JP6716158 B2 JP 6716158B2 JP 2016094301 A JP2016094301 A JP 2016094301A JP 2016094301 A JP2016094301 A JP 2016094301A JP 6716158 B2 JP6716158 B2 JP 6716158B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- ultrasonic vibration
- chips
- ultrasonic
- damage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 7
- 230000002950 deficient Effects 0.000 claims description 15
- 238000012790 confirmation Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 4
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 23
- 230000005540 biological transmission Effects 0.000 description 7
- 238000010897 surface acoustic wave method Methods 0.000 description 6
- 238000010187 selection method Methods 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/043—Analysing solids in the interior, e.g. by shear waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/045—Analysing solids by imparting shocks to the workpiece and detecting the vibrations or the acoustic waves caused by the shocks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/12—Analysing solids by measuring frequency or resonance of acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/223—Supports, positioning or alignment in fixed situation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
- G01N29/4445—Classification of defects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/014—Resonance or resonant frequency
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/025—Change of phase or condition
- G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/0289—Internal structure, e.g. defects, grain size, texture
Landscapes
- Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Dicing (AREA)
Description
10,44 超音波振動子
11 LTチップ
12,46,48 超音波伝達部材
14 電力供給手段
15 エキスパンド装置
30 支持部材
35 超音波振動装置
42 ホーン
50 撮像ユニット
52 ピックアップコレット
Claims (2)
- 板状被加工物を分割して形成された複数のチップの良品と不良品とを選別するチップの選別方法であって、
該複数のチップに超音波振動を同時に付与する超音波振動付与ステップと、
該超音波振動付与ステップでチップが破損するか否かを確認する破損確認ステップと、
該破損確認ステップで破損していないチップを良品として選別する選別ステップと、を備え、
該超音波振動付与ステップでチップに付与される超音波振動は、微小破損を内包しないチップは破損しないが微小破損を内包するチップは破損する周波数及び振幅に設定されることを特徴とするチップの選別方法。 - 前記超音波振動付与ステップでチップに付与される超音波振動は、微小破損を内包しないチップは破損しない温度にチップを加熱する周波数及び振幅に設定される請求項1記載のチップの選別方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016094301A JP6716158B2 (ja) | 2016-05-10 | 2016-05-10 | チップの選別方法 |
US15/585,937 US10175204B2 (en) | 2016-05-10 | 2017-05-03 | Method of sorting chips |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016094301A JP6716158B2 (ja) | 2016-05-10 | 2016-05-10 | チップの選別方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017203654A JP2017203654A (ja) | 2017-11-16 |
JP6716158B2 true JP6716158B2 (ja) | 2020-07-01 |
Family
ID=60294621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016094301A Active JP6716158B2 (ja) | 2016-05-10 | 2016-05-10 | チップの選別方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10175204B2 (ja) |
JP (1) | JP6716158B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020009827A (ja) * | 2018-07-04 | 2020-01-16 | 株式会社ディスコ | デバイスチップの検査方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2666772B2 (ja) * | 1995-05-26 | 1997-10-22 | 日本電気株式会社 | 超音波加熱を用いた半導体集積回路配線系の検査法および装置 |
US7060971B2 (en) * | 2002-09-13 | 2006-06-13 | Siemens Westinghouser Power Corporation | Reference standard systems for thermosonic flaw detection |
US6957581B2 (en) * | 2003-10-29 | 2005-10-25 | Infineon Technologies Richmond, Lp | Acoustic detection of mechanically induced circuit damage |
JP4830772B2 (ja) * | 2006-10-11 | 2011-12-07 | ヤマハ株式会社 | 半導体チップの検査方法 |
US7973547B2 (en) * | 2008-08-13 | 2011-07-05 | Infineon Technologies Ag | Method and apparatus for detecting a crack in a semiconductor wafer, and a wafer chuck |
EP2444999A4 (en) * | 2009-06-18 | 2012-11-14 | Rohm Co Ltd | SEMICONDUCTOR DEVICE |
US20120153444A1 (en) * | 2009-06-18 | 2012-06-21 | Rohm Co., Ltd | Semiconductor device |
JP2012099543A (ja) * | 2010-10-29 | 2012-05-24 | Sanyo Electric Co Ltd | 半導体ウェハのクラック検査方法及び半導体素子の製造方法 |
JP2012182356A (ja) * | 2011-03-02 | 2012-09-20 | Renesas Electronics Corp | 半導体装置の製造方法 |
JP5827845B2 (ja) | 2011-09-16 | 2015-12-02 | スカイワークス・パナソニック フィルターソリューションズ ジャパン株式会社 | 弾性表面波装置およびその製造方法 |
JP2014072396A (ja) * | 2012-09-28 | 2014-04-21 | Sharp Corp | 検出装置、異常検出方法及び光電池セルの製造方法 |
US20140208850A1 (en) * | 2013-01-29 | 2014-07-31 | Geun-Woo Kim | Apparatus and method of detecting a defect of a semiconductor device |
-
2016
- 2016-05-10 JP JP2016094301A patent/JP6716158B2/ja active Active
-
2017
- 2017-05-03 US US15/585,937 patent/US10175204B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017203654A (ja) | 2017-11-16 |
US10175204B2 (en) | 2019-01-08 |
US20170328867A1 (en) | 2017-11-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6742448B2 (ja) | 超音波接合装置、超音波接合検査方法および超音波接合部の製造方法 | |
JP7137992B2 (ja) | 加工装置及び剥離装置 | |
US9751257B2 (en) | Ultrasonic welder clamp | |
US10121672B2 (en) | Cutting method for cutting processing-target object and cutting apparatus that cuts processing-target object | |
JP2003264203A (ja) | 半導体装置の製造方法 | |
JP2004363612A (ja) | 超音波変換器組立体 | |
JP6972299B2 (ja) | 改良型ガイド波サーモグラフィ検査システムおよびそれを使用する方法 | |
US10024825B2 (en) | Wafer clamp detection based on vibration or acoustic characteristic analysis | |
TWI591745B (zh) | 用於在接合前檢測半導體晶片的方法及裝置 | |
JP6716158B2 (ja) | チップの選別方法 | |
JP2012083246A (ja) | 接合検査方法 | |
JP2005271028A (ja) | 超音波溶着装置 | |
JP6673634B2 (ja) | 超音波接合方法 | |
JP6814674B2 (ja) | シート拡張装置 | |
JP2019102547A (ja) | 板状物の分割方法及び分割装置 | |
JP6066120B2 (ja) | 二枚のウェーハを接合するための方法及びデバイス | |
JP4849246B2 (ja) | 超音波接合の接合品質判別方法 | |
JP7408475B2 (ja) | 剥離装置 | |
JP2014024065A (ja) | 異常検出装置および異常検出方法 | |
WO2020067191A1 (ja) | 超音波接合方法 | |
JP2017034037A (ja) | 溶融装置及び溶融方法 | |
WO2022264386A1 (ja) | 超音波複合振動装置および半導体装置の製造装置 | |
JP3356072B2 (ja) | ギャングボンディング装置及びギャングボンディング方法 | |
JP2009090296A (ja) | 超音波振動接合装置 | |
JP2023006251A (ja) | ボンディング装置、制御方法、および、制御システム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190320 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200206 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200218 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200327 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200609 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200609 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6716158 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |