JP6708093B2 - 抵抗ペースト及びその焼成により作製される抵抗体 - Google Patents

抵抗ペースト及びその焼成により作製される抵抗体 Download PDF

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Publication number
JP6708093B2
JP6708093B2 JP2016205989A JP2016205989A JP6708093B2 JP 6708093 B2 JP6708093 B2 JP 6708093B2 JP 2016205989 A JP2016205989 A JP 2016205989A JP 2016205989 A JP2016205989 A JP 2016205989A JP 6708093 B2 JP6708093 B2 JP 6708093B2
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JP
Japan
Prior art keywords
resistor
paste
lead
resistance
firing
Prior art date
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Active
Application number
JP2016205989A
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English (en)
Japanese (ja)
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JP2018067478A (ja
Inventor
富士雄 幕田
富士雄 幕田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP2016205989A priority Critical patent/JP6708093B2/ja
Priority to KR1020197011628A priority patent/KR102384488B1/ko
Priority to PCT/JP2017/037905 priority patent/WO2018074562A1/ja
Priority to CN201780064365.2A priority patent/CN109844871B/zh
Priority to TW106136193A priority patent/TWI746670B/zh
Publication of JP2018067478A publication Critical patent/JP2018067478A/ja
Application granted granted Critical
Publication of JP6708093B2 publication Critical patent/JP6708093B2/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
    • H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • Conductive Materials (AREA)
  • Non-Adjustable Resistors (AREA)
  • Glass Compositions (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP2016205989A 2016-10-20 2016-10-20 抵抗ペースト及びその焼成により作製される抵抗体 Active JP6708093B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016205989A JP6708093B2 (ja) 2016-10-20 2016-10-20 抵抗ペースト及びその焼成により作製される抵抗体
KR1020197011628A KR102384488B1 (ko) 2016-10-20 2017-10-19 저항 페이스트 및 그의 소성에 의해 제작되는 저항체
PCT/JP2017/037905 WO2018074562A1 (ja) 2016-10-20 2017-10-19 抵抗ペースト及びその焼成により作製される抵抗体
CN201780064365.2A CN109844871B (zh) 2016-10-20 2017-10-19 电阻膏、电阻体、电子零件以及无铅的电阻体的制造方法
TW106136193A TWI746670B (zh) 2016-10-20 2017-10-20 電阻膏以及由該電阻膏的煅燒而製作的電阻體

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016205989A JP6708093B2 (ja) 2016-10-20 2016-10-20 抵抗ペースト及びその焼成により作製される抵抗体

Publications (2)

Publication Number Publication Date
JP2018067478A JP2018067478A (ja) 2018-04-26
JP6708093B2 true JP6708093B2 (ja) 2020-06-10

Family

ID=62018738

Family Applications (1)

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JP2016205989A Active JP6708093B2 (ja) 2016-10-20 2016-10-20 抵抗ペースト及びその焼成により作製される抵抗体

Country Status (5)

Country Link
JP (1) JP6708093B2 (zh)
KR (1) KR102384488B1 (zh)
CN (1) CN109844871B (zh)
TW (1) TWI746670B (zh)
WO (1) WO2018074562A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7251068B2 (ja) * 2018-07-31 2023-04-04 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、及び厚膜抵抗体
JP7183507B2 (ja) * 2019-02-13 2022-12-06 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、及び厚膜抵抗体
JP2020198404A (ja) * 2019-06-05 2020-12-10 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、および厚膜抵抗体
JP7347056B2 (ja) * 2019-09-18 2023-09-20 住友金属鉱山株式会社 厚膜抵抗体用組成物およびその製造方法、並びに、厚膜抵抗体用ペーストおよびその製造方法
JP7347057B2 (ja) * 2019-09-18 2023-09-20 住友金属鉱山株式会社 厚膜抵抗体用組成物および厚膜抵抗体用ペースト
CN112010558B (zh) * 2020-09-03 2022-09-27 山东华菱电子股份有限公司 无铅硅酸盐玻璃釉原料组成物、无铅硅酸盐玻璃釉及其应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6335081A (ja) 1986-07-30 1988-02-15 Rhythm Watch Co Ltd ビデオカメラの光量補正装置
JP2001176703A (ja) * 1999-10-04 2001-06-29 Toshiba Corp 電圧非直線抵抗体及びその製造方法
TW466507B (en) * 1999-10-04 2001-12-01 Toshiba Corp Voltage nonlinear resistor and its manufacture
KR101238509B1 (ko) * 2004-04-30 2013-03-04 가부시끼가이샤 구레하 밀봉용 수지 조성물 및 수지 밀봉된 반도체 장치
US8257619B2 (en) * 2008-04-18 2012-09-04 E I Du Pont De Nemours And Company Lead-free resistive composition
US8628695B2 (en) * 2008-04-18 2014-01-14 E I Du Pont De Nemours And Company Surface-modified ruthenium oxide conductive material, lead-free glass(es), thick film resistor paste(s), and devices made therefrom
JP6084397B2 (ja) * 2012-08-17 2017-02-22 太陽ホールディングス株式会社 焼結用無機粒子含有ペーストおよび塗布形成物

Also Published As

Publication number Publication date
TW201823380A (zh) 2018-07-01
WO2018074562A1 (ja) 2018-04-26
KR20190072540A (ko) 2019-06-25
CN109844871B (zh) 2021-06-01
TWI746670B (zh) 2021-11-21
CN109844871A (zh) 2019-06-04
KR102384488B1 (ko) 2022-04-08
JP2018067478A (ja) 2018-04-26

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