JP6712482B2 - 基板処理方法および基板処理装置 - Google Patents
基板処理方法および基板処理装置 Download PDFInfo
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- JP6712482B2 JP6712482B2 JP2016070403A JP2016070403A JP6712482B2 JP 6712482 B2 JP6712482 B2 JP 6712482B2 JP 2016070403 A JP2016070403 A JP 2016070403A JP 2016070403 A JP2016070403 A JP 2016070403A JP 6712482 B2 JP6712482 B2 JP 6712482B2
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- 238000012545 processing Methods 0.000 title claims description 55
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- 238000004140 cleaning Methods 0.000 claims description 56
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- 230000007246 mechanism Effects 0.000 claims description 35
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 56
- 239000003960 organic solvent Substances 0.000 description 41
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- 238000004132 cross linking Methods 0.000 description 1
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- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016070403A JP6712482B2 (ja) | 2016-03-31 | 2016-03-31 | 基板処理方法および基板処理装置 |
KR1020187024342A KR102110065B1 (ko) | 2016-03-31 | 2017-01-24 | 기판 처리 방법 및 기판 처리 장치 |
PCT/JP2017/002403 WO2017169019A1 (ja) | 2016-03-31 | 2017-01-24 | 基板処理方法および基板処理装置 |
CN201780013898.8A CN108701605B (zh) | 2016-03-31 | 2017-01-24 | 基板处理方法及基板处理装置 |
TW106104898A TWI637434B (zh) | 2016-03-31 | 2017-02-15 | 基板處理方法及基板處理裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016070403A JP6712482B2 (ja) | 2016-03-31 | 2016-03-31 | 基板処理方法および基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017183576A JP2017183576A (ja) | 2017-10-05 |
JP6712482B2 true JP6712482B2 (ja) | 2020-06-24 |
Family
ID=59964058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016070403A Active JP6712482B2 (ja) | 2016-03-31 | 2016-03-31 | 基板処理方法および基板処理装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6712482B2 (ko) |
KR (1) | KR102110065B1 (ko) |
CN (1) | CN108701605B (ko) |
TW (1) | TWI637434B (ko) |
WO (1) | WO2017169019A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6642597B2 (ja) * | 2018-02-02 | 2020-02-05 | 信越半導体株式会社 | ウェーハ洗浄処理装置及びウェーハ洗浄方法 |
JP7015219B2 (ja) * | 2018-06-29 | 2022-02-02 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
KR102597005B1 (ko) * | 2020-12-29 | 2023-11-02 | 세메스 주식회사 | 기판 처리 방법 |
US11925963B2 (en) | 2022-05-27 | 2024-03-12 | Semes Co., Ltd. | Method for treating a substrate |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000223457A (ja) * | 1999-02-02 | 2000-08-11 | Sony Corp | 半導体装置の洗浄方法及び洗浄装置、及び半導体装置の製造方法 |
JP2006059918A (ja) * | 2004-08-18 | 2006-03-02 | Tokyo Electron Ltd | 現像処理方法 |
JP2007235032A (ja) * | 2006-03-03 | 2007-09-13 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP5312856B2 (ja) * | 2008-06-27 | 2013-10-09 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP5667545B2 (ja) * | 2011-10-24 | 2015-02-12 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP5586734B2 (ja) * | 2012-08-07 | 2014-09-10 | 東京エレクトロン株式会社 | 基板洗浄装置、基板洗浄システム、基板洗浄方法および記憶媒体 |
JP6017999B2 (ja) * | 2013-03-15 | 2016-11-02 | 株式会社Screenホールディングス | 基板処理装置 |
JP6216188B2 (ja) * | 2013-09-04 | 2017-10-18 | 株式会社Screenホールディングス | 基板乾燥装置および基板乾燥方法 |
JP6268469B2 (ja) * | 2013-12-18 | 2018-01-31 | 株式会社Screenホールディングス | 基板処理装置、基板処理装置の制御方法、および記録媒体 |
JP6304592B2 (ja) * | 2014-03-25 | 2018-04-04 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
-
2016
- 2016-03-31 JP JP2016070403A patent/JP6712482B2/ja active Active
-
2017
- 2017-01-24 CN CN201780013898.8A patent/CN108701605B/zh active Active
- 2017-01-24 WO PCT/JP2017/002403 patent/WO2017169019A1/ja active Application Filing
- 2017-01-24 KR KR1020187024342A patent/KR102110065B1/ko active IP Right Grant
- 2017-02-15 TW TW106104898A patent/TWI637434B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201802912A (zh) | 2018-01-16 |
TWI637434B (zh) | 2018-10-01 |
JP2017183576A (ja) | 2017-10-05 |
WO2017169019A1 (ja) | 2017-10-05 |
CN108701605B (zh) | 2023-03-24 |
KR102110065B1 (ko) | 2020-05-12 |
CN108701605A (zh) | 2018-10-23 |
KR20180107172A (ko) | 2018-10-01 |
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